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公开(公告)号：US11908395B2
公开(公告)日：2024-02-20
申请号：US18107492
申请日：2023-02-08
Applicant: InnoLux Corporation
Inventor： Chun-Hsien Lin , Jui-Feng Ko , Geng-Fu Chang
IPC: G09G3/3266 , G09G3/32 , G09G3/00
CPC classification number: G09G3/32 , G09G3/006 , G09G2300/0861 , G09G2310/0202 , G09G2310/0267 , G09G2310/0281 , G09G2310/0286 , G09G2320/0223 , G09G2330/02 , G09G2330/12
Abstract: An electronic device including a panel, a Chip on Film and a flexible circuit board is disclosed. The panel includes a first gate driver, a switch transistor and a driving transistor. An output terminal of the switch transistor is coupled to a control terminal of the driving transistor. The first gate driver is used for receiving an AC signal and a DC signal and outputting a control signal to a control terminal of the switch transistor. The Chip on Film is electrically connected to the panel and used for transmitting a data signal to an input terminal of the switch transistor and transmitting the AC signal to the first gate driver. The flexible circuit board is electrically connected to the panel and used for transmitting a power signal to an input terminal of the driving transistor and transmitting the DC signal to the first gate driver.
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公开(公告)号：US20220206546A1
公开(公告)日：2022-06-30
申请号：US17542506
申请日：2021-12-06
Applicant: Innolux Corporation
Inventor： Wan-Ling Huang , Jian-Jung Shih , Jui-Feng Ko , Tsau-Hua Hsieh
Abstract: A manufacturing method of a tiling electronic device includes the following steps. A first electronic panel is provided. The first electronic panel includes multiple first bumps and multiple first conducting lines, and the first bumps and the first conducting lines are disposed on a side surface of the first electronic panel. A second electronic panel is provided. The second electronic panel includes multiple second bumps and multiple second conducting lines, and the second bumps and the second conducting lines are disposed on a side surface of the second electronic panel. The first electronic panel and the second electronic panel are coupled through the first bumps and the second bumps. Multiple conducting elements are formed, so that the first conducting lines are electrically connected with the second conducting lines through the conducting elements after the first electronic panel and the second electronic panel are coupled.
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公开(公告)号：US10446752B2
公开(公告)日：2019-10-15
申请号：US15662522
申请日：2017-07-28
Applicant: InnoLux Corporation
Inventor： Chun-Hsien Lin , Ming-Chang Lin , Tzu-Min Yan , Tsau-Hua Hsieh , Tung-Kai Liu , Jui-Feng Ko , Hui-Chieh Wang
Abstract: A light-emitting diode display device includes a light-emitting diode and a substrate. The light-emitting diode includes a central axis, and the substrate includes a first connecting portion and a second connecting portion. The central axis is extended through the first connecting portion. The second connecting portion is disposed outside of the first connecting portion and is spaced apart from the first connecting portion by a distance which is greater than zero, and the first connecting portion and the second connecting portion are respectively electrically connected to the light-emitting diode.
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公开(公告)号：US10748959B2
公开(公告)日：2020-08-18
申请号：US16558322
申请日：2019-09-03
Applicant: Innolux Corporation
Inventor： Kuo-Chang Chiang , Jui-Feng Ko , Tsau-Hua Hsieh
Abstract: A fabricating method for a display apparatus is provided. The fabricating method for the display apparatus includes the following steps. An array substrate having a first electrode and a second electrode is provided. A first light emitting diode is heated to soften a first bump between the first electrode and the first light emitting diode, the first light emitting diode is bonded onto the first electrode by the first bump. The first light emitting diode and a second light emitting diode are heated to soften the first bump and a second bump between the second electrode and the second light emitting diode, the second light emitting diode is bonded onto the second electrode by the second bump, and the first light emitting diode and the second light emitting diode are pressed.
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公开(公告)号：US20200006420A1
公开(公告)日：2020-01-02
申请号：US16558322
申请日：2019-09-03
Applicant: Innolux Corporation
Inventor： Kuo-Chang Chiang , Jui-Feng Ko , Tsau-Hua Hsieh
Abstract: A fabricating method for a display apparatus is provided. The fabricating method for the display apparatus includes the following steps. An array substrate having a first electrode and a second electrode is provided. A first light emitting diode is heated to soften a first bump between the first electrode and the first light emitting diode, the first light emitting diode is bonded onto the first electrode by the first bump. The first light emitting diode and a second light emitting diode are heated to soften the first bump and a second bump between the second electrode and the second light emitting diode, the second light emitting diode is bonded onto the second electrode by the second bump, and the first light emitting diode and the second light emitting diode are pressed.
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Patent Agency Ranking
公开(公告)号：US11955579B2
公开(公告)日：2024-04-09
申请号：US17725741
申请日：2022-04-21
Applicant: InnoLux Corporation
Inventor： Kai Cheng , Tsau-Hua Hsieh , Fang-Ying Lin , Tung-Kai Liu , Hui-Chieh Wang , Chun-Hsien Lin , Jui-Feng Ko
IPC: H01L33/00 , H01L33/62 , H01L25/075 , H01L25/16 , H01L33/32
CPC classification number: H01L33/0093 , H01L33/0095 , H01L33/62 , H01L25/0753 , H01L25/167 , H01L33/0075 , H01L33/32 , H01L2933/0066
Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.
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公开(公告)号：US11335827B2
公开(公告)日：2022-05-17
申请号：US16858826
申请日：2020-04-27
Applicant: InnoLux Corporation
Inventor： Kai Cheng , Tsau-Hua Hsieh , Fang-Ying Lin , Tung-Kai Liu , Hui-Chieh Wang , Chun-Hsien Lin , Jui-Feng Ko
IPC: H01L33/00 , H01L33/62 , H01L25/075 , H01L25/16 , H01L33/32
Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.
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公开(公告)号：US20180012930A1
公开(公告)日：2018-01-11
申请号：US15629766
申请日：2017-06-22
Applicant: Innolux Corporation
Inventor： Kuo-Chang Chiang , Jui-Feng Ko , Tsau-Hua Hsieh
CPC classification number: H01L27/156 , H01L25/0753 , H01L33/0095 , H01L33/06 , H01L33/62 , H01L2933/0066
Abstract: A display apparatus and a fabricating method for a display apparatus are provided. The fabricating method for the display apparatus includes the following steps. An array substrate having a first electrode and a second electrode is provided. A first light emitting diode is heated to soften a first bump between the first electrode and the first light emitting diode, the first light emitting diode is bonded onto the first electrode by the first bump. The first light emitting diode and a second light emitting diode are heated to soften the first bump and a second bump between the second electrode and the second light emitting diode, the second light emitting diode is bonded onto the second electrode by the second bump, and the first light emitting diode and the second light emitting diode are pressed.
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公开(公告)号：US20250004510A1
公开(公告)日：2025-01-02
申请号：US18884047
申请日：2024-09-12
Applicant: Innolux Corporation
Inventor： Wan-Ling Huang , Jian-Jung Shih , Jui-Feng Ko , Tsau-Hua Hsieh
Abstract: A manufacturing method of a tiling electronic device includes the following steps. A first electronic panel is provided. The first electronic panel includes multiple first bumps and multiple first conducting lines, and the first bumps and the first conducting lines are disposed on a side surface of the first electronic panel. A second electronic panel is provided. The second electronic panel includes multiple second bumps and multiple second conducting lines, and the second bumps and the second conducting lines are disposed on a side surface of the second electronic panel. The first electronic panel and the second electronic panel are coupled through the first bumps and the second bumps. Multiple conducting elements are formed, so that the first conducting lines are electrically connected with the second conducting lines through the conducting elements after the first electronic panel and the second electronic panel are coupled.
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公开(公告)号：US12141003B2
公开(公告)日：2024-11-12
申请号：US18522044
申请日：2023-11-28
Applicant: Innolux Corporation
Inventor： Wan-Ling Huang , Jian-Jung Shih , Jui-Feng Ko , Tsau-Hua Hsieh
Abstract: A manufacturing method of a tiling electronic device includes the following steps. A first electronic panel is provided. The first electronic panel includes multiple first bumps and multiple first conducting lines, and the first bumps and the first conducting lines are disposed on a side surface of the first electronic panel. A second electronic panel is provided. The second electronic panel includes multiple second bumps and multiple second conducting lines, and the second bumps and the second conducting lines are disposed on a side surface of the second electronic panel. The first electronic panel and the second electronic panel are coupled through the first bumps and the second bumps. Multiple conducting elements are formed, so that the first conducting lines are electrically connected with the second conducting lines through the conducting elements after the first electronic panel and the second electronic panel are coupled.
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