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    Upper structure for a shoe
    21.
    发明授权
    Upper structure for a shoe 失效
    鞋的上部结构

    公开(公告)号：US08490298B2

    公开(公告)日：2013-07-23

    申请号：US13240384

    申请日：2011-09-22

    申请人： Natsuki Sato ,  Tetsuo Yamamoto

    发明人： Natsuki Sato ,  Tetsuo Yamamoto

    IPC分类号： A43B23/00

    CPC分类号： A43B13/181 ,  A43B23/0235 ,  A43B23/0275 ,  A43B23/047 ,  A43C1/00

    摘要： An upper structure for a shoe includes an upper body and an outside upper member that overlaps the lateral side of the upper body to cover the foot's talus and that has a bottom edge portion fixedly attached to a bottom surface of the upper body. A rear end portion of the bottom edge portion is located rearwardly of the calcaneus load centerline. A rear edge portion of the outside upper member is separate from the upper body rearwardly of the talus. An instep edge portion of the outside upper member is connected to the shoelace. The upper structure includes a region that is expandable and contractible in a longitudinal direction. A top end of the region extends to the opening of the upper body, and a bottom end of the region is disposed in front of the calcaneus load centerline and below 55% of the foot's lateral ankle height.

    摘要翻译： 鞋的上部结构包括上身和外部上部构件，其与上部主体的侧面重叠以覆盖足部的距离，并且具有固定地附接到上身的底部表面的底部边缘部分。 底边缘部分的后端部位于跟骨负载中心线的后方。 外侧上部构件的后缘部分与距离的上部身体分离。 外部上部构件的脚后缘部分连接到鞋带。 上部结构包括沿纵向可膨胀和收缩的区域。 该区域的顶端延伸到上身的开口，并且该区域的底端设置在跟骨负载中心线的前方，并且低于脚的外侧脚踝高度的55％。

    NI-FE magnetic alloy and method for producing thereof
    24.
    发明授权
    NI-FE magnetic alloy and method for producing thereof 失效
    NI-FE磁性合金及其制造方法

    公开(公告)号：US5500057A

    公开(公告)日：1996-03-19

    申请号：US130369

    申请日：1993-10-01

    申请人： Tadashi Inoue ,  Kiyoshi Tsuru ,  Shinichi Okimoto ,  Naokazu Yamamura ,  Tetsuo Yamamoto ,  Hirohisa Haiji

    发明人： Tadashi Inoue ,  Kiyoshi Tsuru ,  Shinichi Okimoto ,  Naokazu Yamamura ,  Tetsuo Yamamoto ,  Hirohisa Haiji

    IPC分类号： C22C19/03 ,  C22F1/00 ,  C22F1/10 ,  H01F1/147 ,  H01F1/04

    CPC分类号： H01F1/14708 ,  C22C19/03 ,  H01F1/14716

    摘要： A Ni-Fe magnetic alloy consists essentially of:77 to 80 wt. % Ni, 3.5 to 5 wt. % Mo, 1.5 to 3 wt. % Cu, 0.1 to 1.1 wt. % Mn, 0.1 wt. % or less Cr, 0.003 wt. % or less S, 0.01 wt. % or less P, 0.005 wt. % or less 0, 0.003 wt. % or less N, 0.02 wt. % or less C, 0.001 to 0.05 wt. % Al, 1 wt. % or less Si, 2.6-6 of the weight ratio of Ca to S, (Ca/S), and the balance being Fe and inevitable impurities, satisfies an equation of 3.2.ltoreq.(2.02.times.[Ni]-11.13.times.[Mo]-1.25.times.[Cu]-5.03.times.[Mn])/ (2.13.times.[Fe]).ltoreq.3.8; and has a Mo segregation ratio defined by a seregration equation satisfying 5% or less, the seregration equation being .vertline.(Mo content in a segregation region-Mo average content)/ (Mo average content).vertline..times.100%.A method for producing a magnetic Ni-Fe alloy comprises the steps of: a first heating step of heating an alloy ingot to 1200.degree. to 1300.degree. C. for 10 to 30 hrs; slabbing the heated ingot at a finishing temperature of 950.degree. C. or more to produce a slab; a second heating step of heating the slab at 1150.degree. to 1270.degree. C. for 1 to 5 hrs: and hot rolling the heated slab at a finishing temperature 950.degree. C. or more.

    摘要翻译： Ni-Fe磁性合金主要由以下组成：77〜80wt。 ％Ni，3.5〜5wt。 ％Mo，1.5〜3wt。 ％Cu，0.1〜1.1wt。 ％Mn，0.1wt。 ％以下Cr，0.003重量％ ％以下S，0.01重量％ ％以下P，0.005重量％ ％以下0，0.003重量％ ％以下N，0.02重量％ ％以下C，0.001〜0.05重量％ ％Al，1wt。 ％以下的Si，2.6〜6（Ca / S）的重量比（Ca / S），余量为Fe和不可避免的杂质，满足3.2的方程式（2.02×[Ni] -11.13×[ Mo] -1.25x [Cu] -5.03x [Mn]）/（2.13x [Fe]）= 3.8; 并且具有由满足5％以下的对数方程定义的Mo偏析比，所述对数方程为|（偏析区中的Mo含量-Mo平均含量）/（Mo平均含量）| x100％。 一种磁性Ni-Fe合金的制造方法，其特征在于，包括以下步骤：将合金锭加热到1200〜1300℃进行10〜30小时的第一加热工序; 在950℃或更高的终轧温度下对加热的锭进行烧结以制造板坯; 第二加热步骤，在1150℃〜1270℃下加热板坯1〜5小时，并在950℃以上的终轧温度下热轧。

    Upper structure for a shoe
    27.
    发明授权
    Upper structure for a shoe 失效
    鞋的上部结构

    公开(公告)号：US08056264B2

    公开(公告)日：2011-11-15

    申请号：US11982218

    申请日：2007-10-31

    申请人： Natsuki Sato ,  Tetsuo Yamamoto

    发明人： Natsuki Sato ,  Tetsuo Yamamoto

    IPC分类号： A43B23/00

    CPC分类号： A43B13/181 ,  A43B23/0235 ,  A43B23/0275 ,  A43B23/047 ,  A43C1/00

    摘要： An upper structure for a shoe improves a fit of the heel portion during heel contact with the ground to the push off motion of a foot. The upper structure includes an upper body 30, and an outside upper member 31 that overlaps the lateral side of the upper body 30 to cover the talus T of the foot, and that has a bottom edge portion 31a fixedly attached to the bottom surface of the upper body 30. The rear end portion A of the bottom edge portion 31a is located rearwardly of the load centerline C of the calcaneus. A rear edge portion 31c of the outside upper member 31 is provided separately from the upper body 30 rearwardly of the talus T of the foot. An instep edge portion 31b of the outside upper member 31 is connected to the shoelace 4. On the lateral side of the heel portion of the upper body 30, there is a region 10 that is expandable and contractible in the longitudinal direction. The top end of the region 10 extends to the opening of the upper body 30 and the bottom end B of the region 10 is disposed in front of the load centerline C of the calcaneus and below a height h that corresponds to 55% of the lateral ankle height H of the foot.

    摘要翻译： 用于鞋子的上部结构改善了跟脚部接触地面时脚跟部分与脚部的推开运动的配合。 上部结构包括上部主体30和与上部主体30的横向侧重叠以覆盖脚部的距离T的外部上部构件31，并且具有固定地附接到底部的底部表面的底部边缘部分31a 底部边缘部31a的后端部A位于跟骨的负载中心线C的后方。 外侧上部构件31的后缘部31c与脚部的距离T的后方与上身30分开设置。 外侧上部构件31的脚后缘部分31b连接到鞋带4.在上部主体30的后跟部分的侧面上，存在沿纵向方向可膨胀和收缩的区域10。 区域10的顶端延伸到上主体30的开口，并且区域10的底端B设置在跟骨的负载中心线C的前方，并且低于对应于侧面的55％的高度h 脚踝高度H。

    Substrate processing apparatus
    28.
    发明申请
    Substrate processing apparatus 有权
    基板加工装置

    公开(公告)号：US20090241835A1

    公开(公告)日：2009-10-01

    申请号：US12382331

    申请日：2009-03-13

    申请人： Tadashi Kontani ,  Tetsuo Yamamoto ,  Nobuhito Shima ,  Nobuo Ishimaru

    发明人： Tadashi Kontani ,  Tetsuo Yamamoto ,  Nobuhito Shima ,  Nobuo Ishimaru

    IPC分类号： C23C16/503 ,  C23C16/513

    CPC分类号： C23C16/345 ,  C23C16/452 ,  C23C16/45542 ,  C23C16/45544

    摘要： A substrate processing apparatus includes a processing chamber in which a substrate is mounted, a gas supply unit that supplies processing gas into the processing chamber, a gas exhaust unit that exhausts atmospheric gas in the processing chamber, first and second electrodes to which high-frequency power is applied to set the processing gas to an active state. Each of the first and second electrodes includes a core wire formed of a metal and plural pipe bodies that are joined to one another through the core wire so as to be bendable, and less thermally deformed than the core wire.

    摘要翻译： 基板处理装置包括：处理室，其中安装有基板;气体供应单元，其将处理气体供应到处理室;排气单元，其排出处理室中的气氛气体;高频的第一和第二电极; 施加电力以将处理气体设置为活动状态。 第一电极和第二电极中的每一个包括由金属和多个管体形成的芯线，所述多个管体通过芯线彼此接合，以便能够弯曲，并且比芯线更不易热变形。

    Electrically disconnecting a peripheral device
    29.
    发明授权
    Electrically disconnecting a peripheral device 有权
    电气断开外围设备

    公开(公告)号：US07325733B2

    公开(公告)日：2008-02-05

    申请号：US11530977

    申请日：2006-09-12

    申请人： Henry Wurzburg ,  Tetsuo Yamamoto ,  Mark Colman Atchison

    发明人： Henry Wurzburg ,  Tetsuo Yamamoto ,  Mark Colman Atchison

    IPC分类号： G06K7/06

    CPC分类号： G06F1/3215 ,  G06F1/266 ,  G06F1/325

    摘要： If a USB device is turned off or is not active, the device may be electrically disconnected from a USB host controller. The device may be electrically disconnected through a physical interface on the device. In some embodiments, if the device becomes active during a wait period (e.g., 2-3 seconds) prior to electrically disconnecting the device, the device may not be electrically disconnected. In some embodiments, when the device is electrically disconnected from the USB host controller and no system activity of a bus mastering peripheral is occurring, the CPU may enter a low power state if other conditions are met. In some embodiments, if the USB device becomes active after electrically disconnecting, the electrical disconnection may be discontinued.

    摘要翻译： 如果USB设备已关闭或未激活，则设备可能与USB主机控制器电气断开。 该设备可以通过设备上的物理接口电断开。 在一些实施例中，如果在电气断开设备之前的设备在等待期间（例如2-3秒）期间变得有效，则该设备可能不会被电断开。 在一些实施例中，当设备与USB主机控制器电气断开连接并且没有发生总线母盘制作外设的系统活动时，如果满足其他条件，则CPU可以进入低功率状态。 在一些实施例中，如果在电断开之后USB设备变为有效，则可能停止电断开。

    Peripheral device feature allowing processors to enter a low power state
    30.
    发明授权
    Peripheral device feature allowing processors to enter a low power state 有权
    外围设备功能允许处理器进入低功耗状态

    公开(公告)号：US07159766B2

    公开(公告)日：2007-01-09

    申请号：US10762767

    申请日：2004-01-20

    申请人： Henry Wurzburg ,  Tetsuo Yamamoto ,  Mark Colman Atchison

    发明人： Henry Wurzburg ,  Tetsuo Yamamoto ,  Mark Colman Atchison

    IPC分类号： G06F7/00

    CPC分类号： G06F1/3215 ,  G06F1/266 ,  G06F1/325

    摘要： If a USB device is turned off or is not active, the device may be electrically disconnected from a USB host controller. The device may be electrically disconnected through a physical interface on the device. In some embodiments, if the device becomes active during a wait period (e.g., 2–3 seconds) prior to electrically disconnecting the device, the device may not be electrically disconnected. In some embodiments, when the device is electrically disconnected from the USB host controller and no system activity of a bus mastering peripheral is occurring, the CPU may enter a low power state if other conditions are met. In some embodiments, if the USB device becomes active after electrically disconnecting, the electrical disconnection may be discontinued.

    摘要翻译： 如果USB设备已关闭或未激活，则设备可能与USB主机控制器电气断开。 该设备可以通过设备上的物理接口电断开。 在一些实施例中，如果在电气断开设备之前的设备在等待期间（例如2-3秒）期间变得有效，则该设备可能不会被电断开。 在一些实施例中，当设备与USB主机控制器电气断开连接并且没有发生总线母盘制作外设的系统活动时，如果满足其他条件，则CPU可以进入低功率状态。 在一些实施例中，如果在电断开之后USB设备变为有效，则可能停止电断开。