公开(公告)号：US12119541B2

公开(公告)日：2024-10-15

申请号：US17848508

申请日：2022-06-24

Applicant: InnoLux Corporation

Inventor： I-Yin Li ,  Tang-Chin Hung

IPC: H01Q1/22 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66

CPC classification number: H01Q1/2283 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6677

Abstract: An antenna device is provided. The antenna device includes a first substrate and a second substrate facing the first substrate. The first substrate includes an inner surface and an outer surface opposite the inner surface of the first substrate. The second substrate includes an inner surface and an outer surface opposite the inner surface of the second substrate. The antenna device also includes a die disposed between the first substrate and the second substrate, a redistribution layer disposed between the die and the inner surface of the second substrate, and an antenna unit electrically connected to the die via the redistribution layer. The antenna unit is arranged on at least one of the inner surface of the first substrate, the outer surface of the first substrate, the inner surface of the second substrate, and the outer surface of the second substrate.

公开(公告)号：US20240312983A1

公开(公告)日：2024-09-19

申请号：US18671908

申请日：2024-05-22

Applicant: Innolux Corporation

Inventor： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC: H01L27/06 ,  H01L21/8234 ,  H01L23/522 ,  H01L23/538 ,  H01L29/93

CPC classification number: H01L27/0629 ,  H01L21/823475 ,  H01L23/5223 ,  H01L29/93 ,  H01L23/5385 ,  H01L27/0694

Abstract: The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, a PN junction assembly, and a transistor circuit. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer is formed above the second surface. The second metal layer is formed on the second surface. The PN junction assembly is disposed on the first surface and electrically connected with the first metal layer and the second metal layer. The PN junction assembly includes a variable capacitor. The transistor circuit is electrically connecting with the second metal layer.

公开(公告)号：US11688934B2

公开(公告)日：2023-06-27

申请号：US17462461

申请日：2021-08-31

Applicant: InnoLux Corporation

Inventor： Yi-Hung Lin ,  Tang-Chin Hung ,  Chia-Chi Ho ,  I-Yin Li

IPC: H01Q1/38 ,  H01Q1/36 ,  H01Q9/04 ,  H01Q3/44

CPC classification number: H01Q1/36 ,  H01Q9/0407 ,  G09G2300/0876 ,  H01Q3/44

Abstract: An antenna device is provided. The antenna device includes a first substrate, a first conductive layer, a first insulating structure, a second substrate, a second conductive layer and a liquid-crystal layer. The first conductive layer is disposed on the first substrate. The first insulating structure is disposed on the first conductive layer, and the first insulating structure includes a first region and a second region. The second substrate is disposed opposite to the first substrate. The second conductive layer is disposed on the second substrate. The liquid-crystal layer is disposed between the first conductive layer and the second conductive layer. The thickness of the first region is less than the thickness of the second region, and at least a portion of the first region is disposed in an overlapping region of the first conductive layer and the second conductive layer.

公开(公告)号：US10651549B2

公开(公告)日：2020-05-12

申请号：US16026171

申请日：2018-07-03

Applicant: InnoLux Corporation

Inventor： I-Yin Li ,  Chin-Lung Ting ,  Chia-Chi Ho ,  Yi-Hung Lin

IPC: H01Q1/40 ,  H01Q3/44 ,  H01Q1/36

Abstract: A microwave device includes a first substrate having a first surface, a first metal layer, a second substrate having a second surface corresponding to the first substrate, a second metal layer, a sealing element, a modulation material, and a fill material. The first metal layer is disposed on the first surface, and the first metal layer includes openings. The second metal layer is disposed on the second surface. The second metal layer includes electrodes corresponding to the openings. The sealing element is located between the first substrate and the second substrate. An active zone is formed by a space between the sealing element, the first substrate, and the second substrate. The modulation material is filled within the active area. The fill material is disposed in the active area. The thickness of the fill material is greater than 0.3 μm, and less than the thickness of the sealing element.

公开(公告)号：US10249949B2

公开(公告)日：2019-04-02

申请号：US15869786

申请日：2018-01-12

Applicant: InnoLux Corporation

Inventor： I-Yin Li ,  Chia-Chi Ho ,  Chin-Lung Ting ,  Yan-Zheng Wu

IPC: H04B1/04 ,  H01Q3/44 ,  H01Q9/16 ,  H01Q7/00 ,  H01Q9/27 ,  H04B1/034 ,  H04B13/00 ,  H04B7/0404

Abstract: A microwave modulation device includes a first radiator; a second radiator disposed on the first radiator; a third radiator disposed on the second radiator; a support structure disposed between the first radiator and the second radiator; and a modulation structure disposed between the second radiator and the third radiator. A microwave-transmission layer is located among the space defined by the first radiator, the second radiator, and the support structure. The microwave-transmission layer is gas, substantially vacuum, liquid or insulating material.

公开(公告)号：US12034002B2

公开(公告)日：2024-07-09

申请号：US17678040

申请日：2022-02-23

Applicant: Innolux Corporation

Inventor： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC: H01L27/06 ,  H01L21/8234 ,  H01L23/522 ,  H01L29/93 ,  H01L23/538

CPC classification number: H01L27/0629 ,  H01L21/823475 ,  H01L23/5223 ,  H01L29/93 ,  H01L23/5385 ,  H01L27/0694

Abstract: The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.

公开(公告)号：US11353735B2

公开(公告)日：2022-06-07

申请号：US16939064

申请日：2020-07-27

Applicant: Innolux Corporation

Inventor： Yi Hung Lin ,  I-Yin Li ,  Chia-Chi Ho ,  Hsiuyi Tsai

IPC: G02F1/1333 ,  G02F1/1339

Abstract: An electronic device including a pair of substrates, a sealant, and a heating unit is provided. Each of the pair of substrates includes a peripheral area and an active area, and each of the peripheral areas are adjacent to an edge of a corresponding one of the pair of substrates. The sealant is disposed between the pair of substrates. The heating unit is disposed on one of the pair of substrates and comprising a first portion disposed in the peripheral area of the one of the pair of substrates and adjacent to an edge of the one of the pair of substrates, a third portion disposed in the active area, and a second portion connecting the first portion and the third portion. The resistance of the first portion is less than a resistance of the third portion. Therefore, the electronic device may have improved heating efficiency.

公开(公告)号：US11342657B2

公开(公告)日：2022-05-24

申请号：US16932862

申请日：2020-07-20

Applicant: Innolux Corporation

Inventor： Yi Hung Lin ,  Chung-Kuang Wei ,  Tang Chin Hung ,  I-Yin Li ,  Chia-Chi Ho

IPC: H01Q1/38 ,  H01Q1/40

Abstract: An antenna device is provided, including a first substrate, a first conductive element, a second substrate, a second conductive element, and an insulating layer. The first conductive element is disposed on the first substrate to define, on the first substrate, a recessed region adjacent to the first conductive element. The second substrate faces the first substrate. The second conductive element is disposed on the second substrate and located between the first substrate and the second substrate. The insulating layer is disposed between the first substrate and the second substrate. In a top view of the antenna device, the second conductive element overlaps the first conductive element and the recessed region, and the insulating layer at least partially overlaps the recessed region.

公开(公告)号：US11217884B2

公开(公告)日：2022-01-04

申请号：US16904646

申请日：2020-06-18

Applicant: InnoLux Corporation

Inventor： Hang-Lang Lee ,  I-Yin Li ,  Tang-Chin Hung ,  Pei-Chi Chen

IPC: H01Q1/38 ,  H03C7/02

Abstract: A radiation device includes: a first substrate; a second substrate; a dielectric layer disposed between the first substrate and the second substrate; and a film layer structure disposed on the first substrate. The resistivity of the film layer structure is between 108 and 5×1014 Ω-cm. Therefore, frequency modulation range of radiation signals of the radiation device can be increased.

公开(公告)号：US11133580B2

公开(公告)日：2021-09-28

申请号：US15788888

申请日：2017-10-20

Applicant: InnoLux Corporation

Inventor： I-Yin Li ,  Yi-Hung Lin ,  Chin-Lung Ting ,  Tang-Chin Hung ,  Jeng-Nan Lin

IPC: H01Q1/00 ,  H01Q1/36 ,  H01Q9/04 ,  H01Q13/10 ,  H01Q3/44 ,  H01Q21/00 ,  G02F1/1339

Abstract: An antenna device is provided, which includes a first substrate, and a second substrate facing and spaced with the first substrate in a distance. At least one working element disposed between the first substrate and the second substrate, wherein the at least one working element is filled with a modulation material. At least one buffer element is connected with the at least one working element for adjusting the amount of the modulation material in the at least one working element.