公开(公告)号：US07364975B2

公开(公告)日：2008-04-29

申请号：US11490301

申请日：2006-07-20

申请人： Marcus Culmsee ,  Frank Weber ,  Josef Maynollo

发明人： Marcus Culmsee ,  Frank Weber ,  Josef Maynollo

IPC分类号： H01L21/336 ,  H01L21/76 ,  H01L21/8238

CPC分类号： H01L21/76229

摘要： Methods of fabricating semiconductor devices are disclosed. In a preferred embodiment, a method of fabricating a semiconductor device includes providing a workpiece including a plurality of active area regions defined therein, and forming at least one trench in the workpiece between at least two of the plurality of active area regions. A first insulating material is deposited over the plurality of active area regions and the at least one trench, partially filling the at least one trench with the first insulating material and forming peaks of the first insulating material over the plurality of active area regions. A masking material is formed over the first insulating material in the at least one trench, leaving the peaks of the first insulating material over the plurality of active area regions completely exposed. At least the peaks of the first insulating material are removed from over the plurality of active area regions.

公开(公告)号：US07208968B2

公开(公告)日：2007-04-24

申请号：US10865050

申请日：2004-06-10

申请人： Frank Weber ,  Gerd Frankowsky

发明人： Frank Weber ,  Gerd Frankowsky

IPC分类号： G01R31/26

CPC分类号： G01R31/2863 ,  G01R31/2889

摘要： Test system for testing integrated chips and an adapter element for a test system. One embodiment provides a test system for testing integrated chips in a burn-in test operation, the integrated chips to be tested being arranged in groups on a burn-in board, the burn-in board having a first connecting device in order to connect the burn-in board to a tester device, the tester device comprising a test module with a test circuit in order to test chips on the burn-in board in accordance with the burn-in test operation, the test module having a second connecting device in order to connect the burn-in board to the test module via the second connecting device, a plurality of test modules being provided, the second connecting devices of which can be contact-connected to a plurality of third connecting devices of an adapter element, the adapter element having a fourth connecting device for contact-connection of the first connecting device of the burn-in board, the third connecting devices of the adapter element being connected to the fourth connecting device in such a way that, in the contact-connected state, it is possible to test each integrated circuit of a group with one of the test modules.

摘要翻译： 用于测试集成芯片的测试系统和用于测试系统的适配器元件。 一个实施例提供了一种用于在老化测试操作中测试集成芯片的测试系统，待测试的集成芯片分组放置在老化板上，该老化板具有第一连接设备，以便连接 所述测试装置包括具有测试电路的测试模块，以便根据所述老化测试操作在所述老化板上测试芯片，所述测试模块具有第二连接装置， 为了通过第二连接装置将老化板连接到测试模块，提供了多个测试模块，其中第二连接装置可以与适配器元件的多个第三连接装置接触连接， 适配器元件具有用于接合连接老化板的第一连接装置的第四连接装置，适配器元件的第三连接装置以这样的方式连接到第四连接装置 在接触连接状态下，可以用一个测试模块来测试组中的每个集成电路。

公开(公告)号：US07163900B2

公开(公告)日：2007-01-16

申请号：US10978540

申请日：2004-11-01

申请人： Frank Weber

发明人： Frank Weber

IPC分类号： H01L21/469

CPC分类号： C23C16/56 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02271 ,  H01L21/02304 ,  H01L21/02318 ,  H01L21/31058 ,  H01L21/31116 ,  H01L21/31695

摘要： In preferred embodiments, a polydentate pore-sealing ligand is used to seal or repair pores damaged by plasma processing. The polydentate ligand includes bidentate ligands corresponding to the general formula X—CH2—(CH2)n—CH2—X or X—Si(CH3)2—(CH2)n—Si(CH3)2—X. The polydentate ligand also includes tridendate ligands corresponding to the general formula X—CH2—(CH2)m(CXH)(CH2)o—CH2—X or X—Si(CH3)2—(CH2)m(CXH)(CH2)o—Si(CH3)2—X. Alternative embodiments may include single or multiply branched polydentate ligands. Other embodiments include ligands that are cross-linked after attachment to the dielectric. Still other embodiments include a derivatization reaction wherein silanol groups formed by plasma damage are removed and favorable dielectric properties are restored.

摘要翻译： 在优选的实施方案中，多齿孔密封配体用于密封或修复由等离子体处理损坏的孔。 多齿配体包括对应于通式X-CH 2 - （CH 2）n - CH 2 - 的二齿配体， SUB或-X-Si（CH 3）2 - （CH 2）n -Si（CH 3） CH 3）2 -X。 多齿配体还包括对应于通式X-CH 2 - （CH 2）m（CXH）（CH 2个-X或X-Si（CH 3 3）2 - - - - - - - - （CH 2 CH 2）m（CXH）（CH 2）2 -Si（CH 3） 2 2。 替代实施方案可以包括单支或多支支链多齿配体。 其它实施方案包括在附着到电介质之后交联的配体。 其它实施方案包括衍生化反应，其中除去由等离子体损伤形成的硅烷醇基团并恢复良好的介电性能。

公开(公告)号：US06773934B2

公开(公告)日：2004-08-10

申请号：US10105590

申请日：2002-03-25

申请人： Jens Möckel ,  Gerrit Färber ,  Martin Fritz ,  Frank Weber ,  Michael Hübner

发明人： Jens Möckel ,  Gerrit Färber ,  Martin Fritz ,  Frank Weber ,  Michael Hübner

IPC分类号： H01L2166

CPC分类号： G01R31/043 ,  G01R1/06794 ,  G01R31/2886 ,  G01R31/312

摘要： A method for releasable contact-connection of a plurality of integrated semiconductor modules on a wafer, each of which having a plurality of interconnected supply voltage terminals, includes the steps of providing a contacting card for applying external electrical signals to the semiconductor modules with contact elements for releasable electrical connection to terminal pads of the semiconductor modules, aligning the contacting card with the wafer, producing a releasable contact between terminal pads of the plurality of semiconductor modules and the contact elements of the contacting card, checking the contact quality for each of the semiconductor modules by applying a voltage to at least one of the supply voltage terminals of the semiconductor module through the contacting card, measuring the voltage present at a further one of the supply voltage terminals through the contacting card, and using the measurement result to assess whether or not the semiconductor module has correct contact.

摘要翻译： 一种用于在晶片上的多个集成半导体模块的可释放接触连接的方法，每个半导体模块具有多个互连的电源电压端子，包括以下步骤：提供接触卡，用于将外部电信号施加到具有接触元件的半导体模块 为了可释放地连接到半导体模块的端子焊盘，将接触卡与晶片对准，在多个半导体模块的端子焊盘和接触卡的接触元件之间产生可释放的接触，检查每个半导体模块的接触质量 半导体模块，通过接触卡将电压施加到半导体模块的至少一个电源电压端子，通过接触卡测量另一个电源电压端子上存在的电压，并使用测量结果来评估是否 或者不是半导体模块具有正确的含义 ct。

公开(公告)号：US09180957B2

公开(公告)日：2015-11-10

申请号：US12983629

申请日：2011-01-03

申请人： Frank Weber ,  Olaf Schoenfeldt

发明人： Frank Weber ,  Olaf Schoenfeldt

IPC分类号： B64C1/00 ,  B23P11/00 ,  B25B27/14 ,  B23Q3/00 ,  B64C1/10 ,  B21J15/14 ,  B64C1/06 ,  B64F5/00

CPC分类号： B64C1/10 ,  B21J15/14 ,  B23P2700/01 ,  B64C1/068 ,  B64C1/069 ,  B64C2001/0072 ,  B64F5/10 ,  Y02T50/43 ,  Y10T29/49826 ,  Y10T29/49895 ,  Y10T29/49966 ,  Y10T29/53417 ,  Y10T29/53913 ,  Y10T29/53961 ,  Y10T29/53974

摘要： A method and an apparatus for carrying out the method for installing an especially dome-shaped pressure bulkhead on a one-piece, substantially conical rear section for an aircraft, wherein said rear section includes a connection area and an end area. The method involves the steps of horizontally accommodating a prefabricated rear section in a horizontal support; inserting the rear section into a pivoting frame; pivoting the rear section into a vertical position using the pivoting frame, wherein the connection area of the rear section points upward; horizontally placing and centering the pressure bulkhead on the connection area, and joining the pressure bulkhead with the rear section in the area of the connection area.

摘要翻译： 一种用于执行用于在飞行器的一体式，大致圆锥形的后部上安装特别是圆顶形的压力舱壁的方法和装置，其中所述后部分包括连接区域和端部区域。 该方法包括将预制后部水平地容纳在水平支撑件中的步骤; 将后部插入到枢转框架中; 使用所述枢转框架将所述后部部分转动到垂直位置，其中所述后部分的连接区域向上指向; 将压力舱壁水平放置和对中在连接区域上，并将压力隔板与连接区域的后部区段接合。

公开(公告)号：US08735076B2

公开(公告)日：2014-05-27

申请号：US13418310

申请日：2012-03-12

申请人： Charis Eng ,  Frank Weber

发明人： Charis Eng ,  Frank Weber

IPC分类号： C12Q1/68

CPC分类号： C12Q1/68 ,  C12Q1/6886 ,  C12Q2600/112 ,  C12Q2600/136 ,  C12Q2600/16 ,  C12Q2600/172 ,  C12Q2600/178

摘要： Provided herein are targets that can be used for the diagnosis, prognosis and therapy of a variety of cancers.

摘要翻译： 本文提供了可用于各种癌症的诊断，预后和治疗的靶标。

公开(公告)号：US08275184B2

公开(公告)日：2012-09-25

申请号：US12785282

申请日：2010-05-21

申请人： Sascha Schneider ,  Frank Weber

发明人： Sascha Schneider ,  Frank Weber

IPC分类号： G06K9/00

CPC分类号： A61C8/0001 ,  A61C9/0053 ,  A61C13/0004

摘要： A measuring body for an implant, having a measuring geometry that can be captured by a measuring camera and a connection geometry on the implant. Said measuring geometry is arranged on a test part and the connection geometry is arranged on a bearing part, both parts being embodied as separate components. Said bearing part comprises a bearing for the test part and the test part comprises a counter bearing to the bearing and the measuring geometry is provided on a free end of the test part. Also provided is a method for capturing a 3D-measurement drawing of a measuring body that is arranged on an implant.

摘要翻译： 用于植入物的测量体，其具有可由测量相机捕获的测量几何形状和植入物上的连接几何形状。 所述测量几何布置在测试部件上，并且连接几何形状布置在轴承部件上，两个部件被实施为单独的部件。 所述轴承部分包括用于测试部件的轴承，并且测试部件包括对轴承的反向轴承，并且测量几何形状设置在测试部件的自由端上。 还提供了一种用于捕获布置在植入物上的测量体的3D测量图的方法。

公开(公告)号：US20110180440A1

公开(公告)日：2011-07-28

申请号：US13080543

申请日：2011-04-05

申请人： Frank Weber

发明人： Frank Weber

IPC分类号： B65D85/00 ,  F16B1/00

CPC分类号： G07F11/62 ,  G07F17/0092 ,  Y10T403/20

摘要： A method and apparatus for controlling removal of one or more receptacles from a receptacle tray are described herein, in which a removal indicator indicates which of the one or more receptacles to remove. Thereafter, the indicated one or more receptacles may be manually removed from the receptacle tray using a gripping mechanism. The receptacles are secured in the tray with two or more tangs protruding from a front face of the receptacle closest to a connector interface. The two or more tangs fit into respective mating units in the receptacle tray, and one or more protrusions toward the rear of the receptacle, with respect to the two or more tangs, mate with respective mating units in the receptacle tray.

摘要翻译： 本文描述了用于控制从容器托盘移除一个或多个容器的方法和装置，其中移除指示器指示要移除的一个或多个容器中的哪一个。 此后，可以使用夹紧机构将指示的一个或多个插座从插座托盘手动移除。 容器被固定在托盘中，两个或多个柄脚从最靠近连接器接口的插座的前面突出。 这两个或两个以上的柄脚装配到插座托盘中的相应的配合单元中，并且相对于两个或更多个柄脚，朝向插座后部的一个或多个突起与插座托盘中的相应匹配单元配合。

公开(公告)号：US20110179626A1

公开(公告)日：2011-07-28

申请号：US12983629

申请日：2011-01-03

申请人： Frank Weber ,  Olaf Schoenfeldt

发明人： Frank Weber ,  Olaf Schoenfeldt

IPC分类号： B23P23/04 ,  B23P11/00

CPC分类号： B64C1/10 ,  B21J15/14 ,  B23P2700/01 ,  B64C1/068 ,  B64C1/069 ,  B64C2001/0072 ,  B64F5/10 ,  Y02T50/43 ,  Y10T29/49826 ,  Y10T29/49895 ,  Y10T29/49966 ,  Y10T29/53417 ,  Y10T29/53913 ,  Y10T29/53961 ,  Y10T29/53974

摘要： The invention relates to a method for installing an especially dome-shaped pressure bulkhead on a one-piece, substantially conical rear section for an aircraft, wherein said rear section comprises a connection area and an end area, comprising the steps: a) horizontally accommodating a prefabricated rear section in a horizontal support, b) inserting the rear section into a pivoting frame, c) pivoting the rear section into a vertical position using the pivoting frame, wherein the connection area of the rear section points upward, d) horizontally placing and centering the pressure bulkhead on the connection area, and e) joining of the pressure bulkhead with the rear section in the area of the connection area. The invention further relates to an apparatus for carrying out the method using a pivoting frame for tilting the rear section into a vertical position for installing the pressure bulkhead.

摘要翻译： 本发明涉及一种用于在飞行器的一体式，基本上圆锥形的后部上安装特别是圆顶形的压力舱壁的方法，其中所述后部包括连接区域和端部区域，其包括以下步骤：a）水平容纳 在水平支撑件中的预制后部，b）将所述后部部分插入到枢转框架中，c）使用所述枢转框架将所述后部部分枢转到垂直位置，其中所述后部的连接区域向上指向，d）水平放置 并且将压力隔板对中在连接区域上，以及e）在连接区域的区域中将压力隔板与后部部分接合。 本发明还涉及一种用于执行使用枢转框架的方法的装置，所述枢转框架用于将后部部分倾斜成用于安装压力舱壁的垂直位置。

公开(公告)号：US20100296710A1

公开(公告)日：2010-11-25

申请号：US12785282

申请日：2010-05-21

申请人： Sascha Schneider ,  Frank Weber

发明人： Sascha Schneider ,  Frank Weber

IPC分类号： G06K9/00 ,  A61C19/04

CPC分类号： A61C8/0001 ,  A61C9/0053 ,  A61C13/0004

摘要： A measuring body for an implant, having a measuring geometry that can be captured by a measuring camera and a connection geometry on the implant. Said measuring geometry is arranged on a test part and the connection geometry is arranged on a bearing part, both parts being embodied as separate components. Said bearing part comprises a bearing for the test part and the test part comprises a counter bearing to the bearing and the measuring geometry is provided on a free end of the test part. Also provided is a method for capturing a 3D-measurement drawing of a measuring body that is arranged on an implant.

摘要翻译： 用于植入物的测量体，其具有可由测量相机捕获的测量几何形状和植入物上的连接几何形状。 所述测量几何布置在测试部件上，并且连接几何形状布置在轴承部件上，两个部件被实施为单独的部件。 所述轴承部分包括用于测试部件的轴承，并且测试部件包括对轴承的反向轴承，并且测量几何形状设置在测试部件的自由端上。 还提供了一种用于捕获布置在植入物上的测量体的3D测量图的方法。