公开(公告)号：US06429151B1

公开(公告)日：2002-08-06

申请号：US09619468

申请日：2000-07-19

申请人： John T. Moore ,  Scott J. DeBoer ,  Mark Fischer

发明人： John T. Moore ,  Scott J. DeBoer ,  Mark Fischer

IPC分类号： H01L2131

CPC分类号： H01L21/3185 ,  H01L21/32 ,  H01L21/76202

摘要： In one aspect, the invention includes a method of semiconductive wafer processing comprising forming a silicon nitride layer over a surface of a semiconductive wafer, the silicon nitride layer comprising at least two portions, one of said at least two portions generating a compressive force against the other of the at least two portions, and the other of the at least two portions generating a tensile force against the one of the at least two portions. In another aspect, the invention includes a method of reducing stress on semiconductive wafer, the semiconductive wafer having a pair of opposing surfaces and having more silicon nitride over one of the opposing surfaces than over the other of the opposing surfaces, the method comprising providing the silicon nitride over the one of the opposing surfaces to comprise a first portion, a second portion and a third portion, the first, second and third portions being elevationally displaced relative to one another, the second portion being between the first and third portions, the second portion having a greater stoichiometric amount of silicon than the first and third portions, the semiconductive wafer being subjected to less stress than if the silicon nitride over the one of the opposing surfaces had a constant stoichiometric amount of silicon throughout its thickness. In yet other aspects, the invention includes semiconductive wafer assemblies.

摘要翻译： 在一个方面，本发明包括半导体晶片处理方法，包括在半导体晶片的表面上形成氮化硅层，所述氮化硅层包括至少两个部分，所述至少两个部分中的一个产生抵抗 所述至少两个部分中的另一个，并且所述至少两个部分中的另一部分产生相对于所述至少两个部分中的一个部分的张力。 在另一方面，本发明包括减少半导体晶片上的应力的方法，该半导体晶片具有一对相对的表面，并且在相对表面的一个之上具有比另一个相对表面更多的氮化硅，该方法包括提供 所述相对表面中的一个上的氮化硅包括第一部分，第二部分和第三部分，所述第一部分，第二部分和第三部分相对于彼此正向移位，所述第二部分位于第一部分和第三部分之间， 第二部分具有比第一和第三部分更大的化学计算量的硅，与相对表面上的一个相反的表面上的氮化硅在整个厚度上具有恒定的化学计量的硅时，半导体晶片受到的应力较小。 在另一方面，本发明包括半导体晶片组件。

公开(公告)号：US06372601B1

公开(公告)日：2002-04-16

申请号：US09146838

申请日：1998-09-03

申请人： David L. Dickerson ,  Richard H. Lane ,  Charles H. Dennison ,  Kunal R. Parekh ,  Mark Fischer ,  John K. Zahurak

发明人： David L. Dickerson ,  Richard H. Lane ,  Charles H. Dennison ,  Kunal R. Parekh ,  Mark Fischer ,  John K. Zahurak

IPC分类号： H01L21762

CPC分类号： H01L21/76232 ,  H01L21/0332 ,  H01L21/76235

摘要： In one aspect, the invention includes an isolation region forming method comprising: a) forming an oxide layer over a substrate; b) forming a nitride layer over the oxide layer, the nitride layer and oxide layer having a pattern of openings extending therethrough to expose portions of the underlying substrate; c) etching the exposed portions of the underlying substrate to form openings extending into the substrate; d) after etching the exposed portions of the underlying substrate, removing portions of the nitride layer while leaving some of the nitride layer remaining over the substrate; and e) after removing portions of the nitride layer, forming oxide within the openings in the substrate, the oxide within the openings forming at least portions of isolation regions. In another aspect, the invention includes an isolation region forming method comprising: a) forming a silicon nitride layer over a substrate; b) forming a masking layer over the silicon nitride layer; c) forming a pattern of openings extending through the masking layer to the silicon nitride layer; d) extending the openings through the silicon nitride layer to the underlying substrate, the silicon nitride layer having edge regions proximate the openings and having a central region between the edge regions; e) extending the openings into the underlying substrate; f) after extending the openings into the underlying substrate, reducing a thickness of the silicon nitride layer at the edge regions to thin the edge regions relative to the central region; and g) forming oxide within the openings.

公开(公告)号：US5789304A

公开(公告)日：1998-08-04

申请号：US741832

申请日：1996-10-31

申请人： Mark Fischer ,  Mark Jost ,  Kunal Parekh

发明人： Mark Fischer ,  Mark Jost ,  Kunal Parekh

IPC分类号： H01L21/02 ,  H01L21/8242 ,  H01L21/20

CPC分类号： H01L27/10852 ,  H01L28/40 ,  Y10S148/02

摘要： A semiconductor processing method of forming a stacked container capacitor includes, a) providing a pair of spaced conductive runners relative to a substrate, the conductive runners respectively having electrically insulative sidewall spacers and an electrically insulative cap, the caps having respective outer surfaces; b) providing a node between the runners to which electrical connection to a capacitor is to be made; c) providing an electrically conductive pillar in electrical connection with the node, the pillar projecting outwardly relative to the node between the runners and having a first outer surface positioned outwardly of both runner caps, the pillar completely filling the space between the pair of runners at the location where the pillar is located; d) providing an insulating dielectric layer outwardly of the caps and the conductive pillar; e) etching a container opening through the insulating dielectric layer to outwardly expose the conductive pillar first outer surface; f) etching the exposed conductive pillar to define a pillar second outer surface which is closer to the node than the pillar first outer surface and to deepen the container opening; g) providing an electrically conductive storage node container layer within the container opening over the second outer conductive pillar surface; h) providing a capacitor dielectric layer over the capacitor storage node layer; and i) providing an electrically conductive outer capacitor plate over the capacitor dielectric layer. Such a capacitor construction is also disclosed.

公开(公告)号：US09098458B1

公开(公告)日：2015-08-04

申请号：US13625431

申请日：2012-09-24

申请人： Mark Fischer

发明人： Mark Fischer

IPC分类号： G06F17/14 ,  G06K9/00 ,  G10L17/26 ,  A61B5/00 ,  H04N19/63

CPC分类号： G06F17/148 ,  A01K29/005 ,  A61B5/726 ,  G06K9/00516 ,  G06K9/00536 ,  G10L17/26 ,  H04N19/63

摘要： A method and apparatus for profiling and identifying the source of a signal is provided. A first method includes receiving a signal produced by a known source and creating a matrix of wavelet coefficients corresponding to a wavelet transform of the signal. The method also includes profiling the signal according to an output of a wavelet transform utilizing a particular base function and a particular scale set. A second method includes performing a wavelet transform having a particular profile on a received signal and determining the presence of a particular signal-producing entity as a function of wavelet coefficients exceeding a threshold. An apparatus includes a receiver configured to receive a signal and a processor coupled to the receiver, such that the processor is configured to perform wavelet transforms on the signals. A database is coupled to the processor and configured to store wavelet transform profiles.

公开(公告)号：US08981444B2

公开(公告)日：2015-03-17

申请号：US13302090

申请日：2011-11-22

申请人： Kevin J. Torek ,  Mark Fischer ,  Robert J. Hanson

发明人： Kevin J. Torek ,  Mark Fischer ,  Robert J. Hanson

IPC分类号： H01L27/06 ,  H01L29/78 ,  H01L29/66 ,  H01L27/108

CPC分类号： H01L29/7851 ,  H01L27/10808 ,  H01L27/10826 ,  H01L27/10879 ,  H01L29/66795 ,  H01L29/7853 ,  H01L29/7854

摘要： Novel etch techniques are provided for shaping silicon features below the photolithographic resolution limits. FinFET devices are defined by recessing oxide and exposing a silicon protrusion to an isotropic etch, at least in the channel region. In one implementation, the protrusion is contoured by a dry isotropic etch having excellent selectivity, using a downstream microwave plasma etch.

摘要翻译： 提供了新颖的蚀刻技术，用于在低于光刻分辨率极限的条件下成形硅特征。 FinFET器件通过凹陷氧化物和至少在沟道区域中将硅突起暴露于各向同性蚀刻来限定。 在一个实施方案中，使用下游微波等离子体蚀刻，通过具有优异选择性的干各向同性蚀刻来形成突起。

公开(公告)号：US08742483B2

公开(公告)日：2014-06-03

申请号：US13490369

申请日：2012-06-06

申请人： Mark Fischer

发明人： Mark Fischer

IPC分类号： H01L27/108

CPC分类号： H01L27/108 ,  H01L27/0207 ,  H01L27/10873

摘要： The invention includes methods for utilizing partial silicon-on-insulator (SOI) technology in combination with fin field effect transistor (finFET) technology to form transistors particularly suitable for utilization in dynamic random access memory (DRAM) arrays. The invention also includes DRAM arrays having low rates of refresh. Additionally, the invention includes semiconductor constructions containing transistors with horizontally-opposing source/drain regions and channel regions between the source/drain regions. The transistors can include gates that encircle at least three-fourths of at least portions of the channel regions, and in some aspects can include gates that encircle substantially an entirety of at least portions of the channel regions.

摘要翻译： 本发明包括与鳍式场效应晶体管（finFET）技术结合使用部分绝缘体上硅（SOI）技术的方法，以形成特别适用于动态随机存取存储器（DRAM）阵列的晶体管。 本发明还包括具有低刷新率的DRAM阵列。 另外，本发明包括含有水平相对的源极/漏极区域和在源极/漏极区域之间的沟道区域的晶体管的半导体构造。 晶体管可以包括围绕通道区域的至少部分的至少四分之三的栅极，并且在一些方面可包括围绕通道区域的至少部分的整体的栅极。

公开(公告)号：US08666937B2

公开(公告)日：2014-03-04

申请号：US13047697

申请日：2011-03-14

申请人： Simon Wong ,  Walter Macklem ,  Mark Fischer ,  Orjan Kjellberg ,  Oliver Pin ,  Sonali Agrawal ,  Ron Pragides ,  Etienne Giraudy

发明人： Simon Wong ,  Walter Macklem ,  Mark Fischer ,  Orjan Kjellberg ,  Oliver Pin ,  Sonali Agrawal ,  Ron Pragides ,  Etienne Giraudy

IPC分类号： G06F17/00

CPC分类号： G06F17/30309 ,  G06F17/30607

摘要： In accordance with embodiments, there are provided mechanisms and methods for versioning content in a database system using content type specific objects. These mechanisms and methods for versioning content in a database system using content type specific objects can enable embodiments to provide a database system which stores information associated with multiple versions of content. The ability of embodiments to provide a database system which supports content versioning can enable an efficient and comprehensive storage of content types having different features by the database system.

摘要翻译： 根据实施例，提供了使用内容类型特定对象在数据库系统中对内容进行版本化的机制和方法。 用于使用内容类型特定对象对数据库系统中的内容进行版本化的这些机制和方法可使实施例能够提供存储与多个内容版本相关联的信息的数据库系统。 实施例提供支持内容版本化的数据库系统的能力可以实现数据库系统具有不同特征的内容类型的有效和全面的存储。

公开(公告)号：US20120190184A1

公开(公告)日：2012-07-26

申请号：US13440383

申请日：2012-04-05

申请人： Mark Fischer ,  T. Earl Allen ,  H. Montgomery Manning

发明人： Mark Fischer ,  T. Earl Allen ,  H. Montgomery Manning

IPC分类号： H01L21/283 ,  H01L21/302

CPC分类号： H01L29/785 ,  H01L29/66818 ,  H01L29/7853 ,  Y10S438/947

摘要： A process may include forming a mask directly on and above a region selected as an initial semiconductor fin on a substrate and reducing the initial semiconductor fin forming a semiconductor fin that is laterally thinned from the initial semiconductor fin. The process may be carried out causing the mask to recede to a greater degree in the lateral direction than the vertical direction. In various embodiments, the process may include removing material from the fin semiconductor to achieve a thinned semiconductor fin, which has receded beneath the shadow of the laterally receded mask. Electronic devices may include the thinned semiconductor fin as part of a semiconductor device.

摘要翻译： 工艺可以包括在衬底上直接在选择为初始半导体鳍片的区域之上和之上形成掩模，并且减少形成从初始半导体鳍片横向变薄的半导体鳍片的初始半导体鳍片。 可以进行该处理，使得掩模在横向上比垂直方向更大程度地退回。 在各种实施例中，该方法可以包括从散热片半导体去除材料以实现已经在横向退绕的掩模的阴影之下的减薄的半导体鳍片。 电子器件可以包括作为半导体器件的一部分的变薄的半导体鳍片。

公开(公告)号：US08217441B2

公开(公告)日：2012-07-10

申请号：US12186726

申请日：2008-08-06

申请人： Mark Fischer

发明人： Mark Fischer

IPC分类号： H01L27/108 ,  H01L21/94 ,  H01L21/336

CPC分类号： H01L27/108 ,  H01L27/0207 ,  H01L27/10873

摘要： The invention includes methods for utilizing partial silicon-on-insulator (SOI) technology in combination with fin field effect transistor (finFET) technology to form transistors particularly suitable for utilization in dynamic random access memory (DRAM) arrays. The invention also includes DRAM arrays having low rates of refresh. Additionally, the invention includes semiconductor constructions containing transistors with horizontally-opposing source/drain regions and channel regions between the source/drain regions. The transistors can include gates that encircle at least three-fourths of at least portions of the channel regions, and in some aspects can include gates that encircle substantially an entirety of at least portions of the channel regions.

摘要翻译： 本发明包括与鳍式场效应晶体管（finFET）技术结合使用部分绝缘体上硅（SOI）技术的方法，以形成特别适用于动态随机存取存储器（DRAM）阵列的晶体管。 本发明还包括具有低刷新率的DRAM阵列。 另外，本发明包括含有水平相对的源极/漏极区域和在源极/漏极区域之间的沟道区域的晶体管的半导体构造。 晶体管可以包括围绕通道区域的至少部分的至少四分之三的栅极，并且在一些方面可包括围绕通道区域的至少部分的整体的栅极。

公开(公告)号：US08207032B2

公开(公告)日：2012-06-26

申请号：US12872705

申请日：2010-08-31

申请人： Mark Fischer ,  Sanh D. Tang

发明人： Mark Fischer ,  Sanh D. Tang

IPC分类号： H01L21/8242 ,  H01L21/8238

CPC分类号： H01L27/10876 ,  H01L21/823425 ,  H01L21/823487 ,  H01L27/2454 ,  H01L29/0653 ,  H01L29/42368 ,  H01L29/456 ,  H01L29/66666 ,  H01L29/7827 ,  H01L45/06 ,  H01L45/1233

摘要： Some embodiments include methods of forming vertical transistors. A construction may have a plurality of spaced apart fins extending upwardly from a semiconductor substrate. Each of the fins may have vertical transistor pillars, and each of the vertical transistor pillars may have a bottom source/drain region location, a channel region location over the bottom source/drain region location, and a top source/drain region location over the channel region location. Electrically conductive gate material may be formed along the fins while using oxide within spaces along the bottoms of the fins to offset the electrically conductive gate material to be above the bottom source/drain region locations of the vertical transistor pillars. The oxide may be an oxide which etches at a rate of at least about 100 Å/minute with dilute HF at room temperature. In some embodiments the oxide may be removed after the electrically conductive gate material is formed.

摘要翻译： 一些实施例包括形成垂直晶体管的方法。 结构可以具有从半导体衬底向上延伸的多个间隔开的翅片。 每个鳍片可以具有垂直的晶体管柱，并且每个垂直晶体管柱可以具有底部源极/漏极区域位置，在底部源极/漏极区域位置上方的沟道区域位置，以及顶部源极/漏极区域 渠道区域位置。 导电栅极材料可以沿着鳍片形成，同时沿着鳍状物的底部在空间内使用氧化物以将导电栅极材料偏移到垂直晶体管柱的底部源极/漏极区域的上方。 氧化物可以是在室温下用稀释HF以至少约100埃/分钟的速率蚀刻的氧化物。 在一些实施例中，可以在形成导电栅极材料之后去除氧化物。