公开(公告)号：US20160266596A1

公开(公告)日：2016-09-15

申请号：US15164130

申请日：2016-05-25

Applicant: QUALCOMM Incorporated

Inventor： Ryan Michael Coutts ,  Mikhail Popovich

IPC: G05F3/02 ,  H01L23/64 ,  H01L23/00 ,  H01L49/02

CPC classification number: G05F3/02 ,  G05F1/00 ,  G06F1/3287 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/62 ,  H01L23/647 ,  H01L24/16 ,  H01L28/40 ,  H01L2224/16227 ,  H01L2924/15311 ,  Y02D10/171

Abstract: In one embodiment, an apparatus comprises a capacitor and a die. The die comprises a resistor switch coupled between a power line and the capacitor, wherein the resistor switch has an adjustable resistance, and the power line and the capacitor are both external to the die. The die also comprises a circuit configured to receive power from the power line, and a controller configured to open the resistor switch if the power line is powered down.

Abstract translation: 在一个实施例中，装置包括电容器和管芯。 管芯包括耦合在电源线和电容器之间的电阻器开关，其中电阻器开关具有可调电阻，并且电源线和电容器都在管芯外部。 芯片还包括被配置为从电力线接收电力的电路，以及配置成如果电源线断电则打开电阻器开关的控制器。

公开(公告)号：US20160092616A1

公开(公告)日：2016-03-31

申请号：US14502752

申请日：2014-09-30

Applicant: QUALCOMM Incorporated

Inventor： Ryan Michael Coutts ,  Arpit Mittal ,  Rajat Mittal ,  Mohamed Waleed Allam ,  Mehdi Saeidi

IPC: G06F17/50 ,  G06F17/15

CPC classification number: G06F17/5009 ,  G06F17/15 ,  G06F17/5068 ,  G06F2217/78 ,  G06F2217/80

Abstract: Systems and methods for performing thermal simulations of a system are disclosed herein in. In one embodiment, a computer-implemented method for thermal simulation comprises determining a leakage power profile for a circuit in the system, adding the leakage power profile to a dynamic power profile of the circuit to obtain a combined power profile, and convolving the combined power profile with an impulse response to obtain a thermal response at a location on the system.

Abstract translation: 用于执行系统的热仿真的系统和方法在本文中公开。在一个实施例中，用于热仿真的计算机实现的方法包括确定系统中的电路的泄漏功率分布，将泄漏功率分布添加到动态功率分布 以获得组合的功率曲线，以及将组合的功率曲线与脉冲响应进行卷积以在系统上的位置处获得热响应。

公开(公告)号：US20150293551A1

公开(公告)日：2015-10-15

申请号：US14250150

申请日：2014-04-10

Applicant: QUALCOMM Incorporated

Inventor： Ryan Michael Coutts ,  Mikhail Popovich

IPC: G05F3/02

CPC classification number: G05F3/02 ,  G05F1/00 ,  G06F1/3287 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/62 ,  H01L23/647 ,  H01L24/16 ,  H01L28/40 ,  H01L2224/16227 ,  H01L2924/15311 ,  Y02D10/171

Abstract: In one embodiment, an apparatus comprises a capacitor and a die. The die comprises a resistor switch coupled between a power line and the capacitor, wherein the resistor switch has an adjustable resistance, and the power line and the capacitor are both external to the die. The die also comprises a circuit configured to receive power from the power line.

Abstract translation: 在一个实施例中，装置包括电容器和管芯。 管芯包括耦合在电源线和电容器之间的电阻器开关，其中电阻器开关具有可调电阻，并且电源线和电容器都在管芯外部。 芯片还包括被配置为从电力线接收电力的电路。

公开(公告)号：US20150237714A1

公开(公告)日：2015-08-20

申请号：US14185505

申请日：2014-02-20

Applicant: QUALCOMM Incorporated

Inventor： Ryan Michael Coutts ,  Yuancheng Christopher Pan

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/30 ,  H05K1/18 ,  H05K1/09

CPC classification number: H05K1/0231 ,  H01L23/49822 ,  H01L23/642 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2924/15311 ,  H05K1/185 ,  H05K3/4697 ,  H05K2201/093 ,  H05K2201/10015 ,  H01L2924/014

Abstract: A package substrate is provided that includes a substrate and a capacitor. The substrate comprises a cavity penetrating a core layer and metal layers of the substrate. The capacitor comprises electrode pads and is disposed in the cavity. One of the metal layers of the substrate includes a discontinuous metal plane, and the electrode pads directly contact the discontinuous metal plane.

Abstract translation: 提供了包括基板和电容器的封装基板。 衬底包括穿透芯层的空腔和衬底的金属层。 电容器包括电极焊盘并且设置在空腔中。 衬底的金属层之一包括不连续的金属平面，并且电极焊盘直接接触不连续的金属平面。

公开(公告)号：US20150198933A1

公开(公告)日：2015-07-16

申请号：US14157503

申请日：2014-01-16

Applicant: QUALCOMM Incorporated

Inventor： Ryan Michael Coutts

IPC: G05B13/02 ,  G01R19/00 ,  G01R21/00 ,  H03K17/687 ,  G01R27/26

CPC classification number: G05B13/0205 ,  G01R19/0084 ,  G01R21/006 ,  G01R27/2605 ,  H03K17/687 ,  H03K19/0016 ,  H03K19/00315 ,  Y10T307/76

Abstract: A method for powering up a circuit comprising a plurality of sections of progressively increasing size is described. The method comprises receiving a signal for powering up the circuit, and, in response to the signal, sequentially powering up the plurality of sections in an order of increasing size.

Abstract translation: 描述了一种用于为逐渐增加大小的多个部分提供电路的方法。 该方法包括接收用于为电路加电的信号，并且响应于该信号，按照增大尺寸的顺序依次对多个部分供电。