公开(公告)号：US10897238B2

公开(公告)日：2021-01-19

申请号：US15088987

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Feras Eid ,  Georgios C. Dogiamis ,  Valluri R. Rao ,  Adel A. Elsherbini ,  Johanna M. Swan ,  Telesphor Kamgaing ,  Vijay K. Nair

IPC: H03H9/54 ,  H03H9/05 ,  H03H9/17 ,  H03H9/15 ,  H03H9/02 ,  H03H9/24

Abstract: Embodiments of the invention include a filtering device that includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The piezoelectric filtering device expands and contracts laterally in a plane of an organic substrate in response to application of an electrical signal between the first and second electrodes.

公开(公告)号：US10887439B2

公开(公告)日：2021-01-05

申请号：US15777093

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Vijay K. Nair

IPC: H04M15/00 ,  H04M1/02 ,  H01Q1/38 ,  G06F1/16 ,  H01Q9/04 ,  H01Q21/00 ,  H01Q23/00 ,  H01Q25/00 ,  H01Q1/40 ,  H01Q21/28 ,  H01Q1/24 ,  H01Q21/22 ,  H01Q3/26 ,  H01Q1/22

Abstract: Embodiments of the invention include a microelectronic device that includes a die having at least one transceiver unit, a redistribution package coupled to the die, and a substrate coupled to the redistribution package. The substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US10594294B2

公开(公告)日：2020-03-17

申请号：US15088830

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Feras Eid ,  Baris Bicen ,  Telesphor Kamgaing ,  Vijay K. Nair ,  Georgios C. Dogiamis ,  Johanna M. Swan ,  Valluri R. Rao

IPC: H03H9/13 ,  H03H9/36

Abstract: Embodiments of the invention include a waveguide structure that includes a first piezoelectric transducer that is positioned in proximity to a first end of a cavity of an organic substrate. The first piezoelectric transducer receives an input electrical signal and generates an acoustic wave to be transmitted with a transmission medium. A second piezoelectric transducer is positioned in proximity to a second end of the cavity. The second piezoelectric transducer receives the acoustic wave from the transmission medium and generates an output electrical signal.

公开(公告)号：US10291283B2

公开(公告)日：2019-05-14

申请号：US15088996

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Feras Eid ,  Adel A. Elsherbini ,  Georgios C. Dogiamis ,  Vijay K. Nair ,  Johanna M. Swan ,  Valluri R. Rao

IPC: H04B1/48 ,  H03H7/38 ,  H01H57/00 ,  H03H15/00

Abstract: Embodiments of the invention include a tunable radio frequency (RF) communication module that includes a transmitting component having at least one tunable component and a receiving component having at least one tunable component. The tunable RF communication module includes at least one piezoelectric switching device coupled to at least one of the transmitting and receiving components. The at least one piezoelectric switching device is formed within an organic substrate having organic material and is designed to tune at least one tunable component of the tunable RF communication module.

公开(公告)号：US11978948B2

公开(公告)日：2024-05-07

申请号：US17458911

申请日：2021-08-27

Applicant: Intel Corporation

Inventor： Vijay K. Nair ,  Digvijay Ashokkumar Raorane

IPC: H01Q1/22 ,  H01L21/48 ,  H01L23/00 ,  H01L23/13 ,  H01L23/538 ,  H01L23/66 ,  H01L25/065 ,  H01Q13/00

CPC classification number: H01Q1/2283 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/5381 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01Q13/00 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237

Abstract: Generally discussed herein are systems, devices, and methods that include a communication cavity. According to an example a device can include substrate with a first cavity formed therein, first and second antennas exposed in and enclosed by the cavity, and an interconnect structure formed in the substrate, the interconnect structure including alternating conductive material layers and inter-layer dielectric layers.

公开(公告)号：US11488880B2

公开(公告)日：2022-11-01

申请号：US16619061

申请日：2017-06-30

Applicant: Intel Corporation

Inventor： Vijay K. Nair ,  Digvijay A. Raorane

IPC: H01L23/10 ,  H01L23/498 ,  H01L23/055 ,  H01L23/552 ,  H01L23/367 ,  H01L21/48 ,  H01L23/31 ,  H01L25/065 ,  H01L23/538

Abstract: Enclosure technology for electronic components is disclosed. An enclosure for an electronic component can comprise a base member and a cover member disposed on the base member such that the cover member and the base member form an enclosure for an electronic component. In one aspect, the base member can have at least one via extending therethrough. The at least one via can be configured to electrically couple an enclosed electronic component with another electronic component external to the enclosure. In another aspect, the cover member can include a protrusion, a receptacle, or both, and the base member can include a mating protrusion, receptacle, or both to facilitate proper alignment of the cover member and the base member. Electronic device packages and associated systems and methods are also disclosed.

公开(公告)号：US11456721B2

公开(公告)日：2022-09-27

申请号：US16648121

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Feras Eid ,  Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Vijay K. Nair ,  Johanna M. Swan

IPC: H03H9/10 ,  H03H9/05 ,  H03H9/54

Abstract: Packaged RF front end systems including a hybrid filter and an active circuit in a single package are described. In an example, a package includes an active die comprising an acoustic wave resonator. A package substrate is electrically coupled to the active die. A seal frame surrounds the acoustic wave resonator and is attached to the active die and to the package substrate, the seal frame hermetically sealing the acoustic wave resonator in a cavity between the active die and the package substrate.

公开(公告)号：US11283427B2

公开(公告)日：2022-03-22

申请号：US16648639

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Feras Eid ,  Georgios C. Dogiamis ,  Vijay K. Nair ,  Johanna M. Swan

IPC: H03H9/54 ,  H03H9/56 ,  H03H9/05 ,  H03H9/13

Abstract: Hybrid filters and more particularly filters having acoustic wave resonators (AWRs) and lumped component (LC) resonators and packages therefor are described. In an example, a packaged filter includes a package substrate, the package substrate having a first side and a second side, the second side opposite the first side. A first acoustic wave resonator (AWR) device is coupled to the package substrate, the first AWR device comprising a resonator. A plurality of inductors is in the package substrate.

公开(公告)号：US11195806B2

公开(公告)日：2021-12-07

申请号：US16348698

申请日：2016-12-29

Applicant: Intel Corporation

Inventor： Vijay K. Nair ,  Digvijay Ashokkumar Raorane

IPC: H01L23/66 ,  H01L23/48 ,  H01L23/538 ,  H01P3/12 ,  H01P11/00 ,  H04B7/00 ,  H01L25/065

Abstract: An integrated circuit (IC) comprises a substrate, a first die mounted on the substrate, a second die mounted on the substrate and a waveguide structure mounted on the first die and the second die to enable high frequency wireless communication between the first die and the second die.

公开(公告)号：US10903818B2

公开(公告)日：2021-01-26

申请号：US15089001

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Vijay K. Nair ,  Feras Eid ,  Adel A. Elsherbini ,  Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Valluri R. Rao ,  Johanna M. Swan

IPC: H03H9/54 ,  H03H9/05 ,  H03H9/58 ,  G06F1/18 ,  H03H9/56

Abstract: Embodiments of the invention include a piezoelectric package integrated filtering device that includes a film stack. In one example, the film stack includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The film stack is suspended with respect to a cavity of an organic substrate having organic material and the film stack generates an acoustic wave to be propagated across the film stack in response to an application of an electrical signal between the first and second electrodes.