公开(公告)号：US12141003B2

公开(公告)日：2024-11-12

申请号：US18522044

申请日：2023-11-28

Applicant: Innolux Corporation

Inventor： Wan-Ling Huang ,  Jian-Jung Shih ,  Jui-Feng Ko ,  Tsau-Hua Hsieh

IPC: G06F1/18 ,  G09F9/302

Abstract: A manufacturing method of a tiling electronic device includes the following steps. A first electronic panel is provided. The first electronic panel includes multiple first bumps and multiple first conducting lines, and the first bumps and the first conducting lines are disposed on a side surface of the first electronic panel. A second electronic panel is provided. The second electronic panel includes multiple second bumps and multiple second conducting lines, and the second bumps and the second conducting lines are disposed on a side surface of the second electronic panel. The first electronic panel and the second electronic panel are coupled through the first bumps and the second bumps. Multiple conducting elements are formed, so that the first conducting lines are electrically connected with the second conducting lines through the conducting elements after the first electronic panel and the second electronic panel are coupled.

公开(公告)号：US11876081B2

公开(公告)日：2024-01-16

申请号：US18321004

申请日：2023-05-22

Applicant: Innolux Corporation

Inventor： Jian-Jung Shih ,  Tsau-Hua Hsieh ,  Fang-Ying Lin ,  Kai Cheng

IPC: H01L25/075 ,  H01L21/66 ,  H01L25/16

CPC classification number: H01L25/0753 ,  H01L22/22 ,  H01L25/167

Abstract: An electronic device includes a substrate, a spacer, a first element and a second element. A spacer is disposed on the substrate and has a first opening, a second opening and a third opening arranged in a first direction. The second opening is located between the first opening and the third opening. A distance between the first opening and the second opening is less than a distance between the second opening and the third opening in the first direction. A first element is located in at least one of the first opening and the second opening. A second element is located in the third opening.

公开(公告)号：US20230352618A1

公开(公告)日：2023-11-02

申请号：US18341790

申请日：2023-06-27

Applicant: Innolux Corporation

Inventor： Tsau-Hua Hsieh ,  Jian-Jung Shih ,  Tzu-Min Yan

IPC: H01L33/00 ,  H01L25/075

CPC classification number: H01L33/0095 ,  H01L33/0093 ,  H01L25/0753 ,  H01L2933/0016

Abstract: The disclosure discloses a method for manufacturing light-emitting diode (LED) chips. The manufacturing method includes: providing a plurality of LED elements; randomly mixing the plurality of LED elements; performing a mesa process on the plurality of LED elements; and forming at least one pair of electrodes on the plurality of LED elements. An electronic device includes the LED chips.

公开(公告)号：US20230290760A1

公开(公告)日：2023-09-14

申请号：US18321004

申请日：2023-05-22

Applicant: Innolux Corporation

Inventor： Jian-Jung Shih ,  Tsau-Hua Hsieh ,  Fang-Ying Lin ,  Kai Cheng

IPC: H01L25/075 ,  H01L21/66 ,  H01L25/16

CPC classification number: H01L25/0753 ,  H01L22/22 ,  H01L25/167

Abstract: An electronic device includes a substrate, a spacer, a first element and a second element. A spacer is disposed on the substrate and has a first opening, a second opening and a third opening arranged in a first direction. The second opening is located between the first opening and the third opening. A distance between the first opening and the second opening is less than a distance between the second opening and the third opening in the first direction. A first element is located in at least one of the first opening and the second opening. A second element is located in the third opening.

公开(公告)号：US11699690B2

公开(公告)日：2023-07-11

申请号：US17167107

申请日：2021-02-04

Applicant: Innolux Corporation

Inventor： Jian-Jung Shih ,  Tsau-Hua Hsieh ,  Fang-Ying Lin ,  Kai Cheng

IPC: H01L25/075 ,  H01L21/66 ,  H01L25/16

CPC classification number: H01L25/0753 ,  H01L22/22 ,  H01L25/167

Abstract: A display device is provided in an embodiment in the disclosure, including a subpixel region, a spacer, a light-emitting element, and a driving circuit. The spacer separates the subpixel region into a first region and a second region. The light-emitting element is located in at least one of the first region or the second region. The driving circuit is electrically connected to the first region and the second region, so as to drive the light-emitting element. A manufacturing method of the display device is also disclosed.

公开(公告)号：US11322645B1

公开(公告)日：2022-05-03

申请号：US16853735

申请日：2020-04-20

Applicant: Innolux Corporation

Inventor： Tsau-Hua Hsieh ,  Jian-Jung Shih ,  Tzu-Min Yan

IPC: H01L21/00 ,  H01L33/00 ,  H01L25/075

Abstract: The disclosure discloses a method for manufacturing light-emitting diode (LED) chips. The manufacturing method includes: providing a plurality of LED elements; randomly mixing the plurality of LED elements; performing a mesa process on the plurality of LED elements; and forming at least one pair of electrodes on the plurality of LED elements. An electronic device includes the LED chips.

公开(公告)号：US20210175390A1

公开(公告)日：2021-06-10

申请号：US17103971

申请日：2020-11-25

Applicant: InnoLux Corporation

Inventor： Hui-Chieh Wang ,  Tsau-Hua Hsieh ,  Jian-Jung Shih ,  Fang-Ying Lin

IPC: H01L33/00 ,  H01L33/62

Abstract: A method of manufacturing an electronic device includes the steps of providing a conductive carrier with at least one electronic element disposed thereon, picking up the at least one electronic element, setting the conductive carrier to have a ground voltage at least in the step of picking up the at least one electronic element, and transferring the at least one electronic element to a target substrate.

公开(公告)号：US10909914B2

公开(公告)日：2021-02-02

申请号：US16131123

申请日：2018-09-14

Applicant: InnoLux Corporation

Inventor： Geng-Fu Chang ,  Jui-Feng Ko ,  Tsau-Hua Hsieh ,  Chun-Hsien Lin ,  Jian-Jung Shih

IPC: G09G3/30 ,  G09G3/3225 ,  H01L27/15 ,  G09G3/20 ,  H01L27/32

Abstract: A semiconductor device includes a first display unit and a second display unit. The first display unit includes a first substrate, first light-emitting units, and a first gate driver circuit. The first substrate includes a first display region. The first substrate has a first side and a second side. The first light-emitting units are disposed in the first display region. The first gate driver circuit is disposed in the first display region. The second display unit is adjacent to the first display unit. The second display unit includes a second substrate. The second substrate includes a second display region, second light-emitting units, and a second gate driver circuit. The second substrate has a third side and a fourth side. The second light-emitting units are disposed in the second display region. A second gate driver circuit is disposed in the second display region.

公开(公告)号：US20200335662A1

公开(公告)日：2020-10-22

申请号：US16821994

申请日：2020-03-17

Applicant: Innolux Corporation

Inventor： Jian-Jung Shih ,  Tsau-Hua Hsieh

IPC: H01L33/22 ,  H01L25/075 ,  H01L27/12 ,  H01L33/62 ,  H01L33/00 ,  H01L21/683

Abstract: The disclosure provides a method for manufacturing a light-emitting element, including the following steps. A light-emitting diode is provided. An energy beam is applied to process a surface of the light-emitting diode, where a power density of the energy beam is greater than 0 mJ/cm2 and less than or equal to 2000 mJ/cm2. The light-emitting element manufactured using the method for manufacturing a light-emitting element disclosed in embodiments of the disclosure may improve light extraction efficiency, may have a relatively good light-emitting effect, and may be electrically connected to a drive circuit to constitute an electronic device.