摘要:
A phase lock loop includes a quantization circuit that generators an out of phase noise cancellation signal from an error in a delta-sigma modulator and applies the noise cancellation signal to the charge pump. The quantization circuit includes a digital-to-analog differentiator. The digital-to-analog differentiator may be, for example, a single-bit first-order digital-to-analog differentiator, a single-bit second-order digital-to-analog differentiator, or a full M-bit binary-weighted digital to analog differentiator.
摘要:
A millimeter wave wireless (M2W2) interconnect is used for transmitting and receiving signals at millimeter-wave frequencies for short-range wireless communication with high data rate capability. The transmitter and receiver antennae may comprise an on-chip differential dipole antenna or a bond wire differential dipole antenna. The bond wire differential dipole antenna is comprised of a pair of bond wires connecting between a pair of pads on an integrated circuit (IC) die and a pair of floating pads on a printed circuit board (PCB).
摘要:
An attenuator system comprises an attenuator and a control circuit for controlling the attenuation of the attenuator. In one embodiment, the attenuator comprises two diodes or two diode connected transistors, and the control circuit comprises two transistors as the only active devices. In another embodiment, the control circuit comprises another transistor in a shut down circuit.
摘要:
An amplifier circuit comprises a detection power input circuit for receiving an RF signal, and a bias circuit that includes an output for generating a bias signal in response to a reference control voltage. The power detector further comprises a detection circuit for generating a power control voltage having a voltage characteristic that offsets temperature characteristics of the received RF signal. The amplifier circuit further comprises a power amplifier coupled to the bias circuit. The power amplifier includes a driver stage providing the RF signal. The detection circuit compensates temperature variation of the inputted detection voltage of the received RF signal.
摘要:
The present invention relates to a wireless data system which has a transmitter including a transmission buffer. The transmitter is configured to transmit a plurality of packets of encoded data, wherein a level of the transmission buffer is encoded in one of the packets of encoded data. The system further has a wireless receiver for receiving the plurality of packets. The receiver has at least one receiving component that receives the plurality of packets to generate a plurality of decoded signals, wherein the at least one receiving component is configured to receive one of the packets of encoded data from the transmitter to determine the level of transmission buffer. The receiving component is further configured to store the plurality of packets received in a receive buffer, to determine the level of the receive buffer, and to calculate an aggregate buffer level from the transmission buffer and the receive buffer. The receiver controls a packet output rate from the receive buffer to maintain the aggregate buffer level at a desired level.
摘要:
Systems and methods are disclosed for wireless transmission and reception of data including processing and buffering features. According to one or more exemplary aspects, there is provided a wireless audio receiver for receiving a plurality of packets of encoded audio data. Moreover, the receiver includes at least one receiving component that receives the plurality of packets to generate a plurality of decoded signals, a decoding component that decodes the first packet of encoded data transmitted to produce decoded data, and a selecting component that identifies the mechanisms for receiving additional encoded data. Other exemplary embodiments may include one or more receiving components that processing data regarding antenna, frequencies and channels selected for transmission, as well as an audio component that receives the decoded signals and produces decoded audio signals.
摘要:
An amplifier circuit comprises a detection power input circuit for receiving an RF signal, and a bias circuit that includes an output for generating a bias signal in response to a reference control voltage. The power detector further comprises a detection circuit for generating a power control voltage having a voltage characteristic that offsets temperature characteristics of the received RF signal. The amplifier circuit further comprises a power amplifier coupled to the bias circuit. The power amplifier includes a driver stage providing the RF signal. The detection circuit compensates temperature variation of the inputted detection voltage of the received RF signal.
摘要:
A front-end module comprises a plurality of chips that includes first and second functional blocks and an interconnection circuit. The first functional block is formed using a first process type and includes a digital control circuit that generates a digital control signal in response to an external control signal from outside the front end module. The second functional block is formed using a second process type and includes a digitally controlled circuit controlled by the digital control signal generated by the first functional block. The second process type is different from the first process type. The interconnection circuit couples the digital control circuit and the digitally controlled circuit to provide the digital control signal to the digitally controlled circuit. In one aspect, the first functional block may be a low noise amplifier formed by a pseudomorphic high electron mobility transistor process. The second functional block may be a power amplifier formed by a heterojunction bipolar transistor process. In another aspect, the first functional block may be a power amplifier formed by a heterojunction bipolar transistor process. The second functional block may be a low noise amplifier formed by a pseudomorphic high electron mobility transistor process.
摘要:
An integrated circuit module has a substrate with an exposed surface. An integrated circuit die has a first surface and a second surface opposite the first surface, and has a plurality of bonding pads on the second surface. The integrated circuit die is positioned with its first surface on the exposed surface of the substrate. A plurality of dielectric layers cover the second surface of the integrated circuit die. At least one conductive layer is sandwiched between a pair of the plurality of dielectric layers, and forms one or more passive elements electrically connected to the plurality of bonding pads of the integrated circuit die, through one or more holes in one of the plurality of dielectric layers.
摘要:
A phase lock loop includes a quantization circuit that generators an out of phase noise cancellation signal from an error in a delta-sigma modulator and applies the noise cancellation signal to the charge pump. The quantization circuit includes a digital-to-analog differentiator. The digital-to-analog differentiator may be, for example, a single-bit first-order digital-to-analog differentiator, a single-bit second-order digital-to-analog differentiator, or a full M-bit binary-weighted digital to analog differentiator.