公开(公告)号：US07139060B2

公开(公告)日：2006-11-21

申请号：US10766536

申请日：2004-01-27

申请人： Ping-Chin Cheng ,  Hui-Chang Chen

发明人： Ping-Chin Cheng ,  Hui-Chang Chen

IPC分类号： G02F1/1345

CPC分类号： G02F1/13452 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A method for bonding integrated circuit chips and other devices to a liquid crystal display panel. The method involves using a single anisotropic conductive film that is sized to bond at least one integrated circuit chip and at least one other device, such as a flexible printed circuit board, a tape carrier package and a chip-on-film, to the liquid crystal display panel.

摘要翻译： 一种用于将集成电路芯片和其它器件接合到液晶显示面板的方法。 该方法包括使用单个各向异性导电膜，其大小适于将至少一个集成电路芯片和至少一个其它器件（例如柔性印刷电路板，载带封装和片上芯片）结合到液体 水晶显示面板。

公开(公告)号：US20060017448A1

公开(公告)日：2006-01-26

申请号：US11049158

申请日：2005-02-02

申请人： Hui-Chang Chen ,  Chun-Yu Lee

发明人： Hui-Chang Chen ,  Chun-Yu Lee

IPC分类号： B23K31/12 ,  G01R31/04

CPC分类号： G01R1/07378

摘要： A bonding configuration structure for facilitating electrical testing in a bonding process and a testing method are provided. The bonding configuration includes a bonded component, a bonding component, a bond portion and a leading component. The bonding component is disposed on the bonded component. The bonding component has a first end and a second end. The first end is coupled to the bond portion. The second end is disposed on the bonded component to form the first testing portion.

公开(公告)号：US20050167853A1

公开(公告)日：2005-08-04

申请号：US10921799

申请日：2004-08-20

申请人： Chun-Yu Lee ,  Hui-Chang Chen

发明人： Chun-Yu Lee ,  Hui-Chang Chen

IPC分类号： G02F1/13 ,  H01L21/60 ,  H01L23/495

CPC分类号： H01L24/83 ,  G02F1/13452 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/15151 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199

摘要： A carrier is provided. The carrier is bonded with a substrate having a number of contact pads through an anisotropic conductive film by thermocompression. The carrier includes a base and a number of leads, wherein the base has a base's surface on which a number of indented patterns are disposed. The leads are disposed on the base's surface with their one end, which are electrically connected to the contact pads through the anisotropic conductive film, being alternately arranged with the indented patterns; meanwhile, part of the anisotropic conductive film spread into the indented patterns when the carrier is bonded to the substrate by thermocompression.

摘要翻译： 提供载体。 载体通过热压法通过各向异性导电膜与具有多个接触焊盘的基板结合。 载体包括基部和多个引线，其中基部具有基部的表面，多个凹入图案设置在基部的表面上。 引线设置在基座的表面上，它们的一端通过各向异性导电膜电连接到接触焊盘，与凹槽图案交替布置; 同时，当载体通过热压接合到基底上时，各向异性导电膜的一部分扩展成凹入图案。

公开(公告)号：US08368192B1

公开(公告)日：2013-02-05

申请号：US13234502

申请日：2011-09-16

申请人： Hui-Chang Chen

发明人： Hui-Chang Chen

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2924/00014

摘要： Disclosed is a multi-chip memory package with a small substrate by using a die pad having an opening to substitute the chip-carrying function of a conventional substrate so that substrate dimension can be reduced. A substrate is attached under the die pad. A first chip is disposed on the substrate located inside the opening. A second chip is disposed on the die pad. An encapsulant encapsulates the top surface of the die pad, the top surface of the substrate, the first chip, and the second chip. The dimension of the substrate is smaller than the dimension of the encapsulant. In a preferred embodiment, a plurality of tie bars physically connect to the peripheries of the die pad and extend to the sidewalls of the encapsulant to have a plurality of insulated cut ends exposed from the encapsulant.

摘要翻译： 公开了一种具有小基板的多芯片存储器封装，其通过使用具有开口的管芯焊盘来代替常规基板的芯片承载功能，从而可以减小基板尺寸。 衬底附接在管芯焊盘下方。 第一芯片设置在位于开口内部的基板上。 第二芯片设置在芯片焊盘上。 密封剂封装管芯焊盘的顶表面，衬底的顶表面，第一芯片和第二芯片。 衬底的尺寸小于密封剂的尺寸。 在优选实施例中，多个连接杆物理地连接到管芯焊盘的周边并且延伸到密封剂的侧壁以具有从密封剂暴露出的多个绝缘切割端。

公开(公告)号：US07576807B2

公开(公告)日：2009-08-18

申请号：US11427416

申请日：2006-06-29

申请人： Hui-Chang Chen ,  Tsung-Yu Lin ,  Chin-Yu Huang

发明人： Hui-Chang Chen ,  Tsung-Yu Lin ,  Chin-Yu Huang

IPC分类号： G02F1/1333

CPC分类号： G02F1/1309 ,  G09G3/006 ,  G09G2330/12

摘要： A display panel comprising a substrate, a display array formed on the substrate, and a test circuit disposed on the substrate and comprising shorting bars, testing lines, a first and a second isolation layers, and a conductive structure. The shorting bars include a first short bar. The testing lines include a first testing line vertical with the first shorting bar and electrically connecting the display array. The first isolation layer is formed between the shorting bars and the testing lines. The second isolation layer is disposed on the shorting bars, the testing lines, and the first isolation layer and has a first and a second holes, which correspond to the first shorting bar. The second hole penetrates through the first isolation layer. The conductive structure is formed on the second isolation layer and electrically connects the first testing line and the first shorting bar through the first and second holes.

摘要翻译： 一种显示面板，包括基板，形成在基板上的显示阵列，以及设置在基板上并包括短路棒，测试线，第一和第二隔离层以及导电结构的测试电路。 短路棒包括第一个短条。 测试线包括垂直于第一短路杆的第一测试线并电连接显示器阵列。 第一隔离层形成在短路棒和测试线之间。 第二隔离层设置在短路棒，测试线和第一隔离层上，并具有与第一短路棒对应的第一和第二孔。 第二孔穿过第一隔离层。 导电结构形成在第二隔离层上，并通过第一和第二孔电连接第一测试线和第一短路棒。

公开(公告)号：US07538278B2

公开(公告)日：2009-05-26

申请号：US10858906

申请日：2004-06-02

申请人： Hui-Chang Chen

发明人： Hui-Chang Chen

IPC分类号： H05K1/00

CPC分类号： H05K1/0271 ,  H05K1/147 ,  H05K3/361 ,  H05K2201/09063 ,  H05K2201/10136

摘要： A printed circuit board (PCB) for a display preventing increase of thermal expansion. The PCB comprises a plurality of bonding regions and at least one opening. The bonding regions are disposed on the inner side of the PCB. The opening is disposed between two adjacent bonding regions.

摘要翻译： 一种用于显示器的印刷电路板（PCB），防止热膨胀的增加。 PCB包括多个接合区域和至少一个开口。 接合区域设置在PCB的内侧。 开口设置在两个相邻的接合区域之间。

公开(公告)号：US20070273820A1

公开(公告)日：2007-11-29

申请号：US11882195

申请日：2007-07-31

申请人： Hui-Chang Chen

发明人： Hui-Chang Chen

IPC分类号： G02F1/1345

CPC分类号： G02F1/13452 ,  H05K1/117 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09781

摘要： A display module includes a glass substrate, a first lead group, a second lead group, and a plurality of first dummy leads. The first lead group and the second lead group are disposed on a marginal area of the glass substrate. There is a flexible printed circuit (FPC) disposed on the first lead group and the second lead group after a first anisotropic conductive film (ACF) is applied thereon. The first dummy leads are disposed between the first lead group and the second lead group and also on the marginal area of the glass substrate. The first lead group and the second lead group are covered with the first ACF, and the first dummy leads are also covered by the first ACF to improve the performance of adhesion of the first ACF to the glass substrate.

摘要翻译： 显示模块包括玻璃基板，第一引线组，第二引线组和多个第一虚拟引线。 第一引线组和第二引线组设置在玻璃基板的边缘区域上。 在其上施加第一各向异性导电膜（ACF）之后，设置在第一引线组和第二引线组上的柔性印刷电路（FPC）。 第一虚拟引线设置在第一引线组和第二引线组之间以及玻璃基板的边缘区域上。 第一引线组和第二引线组被第一ACF覆盖，并且第一虚拟引线也被第一ACF覆盖，以提高第一ACF对玻璃基板的粘附性能。

公开(公告)号：US20070177066A1

公开(公告)日：2007-08-02

申请号：US11427416

申请日：2006-06-29

申请人： Hui-Chang Chen ,  Tsung-Yu Lin ,  Chin-Yu Huang

发明人： Hui-Chang Chen ,  Tsung-Yu Lin ,  Chin-Yu Huang

IPC分类号： G02F1/1333

CPC分类号： G02F1/1309 ,  G09G3/006 ,  G09G2330/12

摘要： A display panel comprising a substrate, a display array formed on the substrate, and a test circuit disposed on the substrate and comprising shorting bars, testing lines, a first and a second isolation layers, and a conductive structure. The shorting bars include a first short bar. The testing lines include a first testing line vertical with the first shorting bar and electrically connecting the display array. The first isolation layer is formed between the shorting bars and the testing lines. The second isolation layer is disposed on the shorting bars, the testing lines, and the first isolation layer and has a first and a second holes, which correspond to the first shorting bar. The second hole penetrates through the first isolation layer. The conductive structure is formed on the second isolation layer and electrically connects the first testing line and the first shorting bar through the first and second holes.

摘要翻译： 一种显示面板，包括基板，形成在基板上的显示阵列，以及设置在基板上并包括短路棒，测试线，第一和第二隔离层以及导电结构的测试电路。 短路棒包括第一个短条。 测试线包括垂直于第一短路杆的第一测试线并电连接显示器阵列。 第一隔离层形成在短路棒和测试线之间。 第二隔离层设置在短路棒，测试线和第一隔离层上，并具有与第一短路棒对应的第一和第二孔。 第二孔穿过第一隔离层。 导电结构形成在第二隔离层上，并通过第一和第二孔电连接第一测试线和第一短路棒。

公开(公告)号：US20070155156A1

公开(公告)日：2007-07-05

申请号：US11688954

申请日：2007-03-21

申请人： Chun-Yu Lee ,  Shy-Ping Chou ,  Hui-Chang Chen

发明人： Chun-Yu Lee ,  Shy-Ping Chou ,  Hui-Chang Chen

IPC分类号： H01L21/44

CPC分类号： G02F1/13452 ,  H05K1/113 ,  H05K3/225 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09436 ,  H05K2201/09509

摘要： A bonding pad structure of a display device. A first conductive layer is formed overlying a substrate, a protection layer is formed overlying the substrate and the first conductive layer, and a second conductive layer is formed overlying the protection layer. An opening structure penetrates the second conductive layer and the protection layer to expose the first conductive layer. A third conductive layer is formed overlying the second conductive layer to contact the sidewall and bottom of the opening structure. Thus, the third conductive layer is electrically connected to the second conductive layer to provide a first electrical-connection path, and the third conductive layer is electrically connected to the first conductive layer to provide a second electrical-connection path.

摘要翻译： 一种显示装置的焊盘结构。 第一导电层形成在衬底上，覆盖衬底和第一导电层形成保护层，并且形成覆盖保护层的第二导电层。 开口结构穿透第二导电层和保护层以暴露第一导电层。 形成第三导电层，覆盖第二导电层以接触开口结构的侧壁和底部。 因此，第三导电层电连接到第二导电层以提供第一电连接路径，并且第三导电层电连接到第一导电层以提供第二电连接路径。

公开(公告)号：US20070103632A1

公开(公告)日：2007-05-10

申请号：US11361629

申请日：2006-02-24

申请人： Hui-Chang Chen ,  Wen-Hung Lai ,  Chien-Liang Chen

发明人： Hui-Chang Chen ,  Wen-Hung Lai ,  Chien-Liang Chen

IPC分类号： G02F1/1345

CPC分类号： G02F1/13452 ,  H05K1/028 ,  H05K1/118 ,  H05K3/28 ,  H05K3/361 ,  H05K2201/0187 ,  H05K2203/058

摘要： A liquid crystal display panel module and a flexible printed circuit board thereof. The liquid crystal display panel module includes a substrate and the flexible printed circuit board connected with the substrate. The flexible printed circuit board includes a base, a lead, a passivation layer and an insulation layer. The lead is disposed on the base, and has a first end portion and a second end portion. The passivation layer covers the lead without covering the first end portion. The insulation layer is disposed at an interface between the passivation layer and the first end portion to cover part of the passivation layer and part of the first end portion.

摘要翻译： 一种液晶显示面板模块及其柔性印刷电路板。 液晶显示面板模块包括基板和与基板连接的柔性印刷电路板。 柔性印刷电路板包括基底，引线，钝化层和绝缘层。 引线设置在基座上，具有第一端部和第二端部。 钝化层覆盖引线而不覆盖第一端部。 绝缘层设置在钝化层和第一端部之间的界面处，以覆盖钝化层的一部分和第一端部的一部分。