Abstract:
A multilayer ceramic electronic component includes a multilayer ceramic element, a center outer electrode at a center portion of a surface of the multilayer ceramic element, side outer electrodes interposing the center outer electrode therebetween, first inner electrodes inside the multilayer ceramic element and electrically connected to the outer electrode via center extending portions, and second inner electrodes electrically connected to the side outer electrodes via first and second-side extending portions. Exposed ends of the first-side extending portions of the second inner electrodes near a center layer of the multilayer ceramic element are spaced from an end surface of the multilayer ceramic element by a distance C. Exposed ends of the first-side extending portions of the second inner electrodes disposed near an outermost layer of the multilayer portion are spaced from the end surface of the multilayer ceramic element by a distance D greater than the distance C.
Abstract:
A method of producing a ceramic electronic component includes baking a first electrode paste containing a metal powder at a first temperature to form a first electrode layer at a first region of a ceramic body, baking a second electrode paste containing a metal powder of the same type as the metal powder in the first electrode paste at a second temperature lower than the first temperature to form a second electrode layer at a second region different from the first region of the ceramic body, and applying a physical shock treatment to a surface of the second electrode layer to densify a surface layer portion of the second electrode layer.
Abstract:
A mounting structure of a multilayer ceramic capacitor includes a multilayer ceramic capacitor and a mounting substrate on which the multilayer ceramic capacitor is mounted. The multilayer ceramic capacitor includes a laminate including a plurality of dielectric layers and a plurality of internal electrodes alternately laminated, and a first external electrode, a second external electrode, a third external electrode, and a fourth external electrode provided on a surface of the laminate. The plurality of internal electrodes include a first internal electrode, a second internal electrode, and a third internal electrode. The first external electrode, the third external electrode, and the fourth external electrode are bonded to the mounting substrate, and current is not directly supplied from the mounting substrate to the second external electrode.
Abstract:
An electronic component includes a multilayer body, first to fourth outer electrodes, a pair of first insulating coating portions, and a pair of second insulating coating portions. The pair of first insulating coating portions is in at least one of a state in which inner end portions are in contact with the third outer electrode and a state in which outer end portions are in contact with the first outer electrode and the second outer electrode. The pair of second insulating coating portions is in at least one of a state in which inner end portions are in contact with the fourth outer electrode and a state in which outer end portions are in contact with the first outer electrode and the second outer electrode.
Abstract:
A multilayer ceramic capacitor includes a capacitor body including a first internal electrode laminated portion in which three or more first internal electrodes are laminated in a laminating direction, and a second internal electrode laminated portion in which three or more second internal electrodes are laminated in the laminating direction. The second internal electrode laminated portion is opposite to the first internal electrode laminated portion in the laminating direction.
Abstract:
A multilayer ceramic electronic component includes a multilayer ceramic element with first through sixth surfaces, a center outer electrode located between a first-side outer electrode and a second-side outer electrode on the multilayer ceramic element. A first plated film is provided on the center outer electrode, second plated films are provided on the first-side outer electrode and the second-side outer electrode, respectively, and a thickness of each of the second plated films is greater than a thickness of the first plated film.
Abstract:
A capacitor includes a capacitor main body with first and second primary surfaces and first through fourth side surfaces, internal electrodes, and first through fourth terminal electrodes, wherein the third terminal electrode includes a first electrode layer provided on the third side surface and a second electrode layer provided on the first electrode layer, the fourth terminal electrode includes a third electrode layer provided on the fourth side surface and a fourth electrode layer provided on the third electrode layer, the first electrode layer includes a conductive material and Si, the second electrode layer includes a conductive material and Si, and a ratio by weight of Si in the first electrode layer is greater than a ratio by weight of Si in the second electrode layer.
Abstract:
In a laminated ceramic electronic component, a side-surface outer electrode includes a first electrode portion including side-surface electrode portions located on first and second side surfaces and wrap-around electrode portions arranged to extend around from the side-surface electrode portions of the first electrode portion to portions of third and fourth side surfaces; and a second electrode portion including side-surface electrode portions located on the third and fourth side surfaces and wrap-around electrode portions arranged to extend around from the side-surface electrode portions of the second electrode portion to portions of the first and second side surfaces. The wrap-around electrode portions of the second electrode portion reach regions covering portions of outermost inner electrodes located at an outermost side portion among inner electrodes, which portions are exposed in the first and second side surfaces.
Abstract:
A three-terminal multilayer ceramic capacitor includes at least one surface electrode layer on a surface of a second internal electrode layer connected to a lateral surface external electrode. The surface electrode layer includes at least one of Sn, In, Ga, Zn, Bi, Pb, Fe, V, Y or Cu, which is different from a main component of the second internal electrode layer.
Abstract:
A method of manufacturing a multilayer ceramic capacitor includes preparing a laminate including ceramic layers and internal electrode layers arranged in a stacking direction and including two or more exposure regions at which the internal electrode layers and the ceramic layer interposed between the internal electrode layers are both exposed, and transferring a first conductive paste to the laminate. The laminate includes two longitudinal end surfaces, and four surfaces orthogonal or substantially orthogonal to the end surfaces and, on at least one of the four surfaces, a protrusion in which the exposure region protrudes outward. In the transfer step, the first conductive paste is applied to a transfer jig including a groove, and the first conductive paste in the groove is transferred to a surface of the protrusion.