Abstract:
A dielectric ceramic composition comprising a compound expressed by a formula of ABO3, where “A” is Ba alone, or Ba and at least one selected from Ca and Sr, and “B” is Ti alone, or Ti and Zr, and having a perovskite-type crystal structure, and an oxide of a rare-earth element including Sc and Y. The dielectric ceramic composition includes a dielectric particle having a core-shell structure which has a core and a shell, the shell being present around the core and including at least “R” element, and in the shell, a region showing a maximum content rate of “R” element is a boundary region between the core and the shell.
Abstract:
A multilayer capacitor comprises a ceramic sintered body, an internal electrode disposed in the ceramic sintered body, and an external electrode disposed on an external surface of the ceramic sintered body. The external electrode has a first electrode layer formed on the external surface of the ceramic sintered body, a second electrode layer formed on the first electrode layer, and a conductive resin layer formed on the second electrode layer. The internal electrode and the first electrode layer consist primarily of a base metal. The second electrode layer consists primarily of a noble metal or a noble metal alloy. The conductive resin layer contains a noble metal or a noble metal alloy as a conductive material.
Abstract:
A thin-film EL device includes a lower electrode layer, a barrier layer containing a conductive inorganic compound, a lower insulating layer, a light emitting layer, and an upper electrode layer stacked in order on an electrically insulating substrate. An EL device of high display quality is established at a low cost by acquiring satisfactory light emitting properties without using an expensive high-melting point noble metal in the lower electrode layer and without increasing the thickness of the lower electrode layer, even when the lower insulating layer contains a lead base dielectric material.
Abstract:
A method of forming an external electrode of an electronic component involving: a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. A jig with a groove into which an element forming the electronic component can be inserted is prepared. A conductive paste is filled in the groove, and then removed, so as to leave the conductive paste along a first wall surface of the groove and remove the rest. Then, element immediately above the groove is located, and inserted into the groove and moved toward the first wall surface. Finally, the element is moved along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and moved away from the first wall surface so as to separate the ridgeline from the first wall surface.
Abstract:
A multilayer capacitor comprises a ceramic sintered body, an internal electrode disposed in the ceramic sintered body, and an external electrode disposed on an external surface of the ceramic sintered body. The external electrode has a first electrode layer formed on the external surface of the ceramic sintered body, a second electrode layer formed on the first electrode layer, and a conductive resin layer formed on the second electrode layer. The internal electrode and the first electrode layer consist primarily of a base metal. The second electrode layer consists primarily of a noble metal or a noble metal alloy. The conductive resin layer contains a noble metal or a noble metal alloy as a conductive material.
Abstract:
A method of forming an external electrode of an electronic component involves a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. The first step is to prepare a jig with a groove into which an element forming the electronic component can be inserted. The groove of the jig includes at least a first wall surface inclined outward in a direction from an interior toward an aperture. The paste preparation step is to fill a conductive paste in the groove. The removal step is to remove the filled conductive paste so as to leave the conductive paste along the first wall surface and remove the rest. The ealement preparation step is to locate the element immediately above the groove. The contact step is to insert the element into the groove and to move the element toward the first wall surface to bring a ridgeline of the element into contact with the first wall surface. The formation step is to move the element along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and to move the element away from the first wall surface so as to separate the ridgeline from the first wall surface.
Abstract:
An element forming an electronic component has a first face and a second face facing each other, and a third face adjacent to each of the first face and the second face. A method of forming an external electrode of the electronic component involves a pre-formation step, first to third formation steps, and an electrode formation step. The pre-formation step is to apply a conductive paste onto the third face and to evaporate at least a part of a liquid contained in the applied conductive paste, to form a precoat portion expected to become a part of a third electrode portion. The first formation step is to apply the conductive paste from a direction opposite to the first face, onto the first face to form a first electrode portion. The second formation step is to apply the conductive paste from a direction opposite to the second face, onto the second face to form a second electrode portion. The third formation step is to apply the conductive paste onto the third face so as to cover the precoat portion, to form the third electrode portion. The electrode formation step is to dry the element to form the external electrode consisting of the first electrode portion, the second electrode portion, and the third electrode portion. The first electrode portion, the second electrode portion, and the third electrode portion are formed so as to connect with each other.
Abstract:
The object of the present invention is to provide a flat-panel-display substrate which is high in heat resistance, of which the coefficient of thermal expansion is approximated to that of a thick film dielectric layer, which is low at high temperatures in reactivity with the lead-doped thick film dielectric layer, and which can be made to have a large area. The substrate of the present invention is obtained by sintering a body comprising glass powder and a filler made of metal and/or semi-metal oxide, and is constituted by the sintered body and whose average coefficient of linear thermal expansion is from 7 to 9.5 ppm/° C. in the temperature range of 25 to 700° C. The glass powder includes alkaline-earth oxide, 15 to 50% by weight of silicon oxide, and no greater than 2% by weight of boron oxide. Furthermore, the filler is at a concentration of 10 to 30% by volume of the total amount of the glass powder and the filler in the mould.
Abstract:
An optical recording medium (10) is adapted such that information is recorded by forming recording marks on a recording layer (12) that covers grooves (16) of an optical transparent substrate (14). In the recording layer (16), contiguously defined along a feed direction S of irradiation are virtual recording cells (40) which have a given unit length in the feed direction S of irradiation along the groove 16 and a given unit width in the direction orthogonal thereto. In addition, the groove width W is set so that 0.20×(&lgr;/NA)
Abstract:
A dielectric ceramic composition comprising a compound expressed by a formula of ABO3, where “A” is Ba alone, or Ba and at least one selected from Ca and Sr, and “B” is Ti alone, or Ti and Zr, and having a perovskite-type crystal structure, and an oxide of a rare-earth element including Sc and Y. The dielectric ceramic composition includes a dielectric particle having a core-shell structure which has a core and a shell, the shell being present around the core and including at least “R” element, and in the shell, a region showing a maximum content rate of “R” element is a boundary region between the core and the shell.