公开(公告)号：US11670606B2

公开(公告)日：2023-06-06

申请号：US17115755

申请日：2020-12-08

申请人： InnoLux Corporation

发明人： Jen-Hai Chi

IPC分类号： H01L23/66 ,  H01L23/485 ,  H01L23/31 ,  H01Q1/38 ,  H01L23/00

CPC分类号： H01L23/66 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/485 ,  H01L24/05 ,  H01Q1/38 ,  H01L2223/6677 ,  H01L2224/023

摘要： A high-frequency device includes a second substrate disposed opposite to a first substrate, a first electrode disposed on a side surface of the first substrate adjacent to the second substrate, a second electrode disposed on a side surface of the second substrate adjacent to the first substrate, a sealant disposed between the first substrate and the second substrate, and a dielectric layer sandwiched between the first substrate and the second substrate by the sealant. The dielectric layer includes a gas or vacuum.

公开(公告)号：US20230171896A1

公开(公告)日：2023-06-01

申请号：US17976866

申请日：2022-10-30

申请人： Innolux Corporation

发明人： Pei-Chi Chen ,  Wen-Chi Fang ,  Jen-Hai Chi ,  Zhi-Fu Huang ,  Jia-Sin Lin ,  Wan-Chun Tsai

IPC分类号： H05K3/00 ,  H05K3/30

CPC分类号： H05K3/0044 ,  H05K3/30 ,  H05K2203/0228 ,  H05K2203/0264 ,  H05K2203/025 ,  H05K2201/10106 ,  H05K2201/10174

摘要： A manufacturing method of an electronic device including following steps is provided. A first substrate is provided. A thermal release adhesive layer is provided on the first substrate. A thinning process is performed on the first substrate to form a first thinned substrate. A cutting process is performed on the first thinned substrate to form a first sub-substrate. The thermal release adhesive layer is separated from the first thinned substrate or the first sub-substrate. In the manufacturing method of the electronic device provided in one or more embodiments of the disclosure, the manufacturing process of the electronic device may be simplified, and/or defects of the resultant electronic device may be reduced.

公开(公告)号：US20230084360A1

公开(公告)日：2023-03-16

申请号：US17889361

申请日：2022-08-16

申请人： Innolux Corporation

发明人： Jen-Hai Chi ,  Chia-Chi Ho

IPC分类号： H01L23/00 ,  H01L23/66 ,  H01L23/29 ,  H01L23/31 ,  H01L21/56

摘要： An electronic device includes a substrate, a bump, a chip, and an adhesive layer. The substrate includes a first connection pad. The bump is disposed on the first connection pad. The chip includes a second connection pad. The bump is disposed between the first connection pad and the second connection pad. The adhesive layer is disposed between the substrate and the chip. A dissipation factor of the adhesive layer is less than or equal to 0.01 at a frequency of 10 GHz. A manufacturing method of an electronic device includes the following: providing a substrate, where the substrate includes a first connection pad; applying an adhesive layer on the substrate; patterning the adhesive layer, such that the adhesive layer produces an opening exposing the first connection pad; forming a bump on the first connection pad; and bonding the chip onto the bump through the second connection pad.

公开(公告)号：US20220254763A1

公开(公告)日：2022-08-11

申请号：US17584391

申请日：2022-01-26

申请人： Innolux Corporation

发明人： Jen-Hai Chi ,  Chen-Lin Yeh ,  Chih-Yung Hsieh

IPC分类号： H01L25/16 ,  H01L25/18 ,  H01L23/538

摘要： The disclosure provides an electronic device, including a substrate, a first conductor layer, a first insulating layer, an electronic component, and a driving structure. The first conductor layer is arranged on the substrate. The first insulating layer is disposed on the first conductor layer. The electronic component is arranged on the first insulating layer and coupled to the first conductor layer. The driving structure is coupled to the electronic component. The electronic device in the disclosure can have improved structural reliability.

公开(公告)号：US20240223246A1

公开(公告)日：2024-07-04

申请号：US18533195

申请日：2023-12-08

申请人： Innolux Corporation

发明人： Chen-Lin Yeh ,  Yan-Zheng Wu ,  Jen-Hai Chi ,  Chih-Yung Hsieh

IPC分类号： H04B7/0456 ,  H04B7/0426 ,  H04B7/155

CPC分类号： H04B7/0478 ,  H04B7/043 ,  H04B7/15564

摘要： A modulation method and a modulation device for modulating beamforming are provided. The modulation method includes: providing a memory element that stores a beamforming table; providing a driving element; providing a plurality of modulation element groups; providing a signal source to provide at least one initial electromagnetic wave to the modulation element groups; providing a plurality of driving signals corresponding to the modulation element groups according to the beamforming table by the driving element; modulating the at least one initial electromagnetic wave to be a main wave beam with a specific radiation waveform according to the drive signals by the modulation element groups.

公开(公告)号：US20240064949A1

公开(公告)日：2024-02-22

申请号：US18356192

申请日：2023-07-20

申请人： Innolux Corporation

发明人： Jen-Hai Chi

IPC分类号： H05K13/04

CPC分类号： H05K13/0411

摘要： A transfer device, including a substrate and multiple pick-and-place modules, is provided. The pick-and-place modules are disposed on the substrate to transfer multiple electronic components onto the substrate. At least one pick-and-place module includes a rotating arm that rotates vertically relative to the substrate.

公开(公告)号：US20230026864A1

公开(公告)日：2023-01-26

申请号：US17844744

申请日：2022-06-21

申请人： Innolux Corporation

发明人： Chia-Chi Ho ,  Jen-Hai Chi ,  Chin-Lung Ting

IPC分类号： H01L25/16 ,  H01L23/10 ,  H01L23/00 ,  H01L23/16

摘要： Provided is an electronic device including a substrate, a first metal layer, an electronic component, a cover layer, and an adhesive layer. The first metal layer is formed on the substrate. The electronic component is disposed on the substrate and electrically connected to the first metal layer. The adhesive layer is adhered to the substrate and the cover layer.

公开(公告)号：US20230009495A1

公开(公告)日：2023-01-12

申请号：US17845929

申请日：2022-06-21

申请人： Innolux Corporation

发明人： Jen-Hai Chi ,  Chih-Yung Hsieh

IPC分类号： H01L23/00

摘要： The disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a substrate, an electronic element, an underfill layer, and a protective structure. The electronic element is disposed on the substrate. At least a portion of the underfill layer is disposed between the substrate and the electronic element. A thickness of the underfill layer is not greater than a height from a surface of the substrate to an upper surface of the electronic element. The protective structure is disposed on the substrate and adjacent to the underfill layer. The electronic device and the manufacturing method thereof of the disclosure may effectively control an area of the underfill layer.

公开(公告)号：US20220200652A1

公开(公告)日：2022-06-23

申请号：US17533090

申请日：2021-11-22

申请人： Innolux Corporation

发明人： Jen-Hai Chi

IPC分类号： H04B1/66 ,  H01B13/32 ,  H04B1/03 ,  H01B1/12

摘要： The disclosure provides a manufacturing method of an electronic device. The manufacturing method of the electronic device includes steps as follows. A substrate is provided. A first opening is formed and penetrates the substrate. A polymer layer is formed in the first opening. The polymer layer is in contact with a sidewall of the substrate at the first opening.

公开(公告)号：US20240142522A1

公开(公告)日：2024-05-02

申请号：US18480519

申请日：2023-10-04

申请人： Innolux Corporation

发明人： Chih-Yung Hsieh ,  Chen-Lin Yeh ,  Jen-Hai Chi

IPC分类号： G01R31/319 ,  G01R1/067 ,  G01R1/20

CPC分类号： G01R31/31926 ,  G01R1/06766 ,  G01R1/06794 ,  G01R1/20

摘要： An electronic device is provided. The electronic device includes a plurality of units. The plurality of units includes a first unit. The first unit includes a first electronic component and a test circuit. The test circuit is electrically connected to the first electronic component. The test circuit includes a coil circuit.