公开(公告)号：US20210036685A1

公开(公告)日：2021-02-04

申请号：US16526672

申请日：2019-07-30

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Feras Eid ,  Georgios Dogiamis ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC: H03H9/205 ,  H03F3/24 ,  H03H9/25 ,  H01L41/053 ,  H03H9/64 ,  H03H9/54 ,  H01L25/10 ,  H01L23/10 ,  H01L23/552

Abstract: Embodiments may relate to a radio frequency (RF) front-end module (FEM) that includes a first acoustic wave resonator (AWR) die coupled with a package substrate. The RF FEM may also include a second AWR die coupled with the first AWR die. The first AWR die may be between the package substrate and the second AWR die. Other embodiments may be described or claimed.

公开(公告)号：US20210036682A1

公开(公告)日：2021-02-04

申请号：US16526633

申请日：2019-07-30

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Aleksandar Aleksov ,  Feras Eid ,  Georgios Dogiamis ,  Johanna M. Swan

IPC: H03H9/05 ,  H01L23/538 ,  H01L25/18 ,  H01L27/20 ,  H01L25/00 ,  H01L41/053 ,  H01L23/00 ,  H03H9/58 ,  H01L41/047

Abstract: Embodiments may relate to a radio frequency (RF) front-end module (FEM) that includes an acoustic wave resonator (AWR) die. The RF FEM may further include an active die coupled with the package substrate of the RF FEM. When the active die is coupled with the package substrate, the AWR die may be between the active die and the package substrate. Other embodiments may be described or claimed.

公开(公告)号：US20200315052A1

公开(公告)日：2020-10-01

申请号：US16402055

申请日：2019-05-02

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Johanna M. Swan ,  Georgios Dogiamis ,  Henning Braunisch ,  Adel A. Elsherbini ,  Aleksandar Aleksov ,  Richard Dischler

IPC: H05K7/14 ,  H01P3/16 ,  H05K1/02 ,  H01P5/12

Abstract: Embodiments may relate an electronic device that includes a first platform and a second platform coupled with a chassis. The platforms may include respective microelectronic packages. The electronic device may further include a waveguide coupled to the first platform and the second platform such that their respective microelectronic packages are communicatively coupled by the waveguide. Other embodiments may be described or claimed.

公开(公告)号：US20190356033A1

公开(公告)日：2019-11-21

申请号：US16014036

申请日：2018-06-21

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Adel A. Elsherbini ,  Telesphor Kamgaing ,  Henning Braunisch ,  Johanna M. Swan

IPC: H01P3/16 ,  H01L23/66

Abstract: Disclosed herein are various designs for dielectric waveguides, as well as methods of manufacturing such waveguides. One type of dielectric waveguides described herein includes waveguides with one or more cavities in the dielectric waveguide material. Another type of dielectric waveguides described herein includes waveguides with a conductive ridge in the dielectric waveguide material. Dielectric waveguides described herein may be dispersion reduced dielectric waveguides, compared to conventional dielectric waveguides, and may be designed to adjust the difference in the group delay between the lower frequencies and the higher frequencies of a chosen bandwidth.

公开(公告)号：US20190089409A1

公开(公告)日：2019-03-21

申请号：US16196367

申请日：2018-11-20

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios Dogiamis ,  Henning Braunisch ,  Hyung-Jin Lee ,  Richard Dischler

IPC: H04B3/52 ,  H04B3/56 ,  H04B1/52

Abstract: Embodiments may relate to a transceiver chip. The transceiver chip may include a substrate that has a first transceiver component and a second transceiver component positioned therein. The transceiver chip may further include a well material that is positioned between the first transceiver component and the second transceiver component. The well material may mitigate cross-talk between the first transceiver component and the second transceiver component. Other embodiments may be described or claimed.

公开(公告)号：US12199012B2

公开(公告)日：2025-01-14

申请号：US16914066

申请日：2020-06-26

Applicant: Intel Corporation

Inventor： Adel Elsherbini ,  Stephen Morein ,  Feras Eid ,  Georgios Dogiamis

IPC: H01L23/467 ,  C23C24/04 ,  H01L21/48 ,  H01L23/373 ,  H01L23/473 ,  F28D1/03 ,  F28D21/00

Abstract: A microfluidic device having a channel within a first material to thermally couple with an IC die. The channel defines an initial fluid path between a fluid inlet port and a fluid outlet port. A second material is within a portion of the channel. The second material supplements the first material to modify the initial fluid path into a final fluid path between the fluid inlet port and the fluid outlet port. The second material may have a different composition and/or microstructure than the first material.

公开(公告)号：US20250006719A1

公开(公告)日：2025-01-02

申请号：US18341875

申请日：2023-06-27

Applicant: Intel Corporation

Inventor： Georgios Panagopoulos ,  Richard Geiger ,  Steven Callender ,  Georgios Dogiamis ,  Manisha Dutta ,  Stefano Pellerano

IPC: H01L25/18 ,  H01L23/00 ,  H01Q1/22 ,  H01Q23/00

Abstract: Example antenna module includes antenna units provided over an antenna unit support, and ICs communicatively coupled to various antenna units. The ICs are arranged in two or more subsets of one or more ICs in each subset, where an individual IC belongs to only one subset, different subsets are in different layers with respect to the antenna unit support, and an average pitch of projections of all of the ICs onto a plane parallel to the antenna unit support is substantially equal to, or smaller, than an average pitch of the antenna units. When an average width of the ICs is larger than the average pitch of the antenna units, arranging the ICs in two or more subsets in different layers means that at least one of the ICs of one subset partially overlaps with at least one of the ICs of another subset.

公开(公告)号：US20240429221A1

公开(公告)日：2024-12-26

申请号：US18339685

申请日：2023-06-22

Applicant: Intel Corporation

Inventor： Bernd Waidhas ,  Thomas Wagner ,  Georg Seidemann ,  Nicolas Richaud ,  Manisha Dutta ,  Georgios Dogiamis ,  Harshit Dhakad ,  Michael Langenbuch

IPC: H01L25/18 ,  H01L23/31 ,  H01L25/00 ,  H01L27/01 ,  H01Q1/22 ,  H01Q9/04

Abstract: Glass layers and capacitors for use with integrated circuit packages are disclosed. An example integrated circuit (IC) package includes a semiconductor die, a glass layer, and a capacitor electrically coupled to the semiconductor die, at least one side of the capacitor enclosed by the glass layer, the capacitor positioned closer to the glass layer than the semiconductor die is to the glass layer.

公开(公告)号：US12126067B2

公开(公告)日：2024-10-22

申请号：US16911559

申请日：2020-06-25

Applicant: Intel Corporation

Inventor： Diego Correas-Serrano ,  Georgios Dogiamis ,  Henning Braunisch ,  Neelam Prabhu Gaunkar ,  Telesphor Kamgaing

IPC: H01P3/16 ,  H01P1/20 ,  H01P1/208 ,  H01P5/08

CPC classification number: H01P3/16 ,  H01P1/2002 ,  H01P1/2088 ,  H01P5/087

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

公开(公告)号：US12088360B2

公开(公告)日：2024-09-10

申请号：US16897135

申请日：2020-06-09

Applicant: Intel Corporation

Inventor： Henning Braunisch ,  Georgios Dogiamis ,  Diego Correas-Serrano ,  Neelam Prabhu Gaunkar ,  Telesphor Kamgaing ,  Cooper S. Levy ,  Chintan S. Thakkar ,  Stefano Pellerano

IPC: H04B3/32 ,  H04L25/03

CPC classification number: H04B3/32 ,  H04L25/03885

Abstract: Embodiments may relate to a baseband module with communication pathways for a first data signal and a second data signal. The baseband module may also include a finite impulse response (FIR) filter in a communication path between the first signal input and the second signal output. Other embodiments may be described or claimed.