Methods of manufacturing a hermetic lead connector

    公开(公告)号:US11559694B2

    公开(公告)日:2023-01-24

    申请号:US16507310

    申请日:2019-07-10

    Abstract: A method of manufacturing a hermetic lead connector includes fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring to form a hermetic ring subassembly, and fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector. The hermetic lead connector includes an open end, an outer surface, and an inner surface defining a lead aperture. The hermetic lead connector provides a hermetic seal between the outer surface and the inner surface.

    Implantable medical device structures

    公开(公告)号:US10994147B2

    公开(公告)日:2021-05-04

    申请号:US16115170

    申请日:2018-08-28

    Abstract: An implantable medical device (IMD) includes a housing that is configured to enclose internal components including at least a processor and a power source. The housing defines two major surfaces that are generally parallel to each other and one or more channels that are each configured to receive a lead and electrically couple the respective lead to the internal components, where each of the channels extend substantially straight in to the housing along an axis generally parallel to the two major surfaces. The housing may be configured to be mounted to a cranium of a patient such that at least one of the two major surfaces approximates a curvature of the cranium. The IMD may include one or more funneling walls that define a rounded and smooth transition from a sidewall of the housing to a surface that defines one or more mouths to the channels.

    STRUCTURES AND TECHNIQUES FOR MEDICAL LEAD FABRICATION

    公开(公告)号:US20200261713A1

    公开(公告)日:2020-08-20

    申请号:US16779106

    申请日:2020-01-31

    Abstract: A medical lead may be fabricated using an electrode fixture configured to facilitate circumferential and axial alignment between electrodes of the lead. In one example, a method may include positioning an electrode fixture around at least one conductor of a plurality of conductors for a medical lead, wherein the electrode fixture at least partially retains an electrode assembly. The method may also include electrically coupling a portion of the at least one conductor with at least a portion of the electrode assembly at an attachment area defined by the electrode assembly when the electrode assembly is at least partially retained by the electrode fixture.

    Implantable medical pump with pressure sensor

    公开(公告)号:US11426514B2

    公开(公告)日:2022-08-30

    申请号:US16565013

    申请日:2019-09-09

    Abstract: The disclosure is directed to a pressure sensor of an implantable medical device. The pressure sensor may utilize detect fluid pressure based on a changing capacitance between two capacitive elements. The pressure sensor may define at least a portion of a fluid enclosure of the IMD. In one example, the pressure sensor has a self-aligning housing shape that occludes an opening in the pump bulkhead of the IMD. An operative surface of the pressure and the portion of the fluid enclosure may be formed of a corrosion resistant and/or biocompatible material. A first capacitive element of the pressure sensor may be a metal alloy diaphragm that deflects in response to external fluid pressure. A second capacitive element of the pressure sensor may be a metal coating on a rigid insulator sealed from the fluid by the diaphragm and a housing of the sensor.

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