-
公开(公告)号:US20210084765A1
公开(公告)日:2021-03-18
申请号:US16477477
申请日:2017-12-07
Applicant: Robert Bosch GmbH
Inventor: Udo Kaess , Uwe Liskow , Markus Weiss
IPC: H05K1/14
Abstract: A method for mechanically connecting a first electronic component, in particular a circuit board element, to a second electronic component, in particular a second circuit board element, includes arranging and orienting the first electronic component, which includes a first through-opening in a first direction, above the second electronic component in the first direction in such a way that a second through opening in the first direction or a blind hole in the first direction is arranged at least partially below the first through-opening in the first direction. The method further includes introducing a casting compound into the first through-opening and into the second through-opening or into the first through-opening and into the blind hole, and setting the casting compound in order to fix the first electronic component in relation to the second electronic component.
-
公开(公告)号:US10653020B2
公开(公告)日:2020-05-12
申请号:US16481281
申请日:2018-01-23
Applicant: Robert Bosch GmbH
Inventor: Uwe Liskow
Abstract: An electronic module includes a printed circuit board (PCB) element, a base with a first electrically conductive contact element, and an electronic component with a second electrically conductive contact element. The base is fastened on and electrically connected to the PCB element. The electronic component is electrically connected to the base by an electric contact region between the first and second contact elements. A first portion of the first contact element protrudes from the base on a first side of the base facing away from the PCB element. The first portion of the first contact element and/or a second portion of the second contact element has a resilient configuration such that the electronic component is mechanically fastened to the base by a spring force between the first and second contact elements. The electronic module in one embodiment is configured for a transmission controller or an electric vehicle.
-
公开(公告)号:US20200045839A1
公开(公告)日:2020-02-06
申请号:US16481281
申请日:2018-01-23
Applicant: Robert Bosch GmbH
Inventor: Uwe Liskow
Abstract: An electronic module includes a printed circuit board (PCB) element, a base with a first electrically conductive contact element, and an electronic component with a second electrically conductive contact element. The base is fastened on and electrically connected to the PCB element. The electronic component is electrically connected to the base by an electric contact region between the first and second contact elements. A first portion of the first contact element protrudes from the base on a first side of the base facing away from the PCB element. The first portion of the first contact element and/or a second portion of the second contact element has a resilient configuration such that the electronic component is mechanically fastened to the base by a spring force between the first and second contact elements. The electronic module in one embodiment is configured for a transmission controller or an electric vehicle
-
公开(公告)号:US10237979B2
公开(公告)日:2019-03-19
申请号:US15736749
申请日:2016-06-06
Applicant: Robert Bosch GmbH
Inventor: Uwe Liskow
Abstract: An electronic module includes a circuit board, a first component, and a socket element with a first surface and a second surface opposite the first surface. The first surface lies on a surface of the circuit board and is fixed to the circuit board. A second component is secured to the socket element and is electrically connected to the circuit board via the socket element. A protective compound is arranged on the surface of the circuit board and encapsulates the first component. The socket element is partly embedded into the protective compound such that lateral flanks of the socket element are covered by the protective compound, and the second surface of the socket element protrudes out of the protective compound. Connection elements of the socket element and connections of the second component are connected via a welding connection. Second components are attachable to the circuit board in a reliable manner.
-
25.
公开(公告)号:US20180352666A1
公开(公告)日:2018-12-06
申请号:US15779254
申请日:2016-10-19
Applicant: Robert Bosch GmbH
Inventor: Uwe Liskow
CPC classification number: H05K5/0082 , H05K1/144 , H05K3/28 , H05K3/368 , H05K5/0069 , H05K5/06 , H05K5/062 , H05K2201/047
Abstract: An electronic module includes a first circuit board. The first circuit board has electronic components, spacers, a cover plate, and a casting compound. The spacers are positioned so as to rest at least in corner regions of the first circuit board. The cover plate is positioned on the spacers. The casting compound acts as an end face and seals a gap formed by the spacers between the first circuit board and the cover plate, so as to form a housing for the electronic components, which are positioned therein. The casting compound secures the cover plate to the first circuit board via positive engagement. A coefficient of linear thermal expansion of the casting compound corresponds substantially to a coefficient of linear thermal expansion of the circuit board and of the cover plate.
-
公开(公告)号:US10098240B2
公开(公告)日:2018-10-09
申请号:US15106634
申请日:2014-11-10
Applicant: Robert Bosch GmbH
Inventor: Uwe Liskow
IPC: H05K3/32 , H05K3/34 , H05K5/00 , H05K1/02 , H05K1/18 , H05K3/30 , H01R12/51 , H01R12/57 , H01R12/62 , H05K1/11
Abstract: An electronic control module includes a printed circuit board and an electrical component. The circuit board has a contact area arranged on a component side. The electrical component has an electrical connection element with a connection section running parallel to the component side and is electrically connected to the contact area. An adapter is arranged on the circuit board independently of the electrical component and has a holding body fastened to the circuit board outside the contact area and a metal web. The web is arranged on the holding body and has a contact section running parallel to the component side. The contact section and the connection section lie atop another and are welded to one another in a covering area. The web or the connection element makes electrical contact with the contact area by an electrically conductive material applied to the contact area.
-
公开(公告)号:US20180124956A1
公开(公告)日:2018-05-03
申请号:US15569253
申请日:2016-03-02
Applicant: Robert Bosch GmbH
Inventor: Uwe Liskow
IPC: H05K7/20
Abstract: An electronic assembly for a transmission control module includes a printed circuit board and a heat sink. The circuit board includes a first side, a second side averted from the first side, and at least one heat-generating component arranged on the first side and covered with at least one flowable and curable protective compound. The heat sink has an inner face facing the second side and is, at least in sections, spaced apart from the circuit board by at least one gap. The gap is at least partially filled with the at least one flowable and curable protective compound such that the flowable and curable protective compound is in direct contact with the circuit board and the heat sink. The heat sink adheres to the protective compound in a cohesive manner when the flowable and curable protective compound is in the cured state.
-
公开(公告)号:US09642288B2
公开(公告)日:2017-05-02
申请号:US14367180
申请日:2012-11-14
Applicant: Robert Bosch GmbH
Inventor: Uwe Liskow , Peter Klobes , Thomas Meier
CPC classification number: H05K7/20854 , F16H61/0006 , H01L2224/48091 , H01L2224/48472 , H01L2224/73265 , H05K1/0204 , H05K1/142 , H05K3/301 , H05K5/0082 , H05K7/209 , Y10T29/4913 , H01L2924/00014 , H01L2924/00
Abstract: A control device includes a first circuit carrier with electrical components that are electrically conductively connected to one another and a second circuit carrier with electrical components that are electrically conductively connected to one another. The first circuit carrier and the second circuit carrier are electrically conductively connected to one another. The second circuit carrier is fixedly connected in thermally conductive fashion to a fluid-tight thermally conductive carrier element. The second circuit carrier and the carrier element are arranged in a cutout of the first circuit carrier. The carrier element has better thermal conductivity than the first circuit carrier and can be thermally conductively connected to a heat sink. The carrier element is integrated in fluid-tight fashion in an internal region of the first circuit carrier.
-
公开(公告)号:US09516750B2
公开(公告)日:2016-12-06
申请号:US14363541
申请日:2012-11-20
Applicant: Robert Bosch GmbH
Inventor: Uwe Liskow
CPC classification number: H05K1/11 , F16H61/0251 , H05K1/021 , H05K1/0296 , H05K1/112 , H05K1/181 , H05K3/303 , H05K3/3421 , H05K2201/10424 , H05K2201/2018 , Y02P70/613
Abstract: A control unit for a motor vehicle has an electrical SMD (surface mounted device) component having at least one corresponding connection pin and a circuit board. The circuit board has at least one soldering surface. The soldering surface is permanently connected to the circuit board. The soldering surface and the connection pin are connectable to each other in an electrically conductive and firmly bonded manner by a soldering process. According to the disclosure, a contact hold-down piece is permanently connected to the circuit board. The connection pin is positioned in such a manner by the contact hold-down piece that, when the connection pin is connected to the soldering surface in an integrally bonded manner, the connection pin and the circuit board have a predetermined distance from each other.
Abstract translation: 用于机动车辆的控制单元具有至少一个对应的连接销和电路板的电子SMD(表面安装装置)部件。 电路板具有至少一个焊接表面。 焊接表面永久连接到电路板。 焊接表面和连接销可以通过焊接工艺以导电和牢固结合的方式彼此连接。 根据本公开,触点压紧件永久地连接到电路板。 连接销以这样的方式被接触压紧件定位,当连接销以整体连接的方式连接到焊接表面时,连接销和电路板彼此具有预定的距离。
-
-
-
-
-
-
-
-