公开(公告)号：US11179030B2

公开(公告)日：2021-11-23

申请号：US16669954

申请日：2019-10-31

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Yudai Shibata ,  Yoshiyuki Takahira ,  Shintaro Hayashi

IPC: A61B1/06 ,  F21V8/00 ,  A61B1/07

Abstract: An illumination device includes a laser light source that emits laser light, a wavelength converter that converts the laser light to converted light of a different wavelength, and a first light guide that mixes the converted light while guiding, and a second light guide that guides the converted light mixed by the first light guide.

公开(公告)号：US10557997B2

公开(公告)日：2020-02-11

申请号：US15454404

申请日：2017-03-09

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroshi Kitano ,  Shintaro Hayashi ,  Yoshiyuki Nakano ,  Hideharu Kawachi

IPC: G02B6/38 ,  G02B6/42 ,  F21V8/00

Abstract: A light source device and a method of manufacturing a light source device are provided. The light source device includes a base. A light-emitter is above the base. A cap is joined to the base to cover the light-emitter. The cap includes an opening in a position corresponding to the light-emitter. A first light guide is in communication with the opening for guiding, to outside of the cap, light emitted by the light-emitter. A first ferrule is provided around the first light guide. The first ferrule is joined to an edge of the opening in a state in which the first ferrule is in the opening.

公开(公告)号：US10174909B2

公开(公告)日：2019-01-08

申请号：US15765261

申请日：2016-10-06

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Masahito Yamana ,  Shintaro Hayashi

IPC: F21V5/04 ,  F21V9/30 ,  G02B3/08 ,  G02B5/18 ,  G02B5/20 ,  F21V5/00 ,  F21Y115/10

Abstract: An optical member includes: a phosphor layer including a phosphor that converts a wavelength of a portion of light from a light source which is incident on an incidence face; and a microlens array that causes the portion of light wavelength-converted by the phosphor layer and the other portion of light transmitted through the phosphor layer to emerge from an emission face, in which a diffractive lens array for diffracting the portion of light wavelength-converted and the other portion of light transmitted is provided on the emission face of the microlens array, and a pitch of the diffractive lens array is different for each of predetermined sections.

公开(公告)号：US20150287696A1

公开(公告)日：2015-10-08

申请号：US14420181

申请日：2013-03-11

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Mitsuhiko Ueda ,  Yoshiharu Sanagawa ,  Takanori Aketa ,  Shintaro Hayashi

IPC: H01L23/00

CPC classification number: H01L24/97 ,  B23K20/00 ,  H01L21/52 ,  H01L21/6836 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/2745 ,  H01L2224/2746 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29013 ,  H01L2224/2908 ,  H01L2224/29082 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/3003 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32501 ,  H01L2224/32505 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75901 ,  H01L2224/7598 ,  H01L2224/8301 ,  H01L2224/83013 ,  H01L2224/83065 ,  H01L2224/83075 ,  H01L2224/8309 ,  H01L2224/83123 ,  H01L2224/83127 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83207 ,  H01L2224/83805 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/83906 ,  H01L2224/83907 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/1461 ,  H01L2224/83 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2924/01032 ,  H01L2924/01083 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A mounting method of mounting chips on a substrate includes a temporarily-bonding process, and a main-bonding process. Temporarily-bonding process is to perform a first basic process, repeatedly depending on the number of the chips. First basic process includes a first step and a second step. First step is to align, on a first metal layer of the substrate, a second metal layer of each chip. Second step is to temporarily bond each chip by subjecting the first and second metal layers to solid phase diffusion bonding. Main-bonding process is to perform a second basic process, repeatedly depending on the number of the chips. Second basic process includes a third step and a fourth step. Third step is to recognize a position of each chip temporarily mounted on the substrate. Fourth step is to firmly bond each chip by subjecting the first and second metal layers to liquid phase diffusion bonding.

Abstract translation: 将芯片安装在基板上的安装方法包括临时粘合工艺和主要粘结工艺。 暂时粘接过程是根据芯片的数量重复执行第一个基本过程。 第一基本过程包括第一步骤和第二步骤。 第一步是在衬底的第一金属层上对准每个芯片的第二金属层。 第二步是通过使第一和第二金属层进行固相扩散接合来临时粘合每个芯片。 主键合过程是根据芯片的数量重复执行第二个基本过程。 第二基本过程包括第三步骤和第四步骤。 第三步是识别临时安装在基板上的每个芯片的位置。 第四步是通过使第一和第二金属层进行液相扩散接合来牢固地结合每个芯片。