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公开(公告)号：US08323873B2
公开(公告)日：2012-12-04
申请号：US12966215
申请日：2010-12-13
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
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公开(公告)号：US08293453B2
公开(公告)日：2012-10-23
申请号：US12950398
申请日：2010-11-19
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
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23.发明授权Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part 有权感光性粘合剂组合物，使用该粘合剂组合物，粘合剂膜，粘合片，具有粘合剂层的半导体晶片，半导体器件和电子部件公开(公告)号：US08278024B2
公开(公告)日：2012-10-02
申请号：US12859720
申请日：2010-08-19
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要翻译： 一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。
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24.发明申请PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART 有权感光性粘合剂组合物，使用它们，粘合膜，粘合片，具有粘合层的半导体膜，半导体器件和电子部件公开(公告)号：US20110079927A1
公开(公告)日：2011-04-07
申请号：US12966215
申请日：2010-12-13
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要翻译： 一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。
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25.发明授权Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part 有权感光性粘合剂组合物，使用该粘合剂组合物，粘合剂膜，粘合片，具有粘合剂层的半导体晶片，半导体器件和电子部件公开(公告)号：US08673539B2
公开(公告)日：2014-03-18
申请号：US13672847
申请日：2012-11-09
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要翻译： 一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。
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26.发明授权Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part 有权感光性粘合剂组合物，使用该粘合剂组合物，粘合剂膜，粘合片，具有粘合剂层的半导体晶片，半导体器件和电子部件公开(公告)号：US08445177B2
公开(公告)日：2013-05-21
申请号：US12950353
申请日：2010-11-19
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要翻译： 一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。
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27.发明申请PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART 有权感光性粘合剂组合物，使用它们，粘合膜，粘合片，具有粘合层的半导体膜，半导体器件和电子部件公开(公告)号：US20100314783A1
公开(公告)日：2010-12-16
申请号：US12859720
申请日：2010-08-19
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要翻译： 一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。
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28.发明授权Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part 有权感光性粘合剂组合物，使用该粘合剂组合物，粘合剂膜，粘合片，具有粘合剂层的半导体晶片，半导体器件和电子部件公开(公告)号：US07851131B2
公开(公告)日：2010-12-14
申请号：US11969358
申请日：2008-01-04
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要翻译： 一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; （C）光聚合引发剂。
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29.发明申请METHOD FOR MANUFACTURING ADHESION BODY, METHOD FOR MANUFACTURING SUBSTRATE WITH ADHESIVE PATTERN, AND SUBSTRATE WITH ADHESIVE PATTERN 审中-公开用于制造粘合体的方法，用粘合剂图案制造基材的方法和具有粘合剂图案的基材公开(公告)号：US20120202015A1
公开(公告)日：2012-08-09
申请号：US13365311
申请日：2012-02-03
申请人： Aya IKEDA , Shinjiro Fujii , Takashi Kawamori , Takashi Masuko
发明人： Aya IKEDA , Shinjiro Fujii , Takashi Kawamori , Takashi Masuko
CPC分类号： C09J5/00 , C09J7/35 , C09J2201/28 , C09J2201/61 , C09J2479/086 , H01L21/6835 , H01L2924/10253 , Y10T428/24802
摘要： The method for manufacturing an adhesion body according to the present invention is a method for manufacturing an adhesion body in which a first adherend and a second adherend are bonded to each other via an adhesive pattern, comprising a step of providing an adhesive layer containing a thermosetting component on a first adherend; a step of forming an adhesive pattern by etching the adhesive layer in a state in which a protective layer for protecting a predetermined portion of the adhesive layer from etching is provided on a surface of the adhesive layer opposite to a surface in contact with the first adherend; and a step of bonding a second adherend to the adhesive pattern after the protective layer is removed.
摘要翻译： 根据本发明的粘合体的制造方法是通过粘合剂图案将第一被粘物和第二被粘物彼此接合的粘合体的制造方法，包括以下步骤：提供含有热固性 第一被粘物上的成分; 在与第一被粘物接触的表面相对的粘合剂层的表面上设置在用于保护粘合剂层的预定部分的保护层不被蚀刻的状态下通过蚀刻粘合剂层来形成粘合剂图案的步骤 ; 以及在除去保护层之后将第二被粘物粘接到粘合剂图案的步骤。
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公开(公告)号：US20090279394A1
公开(公告)日：2009-11-12
申请号：US12437503
申请日：2009-05-07
CPC分类号： G11B19/10 , G11B7/28 , G11B17/08 , G11B17/225 , G11B17/228
摘要： The effect of detection errors when detecting if a disc recording medium is in a disc drive is eliminated. A control unit 17 detects if an optical disc 11 was supplied to an optical disc drive 13 based on the operation of the transportation unit 16, causes the optical disc drive 13 to detect if an optical disc 11 is inside the disc drive, and compares the results of these detection operations. If the results do not match, the control unit 17 causes the optical disc drive 13 to repeat the operation discharging and loading the optical disc 11, and causes the optical disc drive 13 to again detect if an optical disc 11 is present after the discharge and loading operation. The control unit 17 then determines if the new detection result from the optical disc drive 13 and the detection result related to supplying the optical disc 11 to the optical disc drive 13 match, and based on the result of this evaluation detects an optical disc drive 13 operating error.
摘要翻译： 检测盘记录介质是否在盘驱动器中时的检测误差的影响被消除。 控制单元17基于传送单元16的操作来检测是否将光盘11提供给光盘驱动器13，使得光盘驱动器13检测光盘11是否在盘驱动器内部，并将 这些检测操作的结果。 如果结果不匹配，则控制单元17使光盘驱动器13重复放电并加载光盘11的操作，并且使光盘驱动器13再次检测在放电之后是否存在光盘11， 加载操作。 然后，控制单元17确定来自光盘驱动器13的新检测结果和与将光盘11提供给光盘驱动器13相关的检测结果是否一致，并且基于该评估结果检测光盘驱动器13 操作错误。
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