PACKAGE, LIGHT EMITTING DEVICE, AND METHODS OF MANUFACTURING THE PACKAGE AND THE LIGHT EMITTING DEVICE
    21.
    发明申请
    PACKAGE, LIGHT EMITTING DEVICE, AND METHODS OF MANUFACTURING THE PACKAGE AND THE LIGHT EMITTING DEVICE 有权
    包装,发光装置以及制造包装和发光装置的方法

    公开(公告)号:US20160155911A1

    公开(公告)日:2016-06-02

    申请号:US14956393

    申请日:2015-12-02

    Inventor: Koji ABE

    Abstract: A package and a light emitting device with which production of burrs can be suppressed, and methods of manufacturing the package and the light emitting device easily are provided. A package includes a pair of lead electrodes made of metal plates and a resin molded body. A recess portion for mounting a light emitting element is formed. The pair of lead electrodes are exposed on a bottom surface of the recess portion. At least one of the pair of lead electrodes includes a groove portion that is formed on the metal plate and along a periphery of a surface of the metal plate exposed on a bottom surface of the recess portion.

    Abstract translation: 可以抑制毛刺生成的封装和发光装置,容易地制造封装和发光装置的方法。 包装盒包括一对由金属板和树脂成型体制成的引线电极。 形成用于安装发光元件的凹部。 一对引线电极露出在凹部的底面上。 所述一对引线电极中的至少一个包括形成在所述金属板上并沿着露出在所述凹部的底面上的所述金属板的表面的周边的槽部。

Patent Agency Ranking