公开(公告)号：US20120039093A1

公开(公告)日：2012-02-16

申请号：US13277773

申请日：2011-10-20

Applicant: Rais K. Miftakhutdinov ,  Lin Sheng ,  John R. Wiggenhorn ,  Jin Liang ,  Steven Tumasz

Inventor： Rais K. Miftakhutdinov ,  Lin Sheng ,  John R. Wiggenhorn ,  Jin Liang ,  Steven Tumasz

IPC: H02M3/335

CPC classification number: H02M1/32 ,  H02M3/33592 ,  H02M3/3378 ,  Y02B70/1475

Abstract: Various embodiments of the present invention provide voltage converters and methods for using such. As one example, a voltage converter is disclosed that includes a transformer with a first winding and a second winding. A voltage is applied to the first winding for a period that is followed by an OFF time. The voltage converter further includes an OFF time controller that is operable to adjust the OFF time based at least in part on a load current traversing the second winding.

Abstract translation: 本发明的各种实施例提供电压转换器及其使用方法。 作为一个示例，公开了一种电压转换器，其包括具有第一绕组和第二绕组的变压器。 在第一绕组上施加电压一段时间后的OFF时间。 电压转换器还包括OFF时间控制器，其可操作以至少部分地基于穿过第二绕组的负载电流来调节OFF时间。

公开(公告)号：US07416106B1

公开(公告)日：2008-08-26

申请号：US10674080

申请日：2003-09-29

Applicant: Stuart D. Downes ,  Jin Liang ,  Larry Norris

Inventor： Stuart D. Downes ,  Jin Liang ,  Larry Norris

IPC: B23K31/02

CPC classification number: B23K1/0016 ,  B23K2101/40 ,  B23K2101/42 ,  H05K1/111 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/099 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A technique for processing a circuit board involves placing a mask layer on the circuit board, where the mask layer defines a set of pad profiles for a component mounting location. Each pad profile has a set of rounded corners. The technique further involves forming, for each pad profile, a soldering pad having a set of radii corresponding to the set of rounded corners of that pad profile to create a set of soldering pads for the component mounting location. Each soldering pad is configured for a high bond strength solder joint. The technique further involves removing the mask layer from the circuit board and soldering a component to the component mounting location. This technique is well-suited for robustly mounting the component to the circuit board at solder joints with relatively high solder joint bond strengths.

Abstract translation: 一种用于处理电路板的技术包括将掩模层放置在电路板上，其中掩模层限定用于部件安装位置的一组焊盘轮廓。 每个垫子轮廓都有一组圆角。 该技术还涉及为每个焊盘型材形成具有与该焊盘型材的一组圆角对应的一组半径的焊盘，以形成用于部件安装位置的一组焊盘。 每个焊盘都配置为高粘结强度的焊点。 该技术还包括从电路板去除掩模层并将部件焊接到部件安装位置。 这种技术非常适合在具有相对高的焊点接合强度的焊点处牢固地将部件安装到电路板上。