Method of making multilayer electronic component
    22.
    发明申请
    Method of making multilayer electronic component 审中-公开
    制造多层电子元件的方法

    公开(公告)号:US20070227642A1

    公开(公告)日:2007-10-04

    申请号:US11723308

    申请日:2007-03-19

    IPC分类号: C03B29/00

    CPC分类号: H01G4/30 H01G4/12

    摘要: A method of making a multilayer electronic component which can further improve a withstand voltage characteristic is provided. In the method of making a multilayer capacitor in accordance with the present invention, a sheet multilayer body is formed in a multilayer body forming step by laminating a plurality of electrode sheets and blank sheets formed in a sheet forming step. The sheet multilayer body is fired in a firing step, whereby a multilayer capacitor is obtained. The sheet multilayer body includes one blank sheet interposed between the electrode sheets. Namely, two green sheets are interposed between electrode patterns of the electrode sheets, whereby the green sheet thickness is substantially increased. The inventors have newly found that increasing the green sheet thickness by making the sheet multilayer body have such a structure is effective in improving the withstand voltage characteristic.

    摘要翻译: 提供一种制造可以进一步提高耐压特性的多层电子部件的方法。 在制造本发明的多层电容器的方法中,通过层叠多个电极片和在片材形成步骤中形成的坯料,在多层体形成步骤中形成片状多层体。 在烧成工序中烧成片材多层体,得到层叠电容器。 片材多层体包括置于电极片之间的一块坯料片。 也就是说,在电极片的电极图案之间插入两个生片,由此生片厚度大大增加。 本发明人新发现通过使片状多层体具有这种结构来提高生片厚度对提高耐电压特性是有效的。

    Multilayer electronic device and the production method
    23.
    发明申请
    Multilayer electronic device and the production method 审中-公开
    多层电子器件及其制作方法

    公开(公告)号:US20070223177A1

    公开(公告)日:2007-09-27

    申请号:US11725483

    申请日:2007-03-20

    IPC分类号: H01G4/06

    摘要: A production method of a multilayer electronic device having an element body configured by alternately stacked dielectric layers and internal electrode layers: wherein a particle diameter α of conductive particles and a particle diameter β of co-material particles satisfies a relationship of α/β=0.8 to 8.0, and an adding quantity of the co-material particles to the conductive paste is larger than 30 wt % and smaller than 65 wt %.

    摘要翻译: 一种多层电子器件的制造方法,其具有由交替堆叠的电介质层和内部电极层构成的元件体,其中,导电粒子的粒径α和共同材料粒子的粒径β满足α/β= 0.8的关系 至8.0,辅助材料颗粒相对于导电糊的添加量大于30重量%且小于65重量%。

    Dielectric ceramic composition, electronic device, and multilayer ceramic capacitor
    24.
    发明申请
    Dielectric ceramic composition, electronic device, and multilayer ceramic capacitor 有权
    介电陶瓷组合物,电子器件和多层陶瓷电容器

    公开(公告)号:US20070149382A1

    公开(公告)日:2007-06-28

    申请号:US11593485

    申请日:2006-11-07

    IPC分类号: C04B35/468

    摘要: A dielectric ceramic composition including dielectric particles comprising a main ingredient phase having barium titanate as its main ingredient and a diffusion phase present at the periphery of said main ingredient phase, wherein when an average value of the depth where sub ingredient elements present at said diffusion phase diffuses from a surface of said diffusion phase toward a center of said dielectric particle is designated as an average diffusion depth, a dispersion of the average diffusion depth among the dielectric particles is, in terms of CV value, 5 to 30%. According to the present invention, an electronic device excellent in all of the dielectric constant, high temperature accelerated life, TC bias, and IR temperature dependency can be provided.

    摘要翻译: 1.一种电介质陶瓷组合物,其特征在于,包含以钛酸钡为主成分的主成分相和存在于所述主成分相周边的扩散相的电介质粒子,其中,当所述扩散相存在次成分元素的深度的平均值时, 从所述扩散相的表面朝向所述介电粒子的中心扩散为平均扩散深度,以CV值计,介电粒子的平均扩散深度的分散度为5〜30%。 根据本发明,可以提供所有介电常数,高温加速寿命,TC偏压和IR温度依赖性优异的电子器件。

    Ceramic electronic component and multilayer capacitor
    27.
    发明申请
    Ceramic electronic component and multilayer capacitor 有权
    陶瓷电子元器件和多层电容器

    公开(公告)号:US20060187613A1

    公开(公告)日:2006-08-24

    申请号:US11347296

    申请日:2006-02-06

    IPC分类号: H01G4/06

    CPC分类号: H01G4/2325

    摘要: A multilayer capacitor comprises a ceramic sintered body, an internal electrode disposed in the ceramic sintered body, and an external electrode disposed on an external surface of the ceramic sintered body. The external electrode has a first electrode layer formed on the external surface of the ceramic sintered body, a second electrode layer formed on the first electrode layer, and a conductive resin layer formed on the second electrode layer. The internal electrode and the first electrode layer consist primarily of a base metal. The second electrode layer consists primarily of a noble metal or a noble metal alloy. The conductive resin layer contains a noble metal or a noble metal alloy as a conductive material.

    摘要翻译: 多层电容器包括陶瓷烧结体,设置在陶瓷烧结体中的内部电极和设置在陶瓷烧结体的外表面上的外部电极。 外部电极具有形成在陶瓷烧结体的外表面上的第一电极层,形成在第一电极层上的第二电极层和形成在第二电极层上的导电树脂层。 内部电极和第一电极层主要由贱金属组成。 第二电极层主要由贵金属或贵金属合金构成。 导电性树脂层含有作为导电材料的贵金属或贵金属合金。

    Ceramic electronic component, manufacturing method of ceramic electronic component, and packaging method of ceramic electronic components
    28.
    发明授权
    Ceramic electronic component, manufacturing method of ceramic electronic component, and packaging method of ceramic electronic components 有权
    陶瓷电子部件,陶瓷电子部件的制造方法以及陶瓷电子部件的包装方法

    公开(公告)号:US08179225B2

    公开(公告)日:2012-05-15

    申请号:US12350528

    申请日:2009-01-08

    IPC分类号: H01C7/10 H01C1/012

    摘要: A ceramic electronic component has a chip element body having a conductor arranged inside, external electrodes, and a discrimination layer. The chip element body has first and second end faces facing each other, first and second side faces being perpendicular to the first and second end faces and facing each other, and third and fourth side faces being perpendicular to the first and second end faces and to the first and second side faces and facing each other. The external electrodes are formed on the first and second end faces, respectively, of the chip element body. The discrimination layer is provided on at least one side face out of the first side face and the second side face in the chip element body. The chip element body is comprised of a first ceramic. The discrimination layer is comprised of a second ceramic different from the first ceramic and has a color different from that of the third and fourth side faces.

    摘要翻译: 陶瓷电子部件具有芯片元件主体,其具有布置在内部的导体,外部电极和鉴别层。 芯片元件主体具有彼此相对的第一和第二端面,第一和第二侧面垂直于第一和第二端面并面对彼此,第三和第四侧面垂直于第一和第二端面,并且 第一和第二侧面并面对彼此。 外部电极分别形成在芯片元件主体的第一和第二端面上。 识别层设置在芯片元件主体中的第一侧面和第二侧面之外的至少一个侧面。 芯片元件主体由第一陶瓷构成。 识别层由不同于第一陶瓷的第二陶瓷构成,并且具有与第三和第四侧面不同的颜色。

    Ceramic electronic component
    30.
    发明授权
    Ceramic electronic component 有权
    陶瓷电子元件

    公开(公告)号:US07751176B2

    公开(公告)日:2010-07-06

    申请号:US12137810

    申请日:2008-06-12

    IPC分类号: H01G4/06

    CPC分类号: H01G4/1227 H01G4/30

    摘要: A ceramic electronic component includes a ceramic body and an internal electrode layers disposed within the ceramic body. The ceramic body is covered with a diffusion layer, wherein said diffusion layer is an oxide layer into which at least a part of elements contained in the ceramic body are diffused and is located closer to a surface of the ceramic body than an outermost internal electrode layer.

    摘要翻译: 陶瓷电子部件包括陶瓷体和设置在陶瓷体内的内部电极层。 陶瓷体覆盖有扩散层,其中所述扩散层是氧化物层,陶瓷体中包含的至少一部分元素扩散到其中,并且位于比最外部电极层更靠近陶瓷体的表面的位置 。