公开(公告)号：US20250133878A1

公开(公告)日：2025-04-24

申请号：US19000967

申请日：2024-12-24

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H10H20/85 ,  B29C45/00 ,  B29C45/14 ,  H01L23/00 ,  H10H20/01 ,  H10H20/851 ,  H10H20/854 ,  H10H20/856 ,  H10H20/857 ,  H10H20/858

Abstract: A light emitting device includes: a resin package comprising a first lead, a second lead, and a resin part; and a light emitting element disposed on the first lead. The resin package has a rectangular shape in top view and comprises a first outer lateral surface, a second outer lateral surface on a side opposite the first outer lateral surface, a third outer lateral surface, and a fourth outer lateral surface on a side opposite the third outer lateral surface. At the first outer lateral surface, the first lead is exposed from the resin part, and the first lead and a portion of the resin part located at a lateral edge of the first lead are substantially coplanar with each other.

公开(公告)号：US20180006197A1

公开(公告)日：2018-01-04

申请号：US15635203

申请日：2017-06-28

Applicant: NICHIA CORPORATION

Inventor： Taiki YUASA ,  Masaki HAYASHI

IPC: H01L33/50 ,  H01L33/32 ,  H01L27/15 ,  H01L33/60 ,  H01L33/52

CPC classification number: H01L33/504 ,  H01L27/15 ,  H01L33/32 ,  H01L33/507 ,  H01L33/52 ,  H01L33/60

Abstract: A light emitting device includes at least one light emitting element to emit a first light having a first peak emission wavelength in a range of 420 nm to 480 nm and at least one fluorescent material to convert the first light to a second light having a second fluorescent peak wavelength in a range of 610 nm to 750 nm. The second light has chromaticity existing in an enclosed area in a CIE 1931 chromaticity diagram in which chromaticity is defined by x and y coordinates. The enclosed area is enclosed with a first straight line, a second straight line, a third straight line, and a curved line.

公开(公告)号：US20170092816A1

公开(公告)日：2017-03-30

申请号：US15278724

申请日：2016-09-28

Applicant: NICHIA CORPORATION

Inventor： Tadaaki IKEDA ,  Masaki HAYASHI ,  Koji ABE ,  Kimihiro MIYAMOTO

IPC: H01L33/46 ,  H01L33/62 ,  H01L33/48

CPC classification number: H01L33/465 ,  H01L33/44 ,  H01L33/483 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A method of manufacturing a package, the method comprising the steps of: preparing a resin compact having a recess, and including a pair of leads arranged at a bottom surface of the recess, a first resin body forming a lateral wall of the recess, and a second resin body arranged between the pair of leads; forming a reflective film entirely on at least the bottom surface of the recess and an inner surface of the lateral wall of the recess; and removing the reflective film formed on the pair of leads in the recess in the resin compact on which the reflective film has been formed.

公开(公告)号：US20160049566A1

公开(公告)日：2016-02-18

申请号：US14928570

申请日：2015-10-30

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/64 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/486 ,  B29C45/0055 ,  B29C45/14655 ,  B29C2793/009 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/504 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means of an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

Abstract translation: 一种制造具有树脂封装的发光器件的方法，所述树脂封装在热固化之后在350nm和800nm之间的波长处提供等于或大于70％的光学反射率，并且其中树脂部分和引线形成在 在外侧表面上具有大致相同的平面，包括通过上模和下模夹着设置有切口部的引线框架的步骤，将含有光反射材料的热固性树脂转印成型 模具夹在上模具和下模具之间以在引线框架中形成树脂模制体，以及沿切口部分切割树脂模制体和引线框架的步骤。

公开(公告)号：US20130249127A1

公开(公告)日：2013-09-26

申请号：US13893924

申请日：2013-05-14

Applicant: Nichia Corporation

Inventor： Masaki HAYASHI ,  Hiroto TAMAKI ,  Masafumi KURAMOTO ,  Tomohide MIKI ,  Takayuki SANO ,  Tomohisa KISHIMOTO

IPC: B29D11/00

CPC classification number: B29C45/02 ,  B29C45/2806 ,  B29D11/0074 ,  B29K2063/00 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/181 ,  Y10T428/31511 ,  H01L2924/00012

Abstract: A light-emitting device includes a light-emitting element on a molded part. The molded part is formed by molding and curing a thermosetting epoxy resin composition comprising (A) the reaction product of a triazine derived epoxy resin with an acid anhydride, (B) an internal parting agent having m.p. 50-90° C., (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst.

Abstract translation: 发光装置在模制部件上包括发光元件。 模制部件通过模制和固化热固性环氧树脂组合物而形成，该热固性环氧树脂组合物包含（A）三嗪衍生的环氧树脂与酸酐的反应产物，（B）具有m.p。的内分离剂。 50-90℃，（C）反射剂，（D）无机填料和（E）固化催化剂。

公开(公告)号：US20200287096A1

公开(公告)日：2020-09-10

申请号：US16883714

申请日：2020-05-26

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/48 ,  B29C45/00 ,  B29C45/14 ,  H01L33/60 ,  H01L23/00 ,  H01L33/00 ,  H01L33/62 ,  H01L33/64 ,  H01L33/50 ,  H01L33/56

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

公开(公告)号：US20180323357A1

公开(公告)日：2018-11-08

申请号：US16019643

申请日：2018-06-27

Applicant: NICHIA CORPORATION

Inventor： Masaki HAYASHI ,  Tomohisa KISHIMOTO

IPC: H01L33/62 ,  H01L33/60 ,  H01L33/48 ,  H01L33/46 ,  H01L33/20

CPC classification number: H01L33/62 ,  H01L33/20 ,  H01L33/46 ,  H01L33/483 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48247

Abstract: A light emitting device includes: a package forming a recess, having a first lead and a second lead arranged on a bottom surface of the recess and a resin section on a lateralwall of the recess to fix the leads, and being in a substantially rectangular shape surrounded by upper sides of the lateralwalls of the recess; a light emitting element arranged on the first lead and being in a parallelogram shape; a second wire electrically connecting the light emitting element to the second lead; and reflective members covering inner surfaces of the lateralwalls on a diagonal line at corners in the recess, wherein one side of the light emitting element adjacent to the second lead is substantially in parallel to one side of the first lead or the second lead.

公开(公告)号：US20170141273A1

公开(公告)日：2017-05-18

申请号：US15360316

申请日：2016-11-23

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/48 ,  H01L33/56 ,  H01L33/50 ,  H01L33/62 ,  H01L33/60

CPC classification number: H01L33/486 ,  B29C45/0055 ,  B29C45/14655 ,  B29C2793/009 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/504 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

公开(公告)号：US20130235599A1

公开(公告)日：2013-09-12

申请号：US13870587

申请日：2013-04-25

Applicant: NICHIA CORPORATION

Inventor： Masaki HAYASHI

IPC: F21V23/00

CPC classification number: F21V23/001 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/01322 ,  H01L2924/00014

Abstract: A light emitting device comprises a resin molded body having a recess, the recess having a first bottom surface and a second bottom surface arranged at a higher location of an outer periphery than the first bottom surface; a first electrically conductive member and a second electrically conductive member each having terminal portions respectively exposed from a first outer side surface and second outer side surface which are opposite outer side surfaces among the outer side surfaces of the resin molded body; a light emitting element mounted on the first electrically conductive member; a protective element mounted on the second electrically conductive member; and another electrically conductive member separated from the first electrically conductive member and the second electrically conductive member.

Abstract translation: 发光装置包括具有凹部的树脂成形体，所述凹部具有布置在比所述第一底面的外周更高的位置的第一底面和第二底面; 第一导电构件和第二导电构件，每个具有从第一外侧表面和第二外侧表面露出的端子部分，该第一外侧表面和第二外侧表面与树脂模制体的外侧表面相对; 安装在所述第一导电构件上的发光元件; 安装在所述第二导电构件上的保护元件; 以及与第一导电构件和第二导电构件分离的另一个导电构件。

公开(公告)号：US20210336094A1

公开(公告)日：2021-10-28

申请号：US17371943

申请日：2021-07-09

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/64 ,  H01L33/60 ,  H01L33/62 ,  B29C45/00 ,  H01L33/50 ,  H01L23/00 ,  H01L33/56 ,  B29C45/14

Abstract: A light emitting device includes: a resin package including: a resin part, and a plurality of leads including a first lead and a second lead, wherein the resin package has a concave portion having a bottom face at which a part of an upper surface of the first lead and a part of an upper surface of the second lead are exposed from the resin part; a light emitting element mounted on the bottom face of the concave portion; and a sealing member covering the light emitting element in the concave portion. The plurality of leads comprise a plurality of notch parts including a first notch part on a first side corresponding to a first outer side surface of the resin package and a second notch part on a second side corresponding to a second outer side surface of the resin package.