公开(公告)号：US20220094385A1

公开(公告)日：2022-03-24

申请号：US17030832

申请日：2020-09-24

Applicant: Intel Corporation

Inventor： Ofir DEGANI ,  Gil HOROVITZ ,  Evgeny SHUMAKER ,  Sergey BERSHANSKY ,  Aryeh FARBER ,  Igor GERTMAN ,  Run LEVINGER

IPC: H04B1/40

Abstract: An apparatus for generating an output oscillator signal is provided. The apparatus includes a deviation determining circuitry configured to generate a deviation signal based on a first comparison signal and a second comparison signal. Further, the apparatus includes a first oscillator configured to generate the output oscillator signal based on the deviation signal and a second oscillator signal from a second, resonator-based oscillator. The first comparison signal is based on the second oscillator signal or the output oscillator signal. The second oscillator signal has a frequency of at least 1 GHz. The second comparison signal is based on a third oscillator signal from a third oscillator. The third oscillator signal has a frequency lower than 1 GHz.

公开(公告)号：US20220084965A1

公开(公告)日：2022-03-17

申请号：US17528049

申请日：2021-11-16

Applicant: Intel Corporation

Inventor： Aleksandar ALEKSOV ,  Telesphor KAMGAING ,  Sri Ranga Sai BOYAPATI ,  Kristof DARMAWIKARTA ,  Eyal FAYNEH ,  Ofir DEGANI ,  David LEVY ,  Johanna M. SWAN

IPC: H01L23/66 ,  H01L21/48 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

Abstract: In-package radio frequency (RF) waveguides as high bandwidth chip-to-chip interconnects and methods for using the same are disclosed. In one example, an electronic package includes a package substrate, first and second silicon dies or tiles, and an RF waveguide. The first and second silicon dies or tiles are attached to the package substrate. The RF waveguide is formed in the package substrate and interconnects the first silicon die or tile with the second silicon die or tile.

公开(公告)号：US20230308193A1

公开(公告)日：2023-09-28

申请号：US18041804

申请日：2020-09-25

Applicant: Intel Corporation

Inventor： Rotem BANIN ,  Ofir DEGANI ,  Shahar GROSS ,  Run LEVINGER ,  Eytan MANN ,  Ashoke RAVI ,  Ehud RESHEF ,  Amir RUBIN ,  Eran SEGEV ,  Evgeny SHUMAKER

IPC: H04B17/14 ,  H04W56/00

CPC classification number: H04B17/14 ,  H04W56/0015

Abstract: In various aspects of this disclosure, a communication device is provided. The communication device may include a first radiohead circuit including a first transceiver chain configured to transmit a first radio frequency signal associated with a first transmission configuration and to transmit a second radio frequency signal associated with a second transmission configuration a second radiohead circuit comprising a second transceiver chain configured to receive the first radio frequency signal and the second radio frequency signal, and one or more processors configured to determine a first signal parameter associated with the first radio frequency signal received at the second transceiver chain and a second signal parameter associated with the second radio frequency signal received at the second transceiver chain, and to determine a preferred transmission configuration for the first transceiver chain by using the first signal parameter and the second signal parameter.

公开(公告)号：US20230216409A1

公开(公告)日：2023-07-06

申请号：US17999856

申请日：2020-06-26

Applicant: Intel Corporation

Inventor： Ashoke RAVI ,  Ofir DEGANI ,  Harish KRISHNAMURTHY ,  Shahar WOLF ,  Sally AMIN ,  Suhwan KIM

IPC: H02M3/158 ,  H02M1/00

CPC classification number: H02M3/1582 ,  H02M1/007 ,  H02M1/0025 ,  H02M1/0045

Abstract: A single inductor multiple output DC-to-DC converter may be configured as a buck-boost converter. The converter may include an inductor, a plurality of switches coupled to the inductor to control energizing and deenergizing phases of the inductor, and a plurality of output rails. Each of the plurality of output rails may include at least one switch, which is configured to connect the output rail to the inductor of the buck-boost converter. Depending on the energizing and deenergizing patterns of the inductor, and the state of the one or more switches, the various output rails may be supplied with a plurality of different output voltages and / or output currents. Any of a plurality of regulating strategies may be utilized to further control the output voltages and / or the output currents.

公开(公告)号：US20230209284A1

公开(公告)日：2023-06-29

申请号：US17560319

申请日：2021-12-23

Applicant: Intel Corporation

Inventor： Oren HAGGAI ,  Arnaud PIERRES ,  Ofir DEGANI ,  David BIRNBAUM ,  Amy CHEN ,  Revital ALMAGOR ,  Darryl ADAMS

IPC: H04R25/00 ,  H04R1/08 ,  G06F3/16

CPC classification number: H04R25/554 ,  H04R25/505 ,  H04R1/08 ,  G06F3/165

Abstract: A communication device is provided. The communication device may include a wireless communication terminal and/or terminal interface, at least one processor configured to receive a signal representing an audio signal from the wireless communication terminal and/or terminal interface, and a storage element coupled to the processor having a personal audibility feature (PAF) file stored therein, the PAF file including a personal audibility feature of a predetermined user, wherein the processor is further configured to modify the signal according to the PAF file and to provide another signal representing an audio stream based on the modified signal to the wireless communication terminal.

公开(公告)号：US20220278690A1

公开(公告)日：2022-09-01

申请号：US17355217

申请日：2021-06-23

Applicant: Intel Corporation

Inventor： Evgeny SHUMAKER ,  Elan BANIN ,  Ofir DEGANI ,  Gil HOROVITZ

IPC: H03L7/24 ,  H03L7/099 ,  H03L7/085 ,  G04F10/00

Abstract: A TDC circuit configured to receive a reference clock (REF) signal and a signal derived from a LO; generate a plurality of digital values indicative of a measured phase difference between the signal derived from the LO and the REF signal, wherein each of the plurality of digital values are determined from a unique set of a plurality of sets of TDC measurement component quantization levels; generate a combined series of quantization levels based on a combination of the plurality of sets of TDC measurement component quantization levels; and determine a combined digital value from the combined series of quantization levels and at least one of the plurality of digital values to generate an output of the TDC circuit. The combined series of quantization levels may be generated by summing simultaneously occurring levels of each of the plurality of sets of TDC measurement component quantization levels together.

公开(公告)号：US20220200782A1

公开(公告)日：2022-06-23

申请号：US17481357

申请日：2021-09-22

Applicant: Intel Corporation

Inventor： Elan BANIN ,  Evgeny SHUMAKER ,  Ofir DEGANI ,  Rotem BANIN ,  Shahar GROSS

IPC: H04L7/033 ,  H04L27/22 ,  H04L27/152

Abstract: A wireless communication device for asymmetrical frequency spreading including a processor configured to receive a frequency band message comprising a maximum difference and a minimum difference, wherein the maximum difference is between a maximum frequency of a sub-band and a signal frequency, and wherein the minimum difference is between the minimum frequency of the sub-band and the signal frequency compare the maximum difference and the minimum difference with each other; and generate a frequency shift based on the comparison.

公开(公告)号：US20210199511A1

公开(公告)日：2021-07-01

申请号：US16727966

申请日：2019-12-27

Applicant: Intel Corporation

Inventor： Omer SHOLEV ,  Elan BANIN ,  Ofir DEGANI ,  Assaf BEN-BASSAT

IPC: G01K7/00 ,  H04B1/04

Abstract: A device may comprise: a storage for storing a reference output representing an output of an electrical circuit at a reference temperature; one or more processors, configured to: determine a temperature shift based on a comparison of an output of the electrical circuit sensed at a sensing temperature and the reference output; determine a plurality of coefficients of a model of the temperature shift, wherein the model implements one or more functions that associate the plurality of coefficients and a temperature with the temperature shift at the temperature.