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公开(公告)号：US20240164054A1
公开(公告)日：2024-05-16
申请号：US18154791
申请日：2023-01-13
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Chang-Yu CHIANG
CPC classification number: H05K7/20272 , F04D3/005 , F04D29/181 , H05K7/20236 , H05K7/20772
Abstract: A single-phase immersion cooling system includes an immersion cooling tank having a component area, which is separate from a main chamber and is configured to receive a heat-generating electronic device. A coolant circulates along a flow path, in a chamber path through the main chamber and a component path through the component area. A rotating propeller is mounted within the immersion cooling tank, causing a driven flow path in the component area. The driven flow path is configured to cause contact between the coolant in the driven flow path and the heat-generating electronic device when the heat-generating electronic device is received within the component area. The coolant in the driven flow path circulates at a faster speed than the coolant in the chamber path.
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公开(公告)号：US20240057284A1
公开(公告)日：2024-02-15
申请号：US18055650
申请日：2022-11-15
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Herman TAN , Tien-Juei CHUANG
IPC: H05K7/20
CPC classification number: H05K7/20263 , H05K7/20272 , H05K7/20318 , H05K7/20718 , H05K7/20254 , H05K7/20763 , H05K7/208
Abstract: A system for cooling a heat-generating electronic component includes a first stage, a second stage, and a heat exchanger. The first stage has a first cooling path that circulates a first cooling fluid past the heat-generating electronic component to cause the first cooling fluid to absorb heat from the heat-generating electronic component and the temperature of the first cooling fluid to increase. The second stage circulates a second cooling fluid to increase a pressure of the second cooling fluid, remove heat from the second cooling fluid to decrease a temperature of the second cooling fluid, and decrease the pressure of the second cooling fluid to further decrease the temperature of the second cooling fluid. The heat exchanger is fluidly connected to the first stage and the second stage, and causes the second cooling fluid to flow past and absorb heat from the first cooling fluid.
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公开(公告)号：US20230262926A1
公开(公告)日：2023-08-17
申请号：US17660631
申请日：2022-04-25
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Cheng-Yu WEN , Hung-Yuan CHEN
IPC: H05K7/20
CPC classification number: H05K7/20263 , H05K7/20254 , H05K7/20772
Abstract: A cooling system for a heat-generating electronic device includes a cold plate module, a flow channel, and a fin arrangement. The cold plate module includes a base plate and a top cover. The flow channel is for a liquid coolant and extends between an inlet connector and an outlet connector. The liquid coolant flows along a flow direction. The fin arrangement is located between the base plate and the top cover. The fin arrangement is thermally coupled to the flow channel and is eccentrically located relative to the cold plate module.
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公开(公告)号：US20190219058A1
公开(公告)日：2019-07-18
申请号：US15994667
申请日：2018-05-31
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Herman TAN
CPC classification number: H05K7/20172 , F04D29/646 , F05B2240/12 , F05B2240/14 , F05B2250/50 , H05K7/20727
Abstract: A cooling system for providing streamlined airflow is provided. The system includes a fan assembly that includes an inlet side and an outlet side. The fan assembly also includes an inlet fan guard connector located at the inlet side of the fan assembly and an outlet fan guard connector located at the outlet side of the fan assembly. The fan assembly also includes a lever housings located between the inlet fan guard connector and the outlet fan guard connector and a slots oriented between the lever housings and the inlet fan guard connector and the outlet fan guard connector, the plurality of slots configured to secure an additional modular component.
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公开(公告)号：US20190159361A1
公开(公告)日：2019-05-23
申请号：US15949423
申请日：2018-04-10
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Herman TAN , Chih-Wei LIN
IPC: H05K7/20 , H05K7/14 , G10K11/162
Abstract: An apparatus is provided that includes a first distal end and a second distal end. The apparatus also includes a first connecting member located at the first distal end and a second connecting member located at the second distal end. The apparatus also includes at least one bracket secured within the apparatus at the first and second connecting members. The bracket includes a flow guiding depressions and micro pores. The apparatus also includes a plate configured to abut the bracket within the apparatus. The first and second connecting members are configured to connect the apparatus within a server device.
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Patent Agency Ranking
公开(公告)号：US20190025529A1
公开(公告)日：2019-01-24
申请号：US15876572
申请日：2018-01-22
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Kuen-Hsien WU , Kuo-Wei LEE
IPC: G02B6/42
Abstract: A transceiver cage and heat sink assembly for an optical switch is disclosed. A transceiver cage has an open front end to receive an optical transceiver and an opposite rear end. A front heat sink is mounted over the transceiver cage that includes a thermal interface material to contact a contact surface of an optical transceiver. A printed circuit board has a connector electronic circuit to receive a connector on the optical transceiver. A rear heat sink has a beveled surface facing the rear end of the transceiver cage. A cam structure in the front heat sink forces the transceiver into contact with the front heat sink. A metal foil layer is coated on the thermal interface material.
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公开(公告)号：US20180197523A1
公开(公告)日：2018-07-12
申请号：US15401976
申请日：2017-01-09
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Ching-Yu CHEN , Tsung-Ta LI
IPC: G10K11/16 , G10K11/175
CPC classification number: G10K11/161 , F04D25/166 , F04D29/663 , F04D29/664 , G10K11/175 , G11B33/08 , G11B33/128 , G11B33/142
Abstract: An anti-acoustics streamline apparatus is provided. The apparatus includes an air impedance wall having a front face, a rear face, and a plurality of openings extending from the front face to the rear face defining open areas; and a plurality of flow separating structures disposed adjacent to the front face, each of the plurality of flow separating structure extending vertically along the front face of the wall. The openings are configured to define first wall regions in the air impedance wall adjacent to each of the plurality of flow separating structures and second wall regions between the first wall regions. A first ratio of the open areas in the first wall regions to a total area in first wall regions is less than a second ratio of the open areas in the second wall regions to a total area in the second wall regions.
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公开(公告)号：US20150277519A1
公开(公告)日：2015-10-01
申请号：US14519640
申请日：2014-10-21
Applicant: QUANTA COMPUTER INC.
Inventor： Sung-Fong YANG , Chang-Chun LAN , Yu-Nien HUANG , Shun-Ta YU , Wei-Che YEH
CPC classification number: G06F1/203 , H05K7/20154
Abstract: An electrical device having thermal isolation function includes a housing, a heat-generating source, a heat-conductive member, and a thermal isolation plate. The housing includes an accommodation space therein, an inner surface and an outer surface which is opposite to the inner surface. The heat-generating source is disposed in the accommodation space. The heat-conductive member is disposed in the accommodation space, and is in contact with the heat-generating source. The thermal isolation plate is disposed between the heat-conductive member and the inner surface of the housing, and the thermal isolation plate is formed with a vacuum camber therein.
Abstract translation: 具有热隔离功能的电气装置包括壳体，发热源，导热构件和热隔离板。 壳体包括其中的容纳空间，内表面和与内表面相对的外表面。 发热源设置在容纳空间中。 导热构件设置在容纳空间中，并与发热源接触。 热绝缘板设置在导热构件和壳体的内表面之间，并且热隔离板在其中形成有真空外壳。
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公开(公告)号：US20250040099A1
公开(公告)日：2025-01-30
申请号：US18481130
申请日：2023-10-04
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Herman TAN
IPC: H05K7/20
Abstract: The present disclosure relates to a rack unit for circulating coolant to equipment racks. The rack unit has a cold coolant manifold for supplying coolant to an electronic component such as a server. The rack unit has a pump fluidly coupled to the cold coolant manifold for circulating the coolant. The rack unit has a hot coolant manifold for collecting hot coolant from the electronic component. The rack unit has a liquid-to-liquid heat exchanger fluidly coupled to the cold coolant manifold and the hot coolant manifold to form a first coolant loop. The first coolant loop transfers heat to a second coolant loop formed in part by the liquid-to-liquid heat exchanger.
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公开(公告)号：US20240237296A1
公开(公告)日：2024-07-11
申请号：US18180687
申请日：2023-03-08
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Kun-Pei LIU , Yu-Nien HUANG
CPC classification number: H05K7/20636 , F28F3/02 , H05K7/20254 , H05K7/20263 , H05K7/20272 , F28F2260/02
Abstract: A cooling assembly for liquid cooling of a heat-generating component such as a dual in-line memory module (DIMM) in a computer device is disclosed. The cooling assembly includes a bracket holding a micro-pipe assembly. The micro-pipe assembly has a cold manifold, a hot manifold and a series of micro-pipes. The micro-pipes are fluidly coupled between the cold manifold and hot manifold to allow coolant flow between the cold manifold and the hot manifold. The bracket positions the micro-pipe assembly such that micro-pipes are positioned proximate to opposite sides of the heat-generating component. A coolant inlet supplies coolant to the cold manifold and a coolant outlet collecting coolant from the hot manifold.
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