公开(公告)号：US20240223246A1

公开(公告)日：2024-07-04

申请号：US18533195

申请日：2023-12-08

Applicant: Innolux Corporation

Inventor： Chen-Lin Yeh ,  Yan-Zheng Wu ,  Jen-Hai Chi ,  Chih-Yung Hsieh

IPC: H04B7/0456 ,  H04B7/0426 ,  H04B7/155

CPC classification number: H04B7/0478 ,  H04B7/043 ,  H04B7/15564

Abstract: A modulation method and a modulation device for modulating beamforming are provided. The modulation method includes: providing a memory element that stores a beamforming table; providing a driving element; providing a plurality of modulation element groups; providing a signal source to provide at least one initial electromagnetic wave to the modulation element groups; providing a plurality of driving signals corresponding to the modulation element groups according to the beamforming table by the driving element; modulating the at least one initial electromagnetic wave to be a main wave beam with a specific radiation waveform according to the drive signals by the modulation element groups.

公开(公告)号：US20240030580A1

公开(公告)日：2024-01-25

申请号：US18331946

申请日：2023-06-09

Applicant: Innolux Corporation

Inventor： Chen-Lin Yeh ,  Yan-Zheng Wu ,  Yung-Wei Chen

IPC: H01P3/08 ,  H01P11/00 ,  H05K1/02 ,  H05K3/06 ,  H05K3/42 ,  H05K3/36

CPC classification number: H01P3/081 ,  H01P11/003 ,  H05K1/0243 ,  H05K3/06 ,  H05K3/423 ,  H05K3/368 ,  H05K2201/10151 ,  H05K2201/10196 ,  H05K2201/10098 ,  H05K2201/09545 ,  H05K2201/09618 ,  H05K2201/09609 ,  H05K3/0029

Abstract: An electronic device includes a glass substrate, a first metal layer, a second metal layer, and a third metal layer. The glass substrate includes a first surface, a second surface corresponding to the first surface, and at least two first through holes. The first through hole includes a third surface, and the third surface is connected to the first surface and the second surface. A first conductive layer is disposed on the first surface. A second conductive layer is disposed on the second surface. A third conductive layer is disposed on the third surface and is electrically connected to the first conductive layer and the second conductive layer. The first through hole has a major axis and a minor axis in a top view direction. A method of manufacturing the electronic device is also included.

公开(公告)号：US20220201864A1

公开(公告)日：2022-06-23

申请号：US17535572

申请日：2021-11-25

Applicant: Innolux Corporation

Inventor： Chen-Lin Yeh ,  Ming-Sheng Lai ,  Yan-Zheng Wu

IPC: H05K1/18

Abstract: An electronic device includes a substrate, a plurality of conductive patterns, and a tunable element. A plurality of conductive patterns are disposed on the substrate. The tunable element is disposed on at least one conductive pattern in the plurality of conductive patterns and includes a first pad, a second pad, and a third pad. The first pad, the second pad, and the third pad are separated from each other. The first pad and the second pad are overlapped with the at least one conductive pattern in the plurality of conductive patterns. The third pad is disposed between the first pad and the second pad.

公开(公告)号：US20250063801A1

公开(公告)日：2025-02-20

申请号：US18934223

申请日：2024-10-31

Applicant: Innolux Corporation

Inventor： Chin-Lung Ting ,  Jen-Hai Chi ,  Chia-Ping Tseng ,  Chen-Lin Yeh ,  Chung-Kuang Wei ,  Cheng-Hsu Chou

IPC: H01L27/06 ,  H01L29/778 ,  H01L29/93

Abstract: The disclosure provides an electronic device. The electronic device includes a substrate, a transistor, and a variable capacitor. The transistor is disposed on the substrate. The variable capacitor is disposed on the substrate and adjacent to the transistor. A material of the transistor and a material of the variable capacitor both a include a III-V semiconductor material. The electronic device of an embodiment of the disclosure may simplify manufacturing process, reduce costs, or reduce dimensions.

公开(公告)号：US20240142522A1

公开(公告)日：2024-05-02

申请号：US18480519

申请日：2023-10-04

Applicant: Innolux Corporation

Inventor： Chih-Yung Hsieh ,  Chen-Lin Yeh ,  Jen-Hai Chi

IPC: G01R31/319 ,  G01R1/067 ,  G01R1/20

CPC classification number: G01R31/31926 ,  G01R1/06766 ,  G01R1/06794 ,  G01R1/20

Abstract: An electronic device is provided. The electronic device includes a plurality of units. The plurality of units includes a first unit. The first unit includes a first electronic component and a test circuit. The test circuit is electrically connected to the first electronic component. The test circuit includes a coil circuit.

公开(公告)号：US11803086B2

公开(公告)日：2023-10-31

申请号：US17535587

申请日：2021-11-25

Applicant: Innolux Corporation

Inventor： Chen-Lin Yeh ,  Chung-Kuang Wei ,  Jen-Hai Chi ,  Yan-Zheng Wu

IPC: G02F1/1345 ,  G02F1/1337 ,  G02F1/1339

CPC classification number: G02F1/13458 ,  G02F1/1337 ,  G02F1/1339

Abstract: An electronic device and a manufacturing method thereof are provided. The manufacturing method of the electronic device includes: providing a substrate; providing an adjustable element, including a liquid crystal layer; and bonding the adjustable element onto the substrate.

公开(公告)号：US12166033B2

公开(公告)日：2024-12-10

申请号：US17513865

申请日：2021-10-28

Applicant: Innolux Corporation

Inventor： Chin-Lung Ting ,  Jen-Hai Chi ,  Chia-Ping Tseng ,  Chen-Lin Yeh ,  Chung-Kuang Wei ,  Cheng-Hsu Chou

IPC: H01L27/06 ,  H01L29/778 ,  H01L29/93

Abstract: The disclosure provides an electronic device. The electronic device includes a substrate, a transistor, and a variable capacitor. The transistor is disposed on the substrate. The variable capacitor is disposed on the substrate and adjacent to the transistor. A material of the transistor and a material of the variable capacitor both a include a III-V semiconductor material. The electronic device of an embodiment of the disclosure may simplify manufacturing process, reduce costs, or reduce dimensions.

公开(公告)号：US20240379641A1

公开(公告)日：2024-11-14

申请号：US18784850

申请日：2024-07-25

Applicant: Innolux Corporation

Inventor： Jen-Hai Chi ,  Chen-Lin Yeh ,  Chih-Yung Hsieh

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/538 ,  H01L25/18

Abstract: The disclosure provides an electronic device, including a substrate, a first conductor layer, a first insulating layer, an electronic component, and a driving structure. The first conductor layer is arranged on the substrate. The first insulating layer is disposed on the first conductor layer. The electronic component is arranged on the first insulating layer and coupled to the first conductor layer. The driving structure is coupled to the electronic component. The electronic device in the disclosure can have improved structural reliability.

公开(公告)号：US12125829B2

公开(公告)日：2024-10-22

申请号：US18093331

申请日：2023-01-05

Applicant: InnoLux Corporation

Inventor： Jen-Hai Chi ,  Chia-Ping Tseng ,  Chen-Lin Yeh ,  Yan-Zheng Wu

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01L23/66 ,  H01L25/07

CPC classification number: H01L25/072 ,  H01L23/3121 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/66 ,  H01L24/16 ,  H01L2223/6677 ,  H01L2224/16227

Abstract: An electronic device includes a carrier, a plurality of electronic elements and a connecting terminal. The carrier has at least one bonding pad. The electronic elements are disposed on the carrier, and each of the electronic elements includes a substrate. A distance between two adjacent substrates of the electronic elements is not less than 300 μm. The connecting terminal is disposed between one of the substrate and the carrier. One of the electronic elements are electrically connected to the at least one bonding pad via the connecting terminal.

公开(公告)号：US20230299489A1

公开(公告)日：2023-09-21

申请号：US18172284

申请日：2023-02-21

Applicant: Innolux Corporation

Inventor： Jen-Hai Chi ,  Chen-Lin Yeh ,  Chin-Lung Ting

IPC: H01Q9/04 ,  H01F27/28

CPC classification number: H01Q9/0442 ,  H01F27/28

Abstract: An electronic device including a tuning element is provided. The tuning element includes a first capacitor element including a first switch and a first capacitor electrically coupled to the first switch and a second capacitor element including a second capacitor. The first capacitor element is electrically connected in parallel with the second capacitor element.