Integration manufacturing process for MEMS device
    21.
    发明授权
    Integration manufacturing process for MEMS device 有权
    MEMS器件集成制造工艺

    公开(公告)号:US08030111B2

    公开(公告)日:2011-10-04

    申请号:US12326355

    申请日:2008-12-02

    IPC分类号: H01L21/00

    摘要: A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a connecting area and an actuating area respectively located thereon, c) forming plural microstructures in the actuating area, d) mounting a conducting element in the connecting area and the actuating area, e) forming an insulating layer on the conducting element and f) connecting the first substrate to the connecting area to form the MEMS device. The concavity contains the plural microstructures.

    摘要翻译: 提供了一种用于制造MEMS器件的方法。 该方法包括以下步骤:a)提供具有位于其上的凹面的第一基底,b)提供具有分别位于其上的连接区域和致动区域的第二基底,c)在致动区域中形成多个微结构,d) 在所述连接区域和所述致动区域中的元件,e)在所述导电元件上形成绝缘层,以及f)将所述第一基板连接到所述连接区域以形成所述MEMS器件。 凹面包含多个微结构。

    METHOD OF MANUFACTURING OPTICAL COMPONENTS
    22.
    发明申请
    METHOD OF MANUFACTURING OPTICAL COMPONENTS 有权
    制造光学元件的方法

    公开(公告)号:US20090194892A1

    公开(公告)日:2009-08-06

    申请号:US12357039

    申请日:2009-01-21

    IPC分类号: B29D11/00

    摘要: A method of manufacturing an optical component is provided. The method comprises steps of providing a first liquid; providing a fluid, disposed above the first liquid, wherein an interface exists between the first liquid and the fluid; providing a polymer precursor at the interface; and solidifying the polymer precursor so as to form the optical component made by a polymer.

    摘要翻译: 提供了一种制造光学部件的方法。 该方法包括提供第一液体的步骤; 提供设置在所述第一液体上方的流体,其中在所述第一液体和所述流体之间存在界面; 在界面处提供聚合物前体; 并固化聚合物前体以形成由聚合物制成的光学部件。

    METHOD FOR FABRICATING VARIABLE PARALLEL PLATE CAPACITORS
    23.
    发明申请
    METHOD FOR FABRICATING VARIABLE PARALLEL PLATE CAPACITORS 有权
    制造可变平行平板电容器的方法

    公开(公告)号:US20090101622A1

    公开(公告)日:2009-04-23

    申请号:US11944317

    申请日:2007-11-21

    IPC分类号: H01B13/00

    摘要: A method for fabricating micromachined structures is provided. A structure including a dielectric layer, a metal layer and a passivation layer is formed, wherein the dielectric layer has a via thereon. An etching window is formed on the passivation layer. An etching solution is poured into the via through the etching window to perform a process of etching. After etching, the etching solution is removed and the passivation layer is removed. Finally, the structure is etched again to form the micromachined structure.

    摘要翻译: 提供了一种制造微加工结构的方法。 形成包括电介质层,金属层和钝化层的结构,其中介电层在其上具有通孔。 在钝化层上形成蚀刻窗口。 将蚀刻溶液通过蚀刻窗口注入到通孔中以进行蚀刻处理。 蚀刻后,除去蚀刻溶液,除去钝化层。 最后,再次蚀刻结构以形成微加工结构。

    Actuating mechanism for rotating micro-mirror
    25.
    发明授权
    Actuating mechanism for rotating micro-mirror 有权
    旋转微镜的启动机构

    公开(公告)号:US06359718B1

    公开(公告)日:2002-03-19

    申请号:US09838061

    申请日:2001-04-18

    IPC分类号: G02B2608

    CPC分类号: G02B26/0841

    摘要: An actuating mechanism for rotating a micro-mirror is disclosed. The actuating mechanism includes a first linking rod consisting of a first and a second portions, a second linking rod consisting of a third and a fourth portions, a first fulcrum positioned between the first and second portions, and a second fulcrum positioned at one side of the fourth portion opposite to the third portion. The first and third portions are flexibly connected to a shaft that the micro-mirror rotates with, and the second and fourth portions are coupled to respective actuators. When actuating forces are applied to move the second and fourth portions, the first and third portions are levered to rotate the shaft and thus the micro-mirror due to the effect of the fulcrums.

    摘要翻译: 公开了一种用于旋转微反射镜的致动机构。 致动机构包括由第一和第二部分组成的第一连接杆,由第三和第四部分组成的第二连杆,位于第一和第二部分之间的第一支点和位于第一和第二部分之间的第二支点 第四部分与第三部分相对。 第一和第三部分柔性地连接到微反射镜旋转的轴上,第二和第四部分联接到相应的致动器。 当施加致动力以移动第二和第四部分时,由于支点的作用,使第一和第三部分被转动以使轴转动,从而使微反射镜旋转。

    Micromachined structures
    26.
    发明授权
    Micromachined structures 有权
    微加工结构

    公开(公告)号:US09070699B2

    公开(公告)日:2015-06-30

    申请号:US13343187

    申请日:2012-01-04

    IPC分类号: H01L21/00 H01L49/02 H01L29/84

    摘要: A micromachined structure includes a substrate and a suspended structure. The substrate has a cavity formed thereon. The suspended structure is formed on the cavity of the substrate. The suspended structure includes a first metal layer, a second metal layer, and a first dielectric layer positioned between the first and second metal layers, wherein the first dielectric layer has a first opening in communication with the cavity through an opening formed in the first metal layer.

    摘要翻译: 微加工结构包括基底和悬挂结构。 基板具有形成在其上的空腔。 悬浮结构形成在基板的空腔上。 悬浮结构包括第一金属层,第二金属层和位于第一和第二金属层之间的第一介电层,其中第一介电层具有通过形成在第一金属中的开口与空腔连通的第一开口 层。

    Method for fabricating variable parallel plate capacitors
    28.
    发明授权
    Method for fabricating variable parallel plate capacitors 有权
    可变平行板电容器的制造方法

    公开(公告)号:US08105498B2

    公开(公告)日:2012-01-31

    申请号:US11944317

    申请日:2007-11-21

    IPC分类号: B44C1/22

    摘要: A method for fabricating micromachined structures is provided. A structure including a dielectric layer, a metal layer and a passivation layer is formed, wherein the dielectric layer has a via thereon. An etching window is formed on the passivation layer. An etching solution is poured into the via through the etching window to perform a process of etching. After etching, the etching solution is removed and the passivation layer is removed. Finally, the structure is etched again to form the micromachined structure.

    摘要翻译: 提供了一种制造微加工结构的方法。 形成包括电介质层,金属层和钝化层的结构,其中介电层在其上具有通孔。 在钝化层上形成蚀刻窗口。 将蚀刻溶液通过蚀刻窗口注入到通孔中以进行蚀刻处理。 蚀刻后,除去蚀刻溶液,除去钝化层。 最后,再次蚀刻结构以形成微加工结构。

    3-Axis Accelerometer With Gap-Closing Capacitive Electrodes
    29.
    发明申请
    3-Axis Accelerometer With Gap-Closing Capacitive Electrodes 有权
    具有间隙闭合电容电极的3轴加速度计

    公开(公告)号:US20100212425A1

    公开(公告)日:2010-08-26

    申请号:US12556433

    申请日:2009-09-09

    IPC分类号: G01P15/125

    摘要: Disclosed is a novel three-axis capacitive-type accelerometer implemented on SOI wafer. The accelerometer consists of four springs, one proof mass, four pairs of gap-closing sensing electrodes (each pair of gap-closing sensing electrode containing one movable electrode and one stationary electrode), and several metal-vias as the electrical interconnections. The movable electrodes are on the proof mass, whereas the stationary electrodes are fixed to the substrate. The three-axis accelerometer has five merits. (1) The sensitivity of the accelerometer is improved since the proof-mass is increased by containing both device and handling silicon layers; (2) The sensitivity is also improved by the gap-closing differential capacitive sensing electrodes design; (3) The parasitic capacitance at bond pad is reduced by the existing of metal-vias between the device Si layer and handling Si layer; (4) The sensing gap thickness is precisely defined by the buried oxide of SOI wafer; (5) The stationary sensing electrodes anchored to the substrate also act as the limit stops to protect the accelerometer.

    摘要翻译: 公开了一种在SOI晶片上实现的新型三轴电容式加速度计。 加速度计包括四个弹簧,一个检测质量块,四对间隙闭合感测电极(每对间隙闭合感测电极,包含一个可移动电极和一个固定电极)和几个金属通孔作为电互连。 可移动电极位于检测质量上,而固定电极固定在基板上。 三轴加速度计有五个优点。 (1)加速度传感器的灵敏度提高,因为通过容纳硅层和处理硅层来提高质量; (2)间隙闭合差分电容式感应电极的设计灵敏度也得到提高; (3)通过在器件Si层和处理Si层之间存在金属通孔来减小接合焊盘处的寄生电容; (4)传感间隙厚度由SOI晶片的埋入氧化物精确定义; (5)固定在基板上的固定感应电极也作为限位装置来保护加速度计。