公开(公告)号：US20240280609A1

公开(公告)日：2024-08-22

申请号：US18567345

申请日：2022-06-03

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01R1/067

CPC classification number: G01R1/06761

Abstract: The present invention provides an electrically conductive contact pin formed by laminating a plurality of metal layers, wherein the electrically conductive contact pin has improved physical or electrical properties.

公开(公告)号：US20240229287A1

公开(公告)日：2024-07-11

申请号：US18558360

申请日：2022-05-03

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: C25D11/18

CPC classification number: C25D11/18

Abstract: An anodized film structure according to the present invention comprises: a body, formed from an anodized film material, which is formed by anodizing a base metal and then removing the base metal; through holes having a greater inner width than pores formed during anodizing, and formed through the body; and an inner metal layer provided inside the body. Provided is the anodized film structure having enhanced physical and/or electrical properties to solve the problem of brittle fractures and impart partial conductivity.

公开(公告)号：US20240226994A9

公开(公告)日：2024-07-11

申请号：US18278173

申请日：2022-02-21

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: B22C9/20 ,  B22D19/16

CPC classification number: B22C9/20 ,  B22D19/16

Abstract: Proposed are a highly reliable metal molded article manufactured using a combination of a mold made of an anodic aluminum oxide film and a patternable mold, and a method for manufacturing the same.

公开(公告)号：US20240131576A1

公开(公告)日：2024-04-25

申请号：US18278173

申请日：2022-02-21

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: B22C9/20 ,  B22D19/16

CPC classification number: B22C9/20 ,  B22D19/16

Abstract: Proposed are a highly reliable metal molded article manufactured using a combination of a mold made of an anodic aluminum oxide film and a patternable mold, and a method for manufacturing the same.

公开(公告)号：US20230384346A1

公开(公告)日：2023-11-30

申请号：US18031607

申请日：2021-10-07

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01R1/04 ,  H01R13/24 ,  H01R43/16

CPC classification number: G01R1/0408 ,  H01R13/2407 ,  H01R43/16

Abstract: Proposed are an electrically conductive contact pin, a method for manufacturing the same, an inspection apparatus, a method for manufacturing a molded product, and a molded product manufactured thereby. More specifically, proposed are: a method for manufacturing an electrically conductive contact pin, the method including the steps of providing an anodic aluminum oxide mold made of an anodic aluminum oxide film and having openings formed by etching at least partial regions of the anodic aluminum oxide mold to correspond to a shape of electrically conductive contact pins, forming a metal filler in each of the openings, and removing the anodic aluminum oxide mold; an electrically conductive contact pin including at least one micro-convex portion and a plurality of fine trenches; an inspection apparatus; a method for manufacturing a molded product; and a molded product manufactured thereby.

公开(公告)号：US20230268204A1

公开(公告)日：2023-08-24

申请号：US18020262

申请日：2021-08-11

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Seung Ho PARK ,  Sung Hyun BYUN ,  Jeong Hyuk LEE

IPC: H01L21/67 ,  H01L21/683 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L21/67144 ,  H01L21/6835 ,  H01L25/0753 ,  H01L33/62 ,  H01L2221/68354 ,  H01L2221/68368

Abstract: A microelement transfer system includes a microelement carrier. The microelement carrier includes a first plate, a second plate, and a microelement support. The first plate has a plurality of first through-holes corresponding to respective microelements. The second plate is provided on the first plate and has a second through-hole having a smaller inner diameter than that of the first through-hole. At least one of the first plate and the second plate is made of an anodic oxide film material. The microelement support includes a carrier substrate on which the microelements are temporarily fixed. The microelement transfer system relatively moves at least one of the microelement carrier and the microelement support in at least one direction so that each of the microelements comes into contact with a side wall of a corresponding one of the first through-holes and detaches to be released from the temporarily fixed state.

公开(公告)号：US20220320379A1

公开(公告)日：2022-10-06

申请号：US17254519

申请日：2020-09-08

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L33/48 ,  H01L33/00 ,  H01L27/15

Abstract: Proposed are a micro LED display manufacturing device and a method of manufacturing a micro LED display. More particularly, proposed are a micro LED display manufacturing device and a method of manufacturing a micro LED display, wherein a hybrid transfer process is used.

公开(公告)号：US20220123165A1

公开(公告)日：2022-04-21

申请号：US17607030

申请日：2020-05-07

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L33/00 ,  H01L21/683 ,  H01L25/075

Abstract: The invention provides a micro LED suction body, and a method of manufacturing a micro LED display using the same. Proposed is a micro LED suction body for transferring micro LEDs from a first substrate to a second substrate and, more particularly, is a micro LED suction body for transferring micro LEDs by a vacuum suction method.

公开(公告)号：US20210337674A1

公开(公告)日：2021-10-28

申请号：US17232750

申请日：2021-04-16

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: H05K3/40 ,  G01R1/073

Abstract: Proposed are an anodic aluminum oxide mold made of an anodic aluminum oxide film, a manufacturing method thereof, a half-finished probe product, a manufacturing method thereof, a probe card, and a manufacturing method thereof.

公开(公告)号：US20210307159A1

公开(公告)日：2021-09-30

申请号：US17209178

申请日：2021-03-22

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Dong Eun LEE

IPC: H05K1/03 ,  H05K1/11

Abstract: Proposed is an anodic aluminum oxide structure made of anodic aluminum oxide and, more particularly, is an anodic aluminum oxide structure that minimizes damage to a material in the vicinity of a conductor and prevents a problem of delamination between the conductor and a member existing thereon.