A DUAL INTERFEROMETER SYSTEM WITH A SHORT REFERENCE FLAT DISTANCE FOR WAFER SHAPE AND THICKNESS VARIATION MEASUREMENT
    22.
    发明申请
    A DUAL INTERFEROMETER SYSTEM WITH A SHORT REFERENCE FLAT DISTANCE FOR WAFER SHAPE AND THICKNESS VARIATION MEASUREMENT 审中-公开
    具有短形参考平面距离的双干涉仪系统,用于形状和厚度变化测量

    公开(公告)号:US20150176973A1

    公开(公告)日:2015-06-25

    申请号:US13316223

    申请日:2011-12-09

    IPC分类号: G01B11/06 G01B9/02

    摘要: An interferometer system is disclosed. The interferometer system includes two spaced apart reference flats having corresponding reference surfaces forming a cavity therebetween for placement of a polished opaque plate. The surfaces of the plate are approximately 2.5 millimeters or less from the corresponding reference surfaces when the plate is placed in the cavity. The interferometer system also includes two interferometer devices located on diametrically opposite sides of the cavity to map the surfaces of the plate. A light source is optically coupled to the interferometer devices. The light source includes an illuminator configured for producing light of multiple wavelengths and an optical amplitude modulator configured for stabilizing power of the light produced by the illuminator. The interferometer system further includes two interferogram detectors, and at least one computer coupled to receive the outputs of the interferogram detectors for determining thickness variations of the plate.

    摘要翻译: 公开了一种干涉仪系统。 干涉仪系统包括两个间隔开的参考平面,其具有相应的参考表面,在其间形成用于放置抛光的不透明板的空腔。 当板被放置在空腔中时,板的表面与相应的参考表面大约为2.5毫米或更小。 干涉仪系统还包括位于空腔的径向相对侧上的两个干涉仪装置,用于映射该板的表面。 光源光耦合到干涉仪装置。 光源包括被配置为产生多个波长的光的照明器和被配置为稳定由照明器产生的光的功率的光学幅度调制器。 干涉仪系统还包括两个干涉图检测器,以及至少一个计算机,其被耦合以接收用于确定板的厚度变化的干涉图检测器的输出。

    METHOD AND APPARATUS FOR MEASURING SHAPE AND THICKNESS VARIATION OF A WAFER
    23.
    发明申请
    METHOD AND APPARATUS FOR MEASURING SHAPE AND THICKNESS VARIATION OF A WAFER 有权
    用于测量波形的形状和厚度变化的方法和装置

    公开(公告)号:US20130188179A1

    公开(公告)日:2013-07-25

    申请号:US13525858

    申请日:2012-06-18

    申请人: Shouhong Tang

    发明人: Shouhong Tang

    IPC分类号: G01N21/956

    摘要: The invention provides a new dual-sided Moiré wafer analysis system that integrates wafer flatness measurement capability with wafer surface defect detection capability. The invention may be, but is not necessarily, embodied in methods and systems for simultaneously applying phase shifting reflective Moiré wafer analysis to the front and back sides of a silicon wafer and comparing or combining the front and back side height maps. This allows wafer surface height for each side of the wafer, thickness variation map, surface nanotopography, shape, flatness, and edge map to be determined with a dual-sided fringe acquisition process. The invention also improves the dynamic range of wafer analysis to measure wafers with large bows and extends the measurement area closer to the wafer edge.

    摘要翻译: 本发明提供了一种新的双面Moiré晶片分析系统,其将晶片平坦度测量能力与晶片表面缺陷检测能力相结合。 本发明可以但并不一定体现在用于同时将硅移动反射Moiré晶片分析应用于硅晶片的正面和背面并且比较或组合前侧和后侧高度图的方法和系统中。 这允许通过双面条纹获取过程确定晶片每侧的晶片表面高度,厚度变化图,表面纳米形貌,形状,平坦度和边缘图。 本发明还改进了晶片分析的动态范围,以测量具有大弓形的晶片并将测量区域延伸到更接近晶片边缘。

    METHODS AND SYSTEMS FOR IMPROVED LOCALIZED FEATURE QUANTIFICATION IN SURFACE METROLOGY TOOLS
    24.
    发明申请
    METHODS AND SYSTEMS FOR IMPROVED LOCALIZED FEATURE QUANTIFICATION IN SURFACE METROLOGY TOOLS 有权
    用于改进表面计量工具中的本地化特征量化的方法和系统

    公开(公告)号:US20120177282A1

    公开(公告)日:2012-07-12

    申请号:US12986176

    申请日:2011-01-07

    IPC分类号: G06K9/00

    摘要: A method for enabling more accurate measurements of localized features on wafers is disclosed. The method includes: a) performing high order surface fitting to more effectively remove the low frequency shape components and also to reduce possible signal attenuations commonly observed from filtering; b) constructing and applying a proper two dimensional LFM window to the residual image from the surface fitting processing stage to effectively reduce the residual artifacts at the region boundaries; c) calculating the metrics of the region using the artifact-reduced image to obtain more accurate and reliable measurements; and d) using site-based metrics obtained from front and back surface data to quantify the features of interest. A method for filtering data from measurements of localized features on wafers is disclosed. This method includes an algorithm designed to adjust the filtering behavior according to the statistics of extreme data samples.A method for utilizing the 2D window and the data filtering to yield a more robust and more accurate Localized Feature quantification methodology is disclosed.

    摘要翻译: 公开了一种能够更精确地测量晶片上局部特征的方法。 该方法包括:a)执行高阶表面拟合以更有效地去除低频形状分量,并且还可以减少通常从滤波观察到的可能的信号衰减; b)从表面拟合处理阶段构造和应用适当的二维LFM窗口到残余图像,以有效地减少区域边界处的残余伪像; c)使用伪影图像计算该区域的度量以获得更准确和可靠的测量; 以及d)使用从前面和背面数据获得的基于站点的度量来量化感兴趣的特征。 公开了一种用于从晶片上的局部特征的测量中滤出数据的方法。 该方法包括根据极端数据样本统计来调整过滤行为的算法。 公开了一种利用2D窗口和数据过滤产生更强大和更准确的局部特征量化方法的方法。

    Method and apparatus for measuring shape or thickness information of a substrate
    25.
    发明授权
    Method and apparatus for measuring shape or thickness information of a substrate 有权
    用于测量衬底的形状或厚度信息的方法和装置

    公开(公告)号:US08068234B2

    公开(公告)日:2011-11-29

    申请号:US12388487

    申请日:2009-02-18

    IPC分类号: G01B11/02

    摘要: An interferometer system and method may be used to measure substrate thickness or shape. The system may include two spaced apart reference flats having that form an optical cavity between two parallel reference surfaces. A substrate holder may be configured to place the substrate in the cavity with first and second substrate surfaces substantially parallel with corresponding first and second reference surfaces such that a space between the first or second substrate surface is three millimeters or less from a corresponding one of the reference surfaces or a damping surface. Interferometer devices may be located on diametrically opposite sides of the cavity and optically coupled thereto. The interferometers can map variations in spacing between the substrate surfaces and the reference surfaces, respectively, through interference of light optically coupled to and from to the cavity via the interferometer devices.

    摘要翻译: 干涉仪系统和方法可用于测量衬底厚度或形状。 该系统可以包括两个间隔开的参考平面,其具有在两个平行参考表面之间形成光腔。 衬底保持器可以被配置为将衬底放置在空腔中,其中第一和第二衬底表面基本上平行于相应的第一和第二参考表面,使得第一或第二衬底表面之间的空间距离相应的一个 参考表面或阻尼表面。 干涉仪装置可以位于空腔的径向相对的两侧并与之光耦合。 干涉仪可以分别通过经由干涉仪装置光耦合到腔体的光的干涉来映射衬底表面和参考表面之间的间隔的变化。

    Measuring the shape and thickness variation of a wafer with high slopes
    26.
    发明授权
    Measuring the shape and thickness variation of a wafer with high slopes 有权
    测量具有高斜率的晶圆的形状和厚度变化

    公开(公告)号:US07847954B2

    公开(公告)日:2010-12-07

    申请号:US12121250

    申请日:2008-05-15

    IPC分类号: G01B11/02

    摘要: A system with two unequal path interferometers, with a first flat, a second flat, and a cavity between the first and second flats, a holder to receive an object in the cavity such that an optical path remains open between the first and second flats, and a motor coupled to the holder such that the object may be tilted in the cavity to allow for measurements of, and a radiation assembly to direct collimated radiation to the interferometer assembly, a collecting assembly to collect radiation received from the interferometer assembly, and a controller comprising logic to; vary a wavelength of the radiation, record interferograms, extract phases of the interferograms to produce phase maps, determine from each map areas with high slopes, tilt the holder to allow measurement of the high slope areas, and process measurement that covers the entire surface of the object.

    摘要翻译: 一种具有两个不等径干涉仪的系统,具有第一平面,第二平面和在第一和第二平面之间的空腔,保持器,用于接收空腔中的物体,使得光路在第一和第二平面之间保持打开, 以及电动机,其联接到所述保持器,使得所述物体可以在所述空腔中倾斜以允许对所述干涉仪组件进行测量和辐射组件以将准直辐射引导到所述干涉仪组件,收集组件以收集从所述干涉仪组件接收的辐射,以及 控制器包括逻辑; 改变辐射的波长,记录干涉图,提取干涉图的相位以产生相位图,从每个具有高斜率的地图区域确定,倾斜支架以允许测量高斜率区域,并且覆盖整个表面的过程测量 物体。

    MEASURING THE SHAPE AND THICKNESS VARIATION OF A WAFER WITH HIGH SLOPES
    27.
    发明申请
    MEASURING THE SHAPE AND THICKNESS VARIATION OF A WAFER WITH HIGH SLOPES 有权
    测量具有高坡度的波形的形状和厚度变化

    公开(公告)号:US20090284734A1

    公开(公告)日:2009-11-19

    申请号:US12121250

    申请日:2008-05-15

    IPC分类号: G01N21/00

    摘要: In one embodiment, an interferometer system comprises two unequal path interferometers assemble comprising; a first reference flat having a first length L1 in a first dimension, a second reference flat having a second length L2 in the first dimension, a cavity D1 defined by a distance between the first reference flat and the second reference flat, a wafer holder to receive an object in the cavity such that an optical path remains open at an outer annual area between the first reference flat and the second reference flat and at least one wafer holder motor coupled to the wafer holder such that an object may be tilted in the cavity as to allow for measurements of local areas of interest, and a radiation targeting assembly to direct a collimated radiation beam to the interferometer assembly, a radiation collecting assembly to collect radiation received from the interferometer assembly, and a controller comprising logic to; vary a wavelength of the collimated radiation beam, record interferograms formed by a plurality of surfaces, extract phases of each of the interferograms for each of the plurality of surfaces to produce multiple phase maps, determine each map from its corresponding interferogram, determine from each map local areas of interest with high slopes, tilt the wafer holder to allow measurement of the high slope areas of interest, and process measurement that covers the entire surface of an object including high slope areas.

    摘要翻译: 在一个实施例中,干涉仪系统包括两个不等路径干涉仪组装,包括: 具有第一尺寸的第一长度L1的第一参考平面,具有第一尺寸的第二长度L2的第二参考平面,由第一参考平面和第二参考平面之间的距离限定的空腔D1,晶片保持器 在腔中接收物体,使得光路在第一参考平面和第二参考平面之间的外部年度区域保持打开,以及耦合到晶片保持器的至少一个晶片保持器电机,使得物体可以在空腔中倾斜 以便允许对感兴趣的局部区域进行测量,以及辐射瞄准组件将准直辐射束引导到干涉仪组件,用于收集从干涉仪组件接收的辐射的辐射收集组件,以及包括逻辑的控制器; 改变准直辐射束的波长,记录由多个表面形成的干涉图,提取多个表面中的每个表面的每个干涉图的相位以产生多个相位图,从其相应的干涉图确定每个地图,从每个地图确定 局部感兴趣的区域具有高斜坡,倾斜晶片架以允许测量感兴趣的高坡度区域,以及覆盖包括高坡度区域的物体的整个表面的过程测量。

    Temporal interferometric signal modeling with constant phase shift in white light interferometry
    28.
    发明授权
    Temporal interferometric signal modeling with constant phase shift in white light interferometry 有权
    在白光干涉测量中具有恒定相移的时间干涉信号建模

    公开(公告)号:US07538887B1

    公开(公告)日:2009-05-26

    申请号:US11588560

    申请日:2006-10-26

    申请人: Shouhong Tang

    发明人: Shouhong Tang

    IPC分类号: G01B11/02

    摘要: A method for determining the surface topography of an object with various surface properties in white light interferometry first generates a set of interferograms, produced by a phase shift driving mechanism supplied with known inputs, obtained from a single reflective surface at the location of the test piece. The sequence of interferograms from the test piece then is used to calibrate a sequence of inputs to the phase shift driving mechanism to compensate for non-linear characteristics of the phase shifting mechanism. The temporal interferometric signal or its transform at each pixel of a set of subsequently acquired interferograms from a test piece then is compared with signals or their transforms modeled with different properties of the measuring surface. The measured surface properties which generate a best match to the modeling surface properties are selected as the desired signal.

    摘要翻译: 用于在白光干涉测量中用于确定具有各种表面特性的物体的表面形貌的方法首先产生一组干涉图,该组干涉图由提供有已知输入的相移驱动机构产生,该组合由在测试片的位置处的单个反射表面获得 。 然后来自测试件的干涉图序列用于校准到相移驱动机构的输入序列,以补偿相移机构的非线性特性。 将来自测试片的一组随后获取的干涉图中的每个像素处的时间干涉信号或其变换与与测量表面的不同特性建模的信号或它们的变换进行比较。 选择产生与建模表面性质最佳匹配的测量表面性质作为所需信号。

    Method and apparatus for optically analyzing a surface
    29.
    发明申请
    Method and apparatus for optically analyzing a surface 失效
    用于光学分析表面的方法和装置

    公开(公告)号:US20070091317A1

    公开(公告)日:2007-04-26

    申请号:US11260497

    申请日:2005-10-26

    IPC分类号: G01B11/02 G01J3/45 G01B9/02

    摘要: Apparatus and methods are provided for analyzing surface characteristics of a test object using broadband scanning interferometry. Test objects amenable to these apparatus and methods include but are not limited to semiconductor wafers, semiconductor devices, metallic surfaces, and the like. An interferometry system is used to obtain an interferometry signal and related to data embodied in the signal representative of the test object surface. This signal and/or data is used to construct an n-dimensional function that includes an independent frequency variable and an independent time variable, and/or an n-dimensional function that includes an independent scale variable and an independent time variable, and/or a multi-domain function. These functions are compared with various models to obtain a best match that is then used to characterize the test object surface.

    摘要翻译: 提供了使用宽带扫描干涉测量来分析测试对象的表面特性的装置和方法。 适用于这些装置和方法的测试对象包括但不限于半导体晶片,半导体器件,金属表面等。 干涉测量系统用于获得干涉测量信号,并与代表测试对象表面的信号中体现的数据相关。 该信号和/或数据用于构造包括独立频率变量和独立时间变量的n维函数,和/或包括独立标度变量和独立时间变量的n维函数,和/或 多域功能。 将这些功能与各种模型进行比较,以获得最佳匹配,然后用于表征测试对象表面。

    Method and apparatus for measuring the shape and thickness variation of polished opaque plates
    30.
    发明授权
    Method and apparatus for measuring the shape and thickness variation of polished opaque plates 有权
    用于测量抛光不透明板的形状和厚度变化的方法和装置

    公开(公告)号:US06847458B2

    公开(公告)日:2005-01-25

    申请号:US10393883

    申请日:2003-03-20

    摘要: The present invention consists of a technique and device for measuring the thickness variation and shape of wafers or other polished opaque plates. A combination of two improved phase-shifting Fizeau interferometers is used to simultaneously measure the single-sided distance maps between each side of the wafer and the corresponding reference flat, with the thickness variation and shape being calculated from these data. Provisions are made to determine and eliminate the shape and tilt of the reference surfaces, and also to facilitate the correct overlay of the two single-sided measurements for the calculation of thickness variation and shape.

    摘要翻译: 本发明包括用于测量晶片或其它抛光不透明板的厚度变化和形状的技术和装置。 使用两个改进的相移Fizeau干涉仪的组合来同时测量晶片的每一侧和相应的参考平面之间的单面距离图,其中根据这些数据计算厚度变化和形状。 确定和消除参考表面的形状和倾斜的规定,并且还有助于两个单面测量的正确覆盖以计算厚度变化和形状。