Predictive power gating with optional guard mechanism
    23.
    发明授权
    Predictive power gating with optional guard mechanism 有权
    具有可选保​​护机构的预测电源门控

    公开(公告)号:US08219834B2

    公开(公告)日:2012-07-10

    申请号:US12539978

    申请日:2009-08-12

    IPC分类号: G06F1/00 G06F1/26 G06F1/32

    CPC分类号: G06F1/3203

    摘要: A mechanism is provided for predictively power gating a set of units within the data processing system. A second-level power gating controller monitors a set of events for each unit in a set of units within the data processing system. The second-level power gating controller identifies idle sequences of a predetermined set of cycles within the events from each unit where the unit is idle. The second-level power gating controller determines preceding sequences of a predetermined length that precede the idle sequences. The second-level power gating controller determines an accuracy of the preceding sequences. Responsive to the accuracy being above a threshold, the second-level power gating controller sends a permit command to a first-level power gating mechanism associated with the unit to permit power gating of the unit.

    摘要翻译: 提供了用于在数据处理系统内预测性地选通一组单元的机构。 二级电源门控控制器监视数据处理系统内的一组单元中的每个单元的一组事件。 第二级电力门控控制器从单元空闲的每个单元的事件内识别预定的一组周期的空闲序列。 第二级电源门控控制器确定在空闲序列之前的预定长度的先前序列。 二级电源门控控制器确定前面的序列的精度。 响应于精度高于阈值,二级电源门控控制器向与该单元相关联的一级电源门控机构发送许可命令,以允许该单元的电源门控。

    Methods for thermal management of three-dimensional integrated circuits
    24.
    发明授权
    Methods for thermal management of three-dimensional integrated circuits 失效
    三维集成电路热管理方法

    公开(公告)号:US07487012B2

    公开(公告)日:2009-02-03

    申请号:US11747279

    申请日:2007-05-11

    IPC分类号: G05D23/00

    CPC分类号: G05D23/1932

    摘要: A method of dynamic thermal management in a multi-dimensional integrated circuit or device is provided. The method includes monitoring on-chip temperatures, power dissipation, and performance of device layers. The method includes comparing on-chip temperatures to thermal thresholds, on-chip power dissipation to power thresholds and on-chip performance to performance thresholds. Also, the method includes analyzing interactions between temperatures, power, and performance of different device layers within the multi-dimensional integrated circuits. The method includes activating layer-specific thermal and power management within performance constraints on one or more device layers through actuators in the corresponding device layers, depending on the severity of heating.

    摘要翻译: 提供了一种多维集成电路或器件中的动态热管理方法。 该方法包括监测片上温度,功耗和器件层的性能。 该方法包括将片上温度与热阈值进行比较,将片上功耗降至功率阈值,并将片上性能与性能阈值进行比较。 此外,该方法包括分析多维集成电路内不同器件层的温度,功率和性能之间的相互作用。 该方法包括根据加热的严重程度,通过相应设备层中的致动器在一个或多个设备层上的性能约束内激活层特定的热和功率管理。

    Adaptive workload based optimizations coupled with a heterogeneous current-aware baseline design to mitigate current delivery limitations in integrated circuits
    29.
    发明授权
    Adaptive workload based optimizations coupled with a heterogeneous current-aware baseline design to mitigate current delivery limitations in integrated circuits 有权
    基于自适应工作负载的优化与异构电流感知基线设计相结合,以减轻集成电路中的当前传输限制

    公开(公告)号:US08914764B2

    公开(公告)日:2014-12-16

    申请号:US13526252

    申请日:2012-06-18

    IPC分类号: G06F9/455 G06F17/50

    CPC分类号: G06F17/5072 G06F17/5036

    摘要: A dynamic system coupled with “pre-Silicon” design methodologies and “post-Silicon” current optimizing programming methodologies to improve and optimize current delivery into a chip, which is limited by the physical properties of the connections (e.g., Controlled Collapse Chip Connection or C4s). The mechanism consists of measuring or estimating power consumption at a certain granularity within a chip, converting the power information into C4 current information using a method, and triggering throttling mechanisms (including token based throttling) where applicable to limit the current delivery per C4 beyond pre-established limits or periods. Design aids are used to allocate C4s throughout the chip based on the current delivery requirements. The system coupled with design and programming methodologies improve and optimize current delivery is extendable to connections across layers in a multilayer 3D chip stack.

    摘要翻译: 与“前置硅”设计方法和“后硅”当前优化编程方法相结合的动态系统,以改进和优化当前传输到芯片的传输,这受到连接的物理特性的限制(例如,受控崩溃芯片连接或 C4s)。 该机制包括测量或估计芯片内特定粒度的功耗,使用一种方法将功率信息转换为C4当前信息,并在适用的情况下触发限流机制(包括基于令牌的限制),以限制每个C4超过预先的当前传输 - 建立的限制或期限。 设计辅助工具用于根据当前的交付要求在整个芯片上分配C4。 该系统与设计和编程方法相结合,改进并优化电流传递可扩展到多层3D芯片堆叠中的层间连接。

    Measuring data switching activity in a microprocessor
    30.
    发明授权
    Measuring data switching activity in a microprocessor 失效
    测量微处理器中的数据交换活动

    公开(公告)号:US08458501B2

    公开(公告)日:2013-06-04

    申请号:US12844372

    申请日:2010-07-27

    IPC分类号: G06F1/32 G06F3/00

    摘要: A mechanism is provided for approximating data switching activity in a data processing system. A data switching activity identification mechanism in the data processing system receives an identification of a set of data storage devices and a set of bits in the set of data storage devices in the data processing system to be monitored for the data switching activity. The data switching activity identification mechanism sums a count of the identified bits that have changed state for the data storage device along with other counts of the identified bits that have changed state for other data storage devices in the set of data storage devices to form an approximation of data switching activity. A power manager in the data processing system then adjusts a set of operational parameters associated with the data processing system using the approximation of data switching activity.

    摘要翻译: 提供了一种用于近似数据处理系统中的数据交换活动的机制。 数据处理系统中的数据交换活动识别机制在数据处理系统中接收数据存储设备的集合的标识和数据存储设备中的一组位,以对数据交换活动进行监控。 数据交换活动识别机制对数据存储装置的已改变状态的已识别比特的计数与数据存储装置中的其他数据存储装置的已改变状态的识别比特的其他计数相加以形成近似值 的数据交换活动。 数据处理系统中的电源管理器然后使用数据交换活动的近似来调整与数据处理系统相关联的一组操作参数。