公开(公告)号：US20250138369A1

公开(公告)日：2025-05-01

申请号：US19007586

申请日：2025-01-02

Applicant: InnoLux Corporation

Inventor： Jen-Hai Chi ,  Chean Kee

IPC: G02F1/1337 ,  G02F1/1333 ,  G02F1/1339 ,  G02F1/1343 ,  G02F1/1347

Abstract: An electronic device includes a first substrate, a second substrate disposed opposite to the first substrate, a third substrate disposed between the first substrate and the second substrate, an optical media layer disposed between the first substrate and the third substrate, and a first glue disposed between the second substrate and the third substrate. In a cross-sectional view of the electronic device, a sidewall of the third substrate is recessed from a sidewall of the first substrate and a sidewall of the second substrate to form a recessed portion, and another sidewall of the third substrate protrudes from another sidewall of the first substrate and another sidewall of the second substrate to form a protruding portion opposite to the recessed portion.

公开(公告)号：US11670606B2

公开(公告)日：2023-06-06

申请号：US17115755

申请日：2020-12-08

Applicant: InnoLux Corporation

Inventor： Jen-Hai Chi

IPC: H01L23/66 ,  H01L23/485 ,  H01L23/31 ,  H01Q1/38 ,  H01L23/00

CPC classification number: H01L23/66 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/485 ,  H01L24/05 ,  H01Q1/38 ,  H01L2223/6677 ,  H01L2224/023

Abstract: A high-frequency device includes a second substrate disposed opposite to a first substrate, a first electrode disposed on a side surface of the first substrate adjacent to the second substrate, a second electrode disposed on a side surface of the second substrate adjacent to the first substrate, a sealant disposed between the first substrate and the second substrate, and a dielectric layer sandwiched between the first substrate and the second substrate by the sealant. The dielectric layer includes a gas or vacuum.

公开(公告)号：US20230171896A1

公开(公告)日：2023-06-01

申请号：US17976866

申请日：2022-10-30

Applicant: Innolux Corporation

Inventor： Pei-Chi Chen ,  Wen-Chi Fang ,  Jen-Hai Chi ,  Zhi-Fu Huang ,  Jia-Sin Lin ,  Wan-Chun Tsai

IPC: H05K3/00 ,  H05K3/30

CPC classification number: H05K3/0044 ,  H05K3/30 ,  H05K2203/0228 ,  H05K2203/0264 ,  H05K2203/025 ,  H05K2201/10106 ,  H05K2201/10174

Abstract: A manufacturing method of an electronic device including following steps is provided. A first substrate is provided. A thermal release adhesive layer is provided on the first substrate. A thinning process is performed on the first substrate to form a first thinned substrate. A cutting process is performed on the first thinned substrate to form a first sub-substrate. The thermal release adhesive layer is separated from the first thinned substrate or the first sub-substrate. In the manufacturing method of the electronic device provided in one or more embodiments of the disclosure, the manufacturing process of the electronic device may be simplified, and/or defects of the resultant electronic device may be reduced.

公开(公告)号：US20230084360A1

公开(公告)日：2023-03-16

申请号：US17889361

申请日：2022-08-16

Applicant: Innolux Corporation

Inventor： Jen-Hai Chi ,  Chia-Chi Ho

IPC: H01L23/00 ,  H01L23/66 ,  H01L23/29 ,  H01L23/31 ,  H01L21/56

Abstract: An electronic device includes a substrate, a bump, a chip, and an adhesive layer. The substrate includes a first connection pad. The bump is disposed on the first connection pad. The chip includes a second connection pad. The bump is disposed between the first connection pad and the second connection pad. The adhesive layer is disposed between the substrate and the chip. A dissipation factor of the adhesive layer is less than or equal to 0.01 at a frequency of 10 GHz. A manufacturing method of an electronic device includes the following: providing a substrate, where the substrate includes a first connection pad; applying an adhesive layer on the substrate; patterning the adhesive layer, such that the adhesive layer produces an opening exposing the first connection pad; forming a bump on the first connection pad; and bonding the chip onto the bump through the second connection pad.

公开(公告)号：US20220254763A1

公开(公告)日：2022-08-11

申请号：US17584391

申请日：2022-01-26

Applicant: Innolux Corporation

Inventor： Jen-Hai Chi ,  Chen-Lin Yeh ,  Chih-Yung Hsieh

IPC: H01L25/16 ,  H01L25/18 ,  H01L23/538

Abstract: The disclosure provides an electronic device, including a substrate, a first conductor layer, a first insulating layer, an electronic component, and a driving structure. The first conductor layer is arranged on the substrate. The first insulating layer is disposed on the first conductor layer. The electronic component is arranged on the first insulating layer and coupled to the first conductor layer. The driving structure is coupled to the electronic component. The electronic device in the disclosure can have improved structural reliability.

公开(公告)号：US12300624B2

公开(公告)日：2025-05-13

申请号：US17722412

申请日：2022-04-18

Applicant: Innolux Corporation

Inventor： Jen-Hai Chi ,  Yun-Sheng Chen ,  Chia-Chi Ho

IPC: H01L23/538 ,  H01L23/367 ,  H01L23/498 ,  H01L25/16 ,  H01L23/00

Abstract: The disclosure provides an electronic device which includes a substrate structure, a driving component, and a conductive pattern. The driving component and the conductive pattern are formed on the substrate structure, and the thickness of the conductive pattern is greater than or equal to 0.5 μm and less than or equal to 15 μm.

公开(公告)号：US12222605B2

公开(公告)日：2025-02-11

申请号：US18512050

申请日：2023-11-17

Applicant: InnoLux Corporation

Inventor： Jen-Hai Chi ,  Chean Kee

IPC: G02F1/1337 ,  G02F1/1333 ,  G02F1/1339 ,  G02F1/1343 ,  G02F1/1347

Abstract: An electronic device includes a first substrate, a second substrate on the first substrate, a third substrate between the first substrate and the second substrate, a first optical media layer between the first substrate and the third substrate, and a second optical media layer between the second substrate and the third substrate. A sidewall of the third substrate is recessed from a sidewall of the first substrate and a sidewall of the second substrate to form a recessed portion. Another sidewall of the third substrate protrudes from another sidewall of the first substrate and another sidewall of the second substrate to form a protruding portion.

公开(公告)号：US20240223246A1

公开(公告)日：2024-07-04

申请号：US18533195

申请日：2023-12-08

Applicant: Innolux Corporation

Inventor： Chen-Lin Yeh ,  Yan-Zheng Wu ,  Jen-Hai Chi ,  Chih-Yung Hsieh

IPC: H04B7/0456 ,  H04B7/0426 ,  H04B7/155

CPC classification number: H04B7/0478 ,  H04B7/043 ,  H04B7/15564

Abstract: A modulation method and a modulation device for modulating beamforming are provided. The modulation method includes: providing a memory element that stores a beamforming table; providing a driving element; providing a plurality of modulation element groups; providing a signal source to provide at least one initial electromagnetic wave to the modulation element groups; providing a plurality of driving signals corresponding to the modulation element groups according to the beamforming table by the driving element; modulating the at least one initial electromagnetic wave to be a main wave beam with a specific radiation waveform according to the drive signals by the modulation element groups.

公开(公告)号：US20240064949A1

公开(公告)日：2024-02-22

申请号：US18356192

申请日：2023-07-20

Applicant: Innolux Corporation

Inventor： Jen-Hai Chi

IPC: H05K13/04

CPC classification number: H05K13/0411

Abstract: A transfer device, including a substrate and multiple pick-and-place modules, is provided. The pick-and-place modules are disposed on the substrate to transfer multiple electronic components onto the substrate. At least one pick-and-place module includes a rotating arm that rotates vertically relative to the substrate.

公开(公告)号：US20230026864A1

公开(公告)日：2023-01-26

申请号：US17844744

申请日：2022-06-21

Applicant: Innolux Corporation

Inventor： Chia-Chi Ho ,  Jen-Hai Chi ,  Chin-Lung Ting

IPC: H01L25/16 ,  H01L23/10 ,  H01L23/00 ,  H01L23/16

Abstract: Provided is an electronic device including a substrate, a first metal layer, an electronic component, a cover layer, and an adhesive layer. The first metal layer is formed on the substrate. The electronic component is disposed on the substrate and electrically connected to the first metal layer. The adhesive layer is adhered to the substrate and the cover layer.