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21.
公开(公告)号:US6107657A
公开(公告)日:2000-08-22
申请号:US71121
申请日:1998-05-04
申请人: Koji Arita , Eiji Fujii , Yasuhiro Shimada , Yasuhiro Uemoto , Toru Nasu , Akihiro Matsuda , Yoshihisa Nagano , Atsuo Inoue , Taketoshi Matsuura , Tatsuo Otsuki
发明人: Koji Arita , Eiji Fujii , Yasuhiro Shimada , Yasuhiro Uemoto , Toru Nasu , Akihiro Matsuda , Yoshihisa Nagano , Atsuo Inoue , Taketoshi Matsuura , Tatsuo Otsuki
IPC分类号: H01L21/02 , H01L21/8242 , H01L21/8246 , H01L27/115 , H01L29/72
CPC分类号: H01L27/11502 , H01L27/10852 , H01L27/11585 , H01L27/1159 , H01L28/40 , H01L28/55 , H01L28/60 , H01L28/75 , Y10S438/958
摘要: A semiconductor device forming a capacitor through an interlayer insulating layer on a semiconductor substrate on which an integrated circuit is formed. This semiconductor device has an interlayer insulating layer with moisture content of 0.5 g/cm.sup.3 or less, which covers the capacitor in one aspect, and has a passivation layer with hydrogen content of 10.sup.21 atoms/cm.sup.3 or less, which covers the interconnections of the capacitor in other aspect. By thus constituting, deterioration of the capacitor dielectric can be prevented which brings about the electrical reliability of the ferroelectric layer or high dielectric layer.
摘要翻译: 一种通过半导体衬底上的层间绝缘层形成电容器的半导体器件,其上形成集成电路。 该半导体装置具有含水量为0.5g / cm 3以下的层间绝缘层,其在一个方面覆盖电容器,并且具有氢含量为1021原子/ cm3以下的钝化层,其覆盖电容器的互连 在其他方面。 通过这样构成,可以防止导致铁电层或高介电层的电可靠性的电容器电介质的劣化。
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公开(公告)号:US5932281A
公开(公告)日:1999-08-03
申请号:US854173
申请日:1997-05-09
申请人: Yukoh Hochido, deceased , Hidekimi Kadokura , Masamichi Matsumoto , Koji Arita , Masamichi Azuma , Tatsuo Otsuki
发明人: Yukoh Hochido, deceased , Hidekimi Kadokura , Masamichi Matsumoto , Koji Arita , Masamichi Azuma , Tatsuo Otsuki
IPC分类号: C23C16/40 , C23C18/12 , H01L21/02 , H01L21/314 , H01L21/316 , B05D5/12 , B05D3/12 , C23C16/00
CPC分类号: H01L21/31691 , C23C16/40 , C23C18/1216 , C23C18/1279 , H01L28/56 , H01L28/55
摘要: A method of forming a Bi-layered ferroelectric thin film on a substrate with good reproducibility, using a mixed composition of a Bi-containing organic compound and a metal polyalkoxide compound by at least one technique selected from the group consisting of molecular deposition such as CVD, and spincoat-sintering.
摘要翻译: 通过选自以下的至少一种技术,使用含Bi有机化合物和金属聚烷氧化物化合物的混合组合物,在复合性基板上形成双层铁电薄膜的方法, ,和旋涂烧结。
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