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公开(公告)号：US20210119333A1
公开(公告)日：2021-04-22
申请号：US17035725
申请日：2020-09-29
Applicant: Innolux Corporation
Inventor： Hsiuyi Tsai , Yi Hung Lin , Chia-Chi Ho , Yan-Zheng Wu
Abstract: An electromagnetic wave adjusting device includes a first substrate, a first conductive element, a first insulation layer, a second substrate, a second conductive element, a dielectric layer, and a conductive layer. The first conductive element is disposed on the first substrate. The first insulation layer is disposed on the first conductive element. The second conductive element is disposed on the second substrate. The dielectric layer is disposed between the first substrate and the second substrate. The first conductive layer is disposed on the first insulation layer and electrically connected to the first conductive element. The electromagnetic wave adjusting device includes an overlap area and a capacitance adjustable area. An overlap portion of the first conductive element and the second conductive element constitutes the overlap area, the capacitance adjustable area includes the overlap area, and at least part of the first conductive layer is disposed in the capacitance adjustable area.
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公开(公告)号：US10249949B2
公开(公告)日：2019-04-02
申请号：US15869786
申请日：2018-01-12
Applicant: InnoLux Corporation
Inventor： I-Yin Li , Chia-Chi Ho , Chin-Lung Ting , Yan-Zheng Wu
Abstract: A microwave modulation device includes a first radiator; a second radiator disposed on the first radiator; a third radiator disposed on the second radiator; a support structure disposed between the first radiator and the second radiator; and a modulation structure disposed between the second radiator and the third radiator. A microwave-transmission layer is located among the space defined by the first radiator, the second radiator, and the support structure. The microwave-transmission layer is gas, substantially vacuum, liquid or insulating material.
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公开(公告)号：US20240275024A1
公开(公告)日：2024-08-15
申请号：US18409747
申请日：2024-01-10
Applicant: Innolux Corporation
Inventor： Ying-Jen Chen , Yan-Zheng Wu
IPC: H01Q1/22 , H01L21/48 , H01L23/00 , H01L23/498 , H01Q1/38
CPC classification number: H01Q1/2283 , H01L21/4857 , H01L23/49822 , H01Q1/38 , H01L24/16 , H01L2224/16227
Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes an antenna structure, a first circuit structure, and a chip. The antenna structure includes a first dielectric layer, a first metal pattern, a second dielectric layer, and a second metal pattern. The first dielectric layer has a first surface and a second surface. The first metal pattern is disposed on the first surface. The second dielectric layer is disposed on the first metal pattern. The second metal pattern is disposed on the second dielectric layer. The first circuit structure is disposed on the antenna structure, and includes a third dielectric layer, a first conductive layer, and a first pad. The third dielectric layer is disposed on the second surface and has a fourth surface away from the second surface. The first conductive layer is disposed on the fourth surface. The first pad is disposed on the first conductive layer. The chip is disposed on the first circuit structure and electrically connected to the first circuit structure. The first metal pattern is indirectly electrically connected to the first conductive layer. The electronic device and the manufacturing method thereof may increase a bandwidth, reduce warpage, or improve reliability.
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公开(公告)号：US12040315B2
公开(公告)日：2024-07-16
申请号：US17505594
申请日：2021-10-19
Applicant: InnoLux Corporation
Inventor： Jen-Hai Chi , Chia-Ping Tseng , Chen-Lin Yeh , Yan-Zheng Wu
IPC: H01L25/00 , H01L23/00 , H01L23/498 , H01L23/538 , H01L23/66 , H01L25/07
CPC classification number: H01L25/072 , H01L23/49822 , H01L23/5383 , H01L23/66 , H01L24/16 , H01L2223/6677 , H01L2224/16227 , H01L2924/15172
Abstract: An electronic device includes a carrier having at least one bonding pad, a plurality of electronic elements disposed on the carrier and one of the electronic elements including a substrate and at least one connecting terminal disposed between the substrate and the carrier. The electronic elements are electrically connected to the at least one bonding pad via the at least one connecting terminal.
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公开(公告)号：US20240071267A1
公开(公告)日：2024-02-29
申请号：US18358902
申请日：2023-07-25
Applicant: Innolux Corporation
Inventor： Hong-Sheng Hsieh , Chih-Yung Hsieh , Yan-Zheng Wu
Abstract: An electronic device is provided. The electronic device includes a first substrate and a first pattern layer. The first substrate has a first surface and a second surface opposite to each other. The first pattern layer is disposed on the first surface and includes a first grid region and a second grid region. The first grid region includes multiple first grids. The second grid region includes multiple second grids. The first grid region is connected to the second grid region. One of the first grid and the second grid includes a metal grid. The other one of the first grid and the second grid includes a non-metal grid. The electronic device of the embodiment of the disclosure can improve appearance.
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Patent Agency Ranking
公开(公告)号：US20240047882A1
公开(公告)日：2024-02-08
申请号：US18346882
申请日：2023-07-05
Applicant: Innolux Corporation
Inventor： Chih-Yung Hsieh , Hong-Sheng Hsieh , Yan-Zheng Wu
CPC classification number: H01Q9/0414 , H01Q1/48 , H01Q21/065
Abstract: An antenna device includes a first grid layer, a second grid layer, and a first insulation layer. The first grid layer has a first function region. The second grid layer has a second function region and a second dummy region electrically insulated from the second function region. The first insulation layer is disposed between the first grid layer and the second grid layer, and the first function region overlaps the second function region.
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公开(公告)号：US20240004244A1
公开(公告)日：2024-01-04
申请号：US18468751
申请日：2023-09-18
Applicant: Innolux Corporation
Inventor： Chen-Lin Yeh , Chung-Kuang Wei , Jen-Hai Chi , Yan-Zheng Wu
IPC: G02F1/1345 , G02F1/1337 , G02F1/1339
CPC classification number: G02F1/13458 , G02F1/1337 , G02F1/1339
Abstract: A manufacturing method of an electronic device is provided. The manufacturing method of the electronic device includes: providing a substrate; providing an adjustable element, including a liquid crystal layer; and bonding the adjustable element onto the substrate.
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公开(公告)号：US11574893B2
公开(公告)日：2023-02-07
申请号：US17106197
申请日：2020-11-30
Applicant: InnoLux Corporation
Inventor： Jen-Hai Chi , Chia-Ping Tseng , Chen-Lin Yeh , Yan-Zheng Wu
Abstract: An electronic device includes a carrier having at least one bonding pad, a plurality of electronic elements disposed on the carrier and one of the electronic elements including a substrate and at least one connecting terminal disposed between the substrate and the carrier. The electronic elements are electrically connected to the at least one bonding pad via the at least one connecting terminal.
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公开(公告)号：US20220197076A1
公开(公告)日：2022-06-23
申请号：US17535587
申请日：2021-11-25
Applicant: Innolux Corporation
Inventor： Chen-Lin Yeh , Chung-Kuang Wei , Jen-Hai Chi , Yan-Zheng Wu
IPC: G02F1/1345 , G02F1/1337 , G02F1/1339
Abstract: An electronic device and a manufacturing method thereof are provided. The manufacturing method of the electronic device includes: providing a substrate; providing an adjustable element, including a liquid crystal layer; and bonding the adjustable element onto the substrate.
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公开(公告)号：US11201404B2
公开(公告)日：2021-12-14
申请号：US17035725
申请日：2020-09-29
Applicant: Innolux Corporation
Inventor： Hsiuyi Tsai , Yi Hung Lin , Chia-Chi Ho , Yan-Zheng Wu
Abstract: An electromagnetic wave adjusting device includes a first substrate, a first conductive element, a first insulation layer, a second substrate, a second conductive element, a dielectric layer, and a conductive layer. The first conductive element is disposed on the first substrate. The first insulation layer is disposed on the first conductive element. The second conductive element is disposed on the second substrate. The dielectric layer is disposed between the first substrate and the second substrate. The first conductive layer is disposed on the first insulation layer and electrically connected to the first conductive element. The electromagnetic wave adjusting device includes an overlap area and a capacitance adjustable area. An overlap portion of the first conductive element and the second conductive element constitutes the overlap area, the capacitance adjustable area includes the overlap area, and at least part of the first conductive layer is disposed in the capacitance adjustable area.
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