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公开(公告)号：US07816703B2
公开(公告)日：2010-10-19
申请号：US12269407
申请日：2008-11-12
CPC分类号： H01L33/14 , H01L33/10 , H01L33/382
摘要： A light-emitting diode device includes an epitaxial layer, a current blocking layer and a current spreading layer. The current blocking layer is disposed on one side of the epitaxial layer and contacts with a portion of the epitaxial layer. The current spreading layer is disposed on one side of the epitaxial layer and contacts with at least a portion of the current blocking layer.
摘要翻译： 发光二极管器件包括外延层，电流阻挡层和电流扩散层。 电流阻挡层设置在外延层的一侧上并与外延层的一部分接触。 电流扩散层设置在外延层的一侧并与电流阻挡层的至少一部分接触。
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公开(公告)号：US20090050909A1
公开(公告)日：2009-02-26
申请号：US12178975
申请日：2008-07-24
摘要： A light-emitting diode (LED) apparatus includes an epitaxial layer and an etching mask layer. The epitaxial layer has a first semiconductor layer, an active layer and a second semiconductor layer in sequence. The etching mask layer is disposed on the epitaxial layer and has a plurality of hollows. The second semiconductor layer includes a roughing structure.
摘要翻译： 发光二极管（LED）装置包括外延层和蚀刻掩模层。 该外延层依次具有第一半导体层，有源层和第二半导体层。 蚀刻掩模层设置在外延层上并具有多个中空部。 第二半导体层包括粗加工结构。
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公开(公告)号：US20080142824A1
公开(公告)日：2008-06-19
申请号：US11941799
申请日：2007-11-16
CPC分类号： H01L33/405 , H01L33/0079 , H01L33/387 , H01L33/42 , H01L2933/0016
摘要： An electroluminescent device includes a substrate, a reflection layer, a patterned transparent conductive layer, at least one LED element, a first contact electrode and a second contact electrode. The reflection layer is formed on the substrate. The patterned transparent conductive layer is disposed on the reflection layer. The LED element is formed on the patterned transparent conductive layer and includes a first semiconductor layer, an electroluminescent layer and a second semiconductor layer. The second semiconductor layer is disposed on the patterned transparent conductive layer and the reflection layer. The first contact electrode is electrically connected to the first semiconductor layer. The second contact electrode is electrically connected to the second semiconductor layer.
摘要翻译： 电致发光器件包括衬底，反射层，图案化透明导电层，至少一个LED元件，第一接触电极和第二接触电极。 反射层形成在基板上。 图案化的透明导电层设置在反射层上。 LED元件形成在图案化的透明导电层上，并且包括第一半导体层，电致发光层和第二半导体层。 第二半导体层设置在图案化的透明导电层和反射层上。 第一接触电极电连接到第一半导体层。 第二接触电极与第二半导体层电连接。
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公开(公告)号：US20100321920A1
公开(公告)日：2010-12-23
申请号：US12816085
申请日：2010-06-15
CPC分类号： H01L33/54 , H01L33/56 , H01L33/60 , H01L2224/48091 , H01L2924/181 , H01L2933/005 , H01L2924/00014 , H01L2924/00012
摘要： An illuminating device includes a substrate, an illuminating element, at least one barricade and at least one cover layer. The illuminating element is disposed on the substrate. The barricade is protruded from a surface of the substrate and disposed around the illuminating element continuously or discontinuously to form a first accommodating area. The cover layer is disposed in the first accommodating area for covering the illuminating element.
摘要翻译： 照明装置包括基板，照明元件，至少一个路障和至少一个覆盖层。 照明元件设置在基板上。 所述路障从所述基板的表面突出并且连续地或不连续地设置在所述照明元件周围，以形成第一容纳区域。 覆盖层设置在第一容纳区域中以覆盖照明元件。
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公开(公告)号：US08882304B2
公开(公告)日：2014-11-11
申请号：US12816085
申请日：2010-06-15
IPC分类号： F21V5/00
CPC分类号： H01L33/54 , H01L33/56 , H01L33/60 , H01L2224/48091 , H01L2924/181 , H01L2933/005 , H01L2924/00014 , H01L2924/00012
摘要： An illuminating device includes a substrate, an illuminating element, at least one barricade and at least one cover layer. The illuminating element is disposed on the substrate. The barricade is protruded from a surface of the substrate and disposed around the illuminating element continuously or discontinuously to form a first accommodating area. The cover layer is disposed in the first accommodating area for covering the illuminating element.
摘要翻译： 照明装置包括基板，照明元件，至少一个路障和至少一个覆盖层。 照明元件设置在基板上。 所述路障从所述基板的表面突出并且连续地或不连续地设置在所述照明元件周围，以形成第一容纳区域。 覆盖层设置在第一容纳区域中以覆盖照明元件。
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公开(公告)号：US07999450B2
公开(公告)日：2011-08-16
申请号：US11944309
申请日：2007-11-21
CPC分类号： H01L33/64 , F21V29/70 , F21Y2115/10 , H01L33/46 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2924/00014 , H01L2924/0002 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electroluminescent module includes a module substrate, a thermal-conducting carrier substrate and a light-emitting element. The module substrate has an opening, a first surface and a first patterned electrode disposed on the first surface. The thermal-conducting carrier substrate has a carrying element and a second patterned electrode disposed on the carrying element. The carrying element is disposed opposite to the first surface of the module substrate, and the second patterned electrode is disposed facing to the first patterned electrode and electrically connected to the first patterned electrode. The light-emitting element is located at the opening and disposed on the thermal-conducting carrier substrate. The light-emitting element has a first electrode and a second electrode, both of which are respectively electrically connected to the corresponding portions of the second patterned electrode of the thermal-conducting carrier substrate.
摘要翻译： 电致发光模块包括模块衬底，导热载体衬底和发光元件。 模块基板具有设置在第一表面上的开口，第一表面和第一图案化电极。 导热载体衬底具有承载元件和设置在承载元件上的第二图案化电极。 承载元件与模块基板的第一表面相对设置，并且第二图案化电极被设置为面对第一图案化电极并电连接到第一图案化电极。 发光元件位于开口处并设置在导热载体基板上。 发光元件具有第一电极和第二电极，它们都分别电连接到导热载体衬底的第二图案化电极的对应部分。
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