Method of producing a semiconductor device
    21.
    发明授权
    Method of producing a semiconductor device 失效
    半导体装置的制造方法

    公开(公告)号:US06716718B2

    公开(公告)日:2004-04-06

    申请号:US09972147

    申请日:2001-10-09

    IPC分类号: H01L2176

    CPC分类号: H01L21/76235

    摘要: A trench is formed by performing an anisotropic etching treatment on a silicon substrate with the use of a mask pattern including a pad oxide film, a polysilicon film, and a silicon nitride film formed on the silicon substrate, as a mask. Next, the side surface of the polysilicon film is retreated by etching so that the part of an oxide film formed on the side surface of the polysilicon film may not be hung over the part of an oxide film formed on the side surface of the pad oxide film. Next, an oxide film is formed by performing a thermal oxidation treatment on the inner wall surface of the trench including the exposed side surface of the polysilicon film. This produces a semiconductor device that prevents voids from being formed in a trench isolation structure.

    摘要翻译: 通过使用包括形成在硅衬底上的衬垫氧化物膜,多晶硅膜和氮化硅膜的掩模图案作为掩模,在硅衬底上进行各向异性蚀刻处理来形成沟槽。 接下来,通过蚀刻来回退多晶硅膜的侧表面,使得形成在多晶硅膜的侧表面上的氧化膜的部分不会悬挂在形成在衬垫氧化物的侧表面上的氧化膜的部分上 电影。 接下来,通过对包括多晶硅膜的暴露侧表面的沟槽的内壁表面进行热氧化处理来形成氧化物膜。 这产生了防止在沟槽隔离结构中形成空隙的半导体器件。

    Method for forming a thin film capacitive memory deivce with a high
dielectric constant
    22.
    发明授权
    Method for forming a thin film capacitive memory deivce with a high dielectric constant 失效
    用于形成具有高介电常数的薄膜电容式存储器的方法

    公开(公告)号:US5444011A

    公开(公告)日:1995-08-22

    申请号:US253296

    申请日:1994-06-03

    申请人: Kouji Taniguchi

    发明人: Kouji Taniguchi

    摘要: A method is disclosed for making a thin film capacitive memory device with a high dielectric constant. A lower electrode of yttrium or hafnium is formed on a semiconductor substrate. A dielectric insulating film is formed on the lower electrode, and the dielectric insulating film is annealed such that at thinner portions the dielectric insulating film, the lower electrode is oxidized more heavily than at thicker portions of the dielectric insulating film. An upper electrode is formed on the dielectric insulating film.

    摘要翻译: 公开了制造具有高介电常数的薄膜电容式存储器件的方法。 在半导体衬底上形成钇或铪的下电极。 在下部电极上形成介电绝缘膜,并且在电介质绝缘膜的较薄部分,电介质绝缘膜的下部电极比介电绝缘膜的较厚部分氧化得更为严重。 在电介质绝缘膜上形成上电极。