公开(公告)号：US20190079055A1

公开(公告)日：2019-03-14

申请号：US16190998

申请日：2018-11-14

Applicant: Infineon Technologies AG

Inventor： Rui Miguel Moreira Araujo ,  Bernd Goller ,  Dominic Maier

IPC: G01N29/024 ,  H04R1/02 ,  G01N29/02 ,  G01N29/42 ,  G01N29/14 ,  H04R1/04

Abstract: Embodiments of the present disclosure provide an apparatus for determining a characteristic of a fluid. The apparatus may include a device configured to determine a hydrodynamic pressure of the fluid. The apparatus may further include a sensor configured to determine a hydrostatic pressure of the fluid or at least one component of the fluid. The apparatus may also include a common substrate on which the sensor and the device configured to determine a hydrodynamic pressure of the fluid may be commonly arranged, and an ASIC (Application Specific Integrated Circuit) which may be electrically coupled with at least one of the device or the sensor. The ASIC may be at least partially embedded in the common substrate.

公开(公告)号：US10161908B2

公开(公告)日：2018-12-25

申请号：US15079889

申请日：2016-03-24

Applicant: Infineon Technologies AG

Inventor： Rui Miguel Moreira Araujo ,  Bernd Goller ,  Dominic Maier

IPC: G01N29/024 ,  G01N29/02 ,  H04R1/02 ,  G01N29/14 ,  G01N29/42 ,  H04R1/04

Abstract: Embodiments of the present disclosure provide an apparatus for determining a characteristic of a fluid. The apparatus may include a device configured to determine a hydrodynamic pressure of the fluid. The apparatus may further include a sensor configured to determine a hydrostatic pressure of the fluid or at least one component of the fluid. The apparatus may also include a common substrate on which the sensor and the device configured to determine a hydrodynamic pressure of the fluid may be commonly arranged, and an ASIC (Application Specific Integrated Circuit) which may be electrically coupled with at least one of the device or the sensor. The ASIC may be at least partially embedded in the common substrate.

公开(公告)号：US20180305200A1

公开(公告)日：2018-10-25

申请号：US15957349

申请日：2018-04-19

Applicant: Infineon Technologies AG

Inventor： Bernd Goller ,  Matthias Steiert

IPC: B81B7/00 ,  B81C1/00 ,  H04R19/04

CPC classification number: B81B7/0064 ,  B81B3/0081 ,  B81B7/0058 ,  B81C1/00261 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/97 ,  H01L2924/15151 ,  H04R1/086 ,  H04R19/005 ,  H04R19/04 ,  H01L2924/00014

Abstract: The present disclosure relates to an apparatus comprising a substrate, wherein a MEMS module is arranged on a first side of the substrate, the output signal from said MEMS module changing in the event of a change in temperature. Furthermore, the apparatus has a housing structure which is arranged on a first side of the substrate and has a recess in which the MEMS module is arranged. The apparatus also has a layer which is applied to the housing structure and increases the heat capacity of the apparatus. The present disclosure also relates to a method for producing an apparatus of this kind.

公开(公告)号：US20180148322A1

公开(公告)日：2018-05-31

申请号：US15692938

申请日：2017-08-31

Applicant: Infineon Technologies AG

Inventor： Dominic Maier ,  Matthias Steiert ,  Chau Fatt Chiang ,  Christian Geissler ,  Bernd Goller ,  Thomas Kilger ,  Johannes Lodermeyer ,  Franz-Xaver Muehlbauer ,  Chee Yang Ng ,  Beng Keh See ,  Claus Waechter

IPC: B81B7/00 ,  B81C1/00

Abstract: A semiconductor package includes a semiconductor die having a sensor structure disposed at a first side of the semiconductor die, and a first port extending through the semiconductor die from the first side to a second side of the semiconductor die opposite the first side, so as to provide a link to the outside environment. Corresponding methods of manufacture are also provided.