公开(公告)号：US07765872B2

公开(公告)日：2010-08-03

申请号：US12273912

申请日：2008-11-19

申请人： Gilberto Morales ,  Carl Stewart ,  Scott Edward Beck ,  Richard Alan Davis

发明人： Gilberto Morales ,  Carl Stewart ,  Scott Edward Beck ,  Richard Alan Davis

IPC分类号： G01L7/00

CPC分类号： G01L19/0023 ,  G01F1/363 ,  G01F1/48 ,  Y10T29/49002 ,  Y10T29/49826

摘要： A flow sensor apparatus that utilizes a pressure sensor with media isolated electrical connections. A cap can be attached to topside of the pressure sensor over a diaphragm to protect bond pads and wire bonds from a fluid media. A flow channel can be etched on the cap with an opening and exit on the sides of the cap so that liquid can flow through the flow channel. An inlet port and an outlet port can be attached to the channel's opening and exit to allow for fluid flow over the diaphragm. The flow channel creates a larger pressure over portions of the diaphragm that increases the deflection of the diaphragm, which increases an output signal of the pressure sensor. V-grooves can be created on two sides of the pressure sensor and in the cap to create the channel for the fluid in and out of the cap's cavity.

摘要翻译： 一种使用具有介质隔离电气连接的压力传感器的流量传感器装置。 盖可以通过隔膜连接到压力传感器的顶部，以保护接合垫和引线接合与流体介质。 可以在盖上蚀刻流动通道，其开口和出口在盖的侧面上，使得液体可以流过流动通道。 入口和出口可以连接到通道的开口和出口，以允许流体流过隔膜。 流动通道在膜片的部分上产生较大的压力，这增加了膜片的偏转，这增加了压力传感器的输出信号。 可以在压力传感器和盖子的两侧上形成V形槽，以形成流体进出盖体腔体的通道。

公开(公告)号：US20090007681A1

公开(公告)日：2009-01-08

申请号：US11825237

申请日：2007-07-05

申请人： Carl E. Stewart ,  Gilberto Morales ,  Richard A. Davis

发明人： Carl E. Stewart ,  Gilberto Morales ,  Richard A. Davis

IPC分类号： G01L9/06 ,  H01B13/00

CPC分类号： G01L9/0042 ,  G01L9/0054

摘要： A gauge pressure sensor apparatus and a method of forming the same. A constraint wafer can be partially etched to set the diaphragm size, followed by bonding to a top wafer. The thickness of the top wafer is either the desired diaphragm thickness or is thinned to the desired thickness after bonding. The bonding of top wafer and constraint wafer enables electrochemical etch stopping. This allows the media conduit to be etched through the back of the constraint wafer and an electrical signal produced when the etching reaches the diaphragm. The process prevents the diaphragm from being over-etched. The invention allows the die size to be smaller than die where the diaphragm size is set by etching from the back side.

摘要翻译： 表压传感器装置及其形成方法。 可以部分地蚀刻约束晶片以设置膜片尺寸，然后粘结到顶部晶片。 顶部晶片的厚度是所需的隔膜厚度，或者在粘结后被减薄到所需的厚度。 顶部晶片和约束晶片的结合使得电化学蚀刻停止。 这允许介质管道被蚀刻通过约束晶片的背面和当蚀刻到达隔膜时产生的电信号。 该过程防止隔膜过度蚀刻。 本发明允许模具尺寸小于通过从背面蚀刻设置膜片尺寸的模具。

公开(公告)号：US07278309B2

公开(公告)日：2007-10-09

申请号：US11366653

申请日：2006-03-01

申请人： Anthony M. Dmytriw ,  Wayne T. Kilian ,  Jamie W. Speldrich ,  Scott Edward Beck ,  Gilberto Morales ,  Richard William Gehman

发明人： Anthony M. Dmytriw ,  Wayne T. Kilian ,  Jamie W. Speldrich ,  Scott Edward Beck ,  Gilberto Morales ,  Richard William Gehman

IPC分类号： G01F1/68

CPC分类号： G01F1/6845 ,  G01F1/688

摘要： A sensor apparatus includes a heating element comprising an upstream side and a downstream side. A first heat sensing set is generally configured adjacent to the upstream side of the heating element and comprises a first sensing element and a second sensing element, the first and second sensing elements configured in a serpentine, interdigitated pattern. A second heat sensing set can be configured adjacent to the downstream side of the heating element and comprises a third sensing element and a fourth sensing element, the third and fourth sensing elements configured in a serpentine, interdigitated pattern.

摘要翻译： 传感器装置包括加热元件，该加热元件包括上游侧和下游侧。 第一感测组件通常配置成与加热元件的上游侧相邻，并且包括第一感测元件和第二感测元件，第一和第二感测元件被构造成蛇形，交错图案。 第二感测组可以被配置成与加热元件的下游侧相邻，并且包括第三感测元件和第四感测元件，第三和第四感测元件被构造成蛇形，叉指形式。

公开(公告)号：US08033180B2

公开(公告)日：2011-10-11

申请号：US12779657

申请日：2010-05-13

申请人： Gilberto Morales ,  Carl Stewart ,  Scott Edward Beck ,  Richard Alan Davis

发明人： Gilberto Morales ,  Carl Stewart ,  Scott Edward Beck ,  Richard Alan Davis

IPC分类号： G01L7/00

CPC分类号： G01L19/0023 ,  G01F1/363 ,  G01F1/48 ,  Y10T29/49002 ,  Y10T29/49826

摘要： A flow sensor apparatus that utilizes a pressure sensor with media isolated electrical connections. A cap can be attached to topside of the pressure sensor over a diaphragm to protect bond pads and wire bonds from a fluid media. A flow channel can be etched on the cap with an opening and exit on the sides of the cap so that liquid can flow through the flow channel. An inlet port and an outlet port can be attached to the channel's opening and exit to allow for fluid flow over the diaphragm. The flow channel creates a larger pressure over portions of the diaphragm that increases the deflection of the diaphragm, which increases an output signal of the pressure sensor. V-grooves can be created on two sides of the pressure sensor and in the cap to create the channel for the fluid in and out of the cap's cavity.

摘要翻译： 一种使用具有介质隔离电气连接的压力传感器的流量传感器装置。 盖可以通过隔膜连接到压力传感器的顶部，以保护接合垫和引线接合与流体介质。 可以在盖上蚀刻流动通道，其开口和出口在盖的侧面上，使得液体可以流过流动通道。 入口和出口可以连接到通道的开口和出口，以允许流体流过隔膜。 流动通道在膜片的部分上产生较大的压力，这增加了膜片的偏转，这增加了压力传感器的输出信号。 可以在压力传感器和盖子的两侧上形成V形槽，以形成流体进出盖体腔体的通道。

公开(公告)号：US07755466B2

公开(公告)日：2010-07-13

申请号：US11412460

申请日：2006-04-26

申请人： Scott E. Beck ,  Gilberto Morales

发明人： Scott E. Beck ,  Gilberto Morales

IPC分类号： H01C3/04

CPC分类号： G01F1/6845 ,  G01F1/6847

摘要： A flip-chip flow sensor has electrical components, such as temperature sensors and a heater, on the top of a substrate and has a channel formed in the bottom of the substrate. The channel is separated from the substrate's top by a membrane of substrate material. A fluid flowing through the channel is separated from a heater, upstream temperature sensor, downstream temperature sensor, bond pads, and wire bonds by the membrane. Heat flows through the membrane easily because the membrane is thin. As such, the electrical elements of the flow sensor, the bond pads and the wires are physically separated from a fluid flowing through the channel but can function properly because they are not thermally isolated.

摘要翻译： 倒装芯片流量传感器在基板的顶部具有诸如温度传感器和加热器的电气部件，并且在基板的底部形成通道。 通道由衬底材料的膜与衬底的顶部分离。 流经通道的流体与加热器，上游温度传感器，下游温度传感器，接合焊盘和膜的引线接合分离。 由于膜薄，热容易流过膜。 因此，流量传感器，接合焊盘和电线的电气元件与流过通道的流体物理分离，但是由于它们不是热隔离的，所以可以正常工作。

公开(公告)号：US20100018324A1

公开(公告)日：2010-01-28

申请号：US12180070

申请日：2008-07-25

申请人： Wayne Kilian ,  Scott Edward Beck ,  Gilberto Morales

发明人： Wayne Kilian ,  Scott Edward Beck ,  Gilberto Morales

IPC分类号： G01F1/38

CPC分类号： G01F1/28 ,  G01F1/38

摘要： A volumetric fluid flow sensor (100) includes a flow channel (120) for flowing a fluid therein; and a diaphragm (110) having an outer surface within the flow channel (120). The diaphragm (110) includes at least one flow disrupting feature mechanically coupled to or emerging from the outer surface of the diaphragm (110). A sensing structure (126) is coupled to the diaphragm (110) for generating a sensing signal responsive to a pressure signal on the diaphragm (110).

摘要翻译： 体积流体流量传感器（100）包括用于在其中流动流体的流动通道（120） 以及在所述流动通道（120）内具有外表面的隔膜（110）。 隔膜（110）包括至少一个机械耦合到隔膜（110）的外表面或从隔膜的外表面出来的流动干扰特征。 感测结构（126）耦合到隔膜（110），用于响应于隔膜（110）上的压力信号产生感测信号。

公开(公告)号：US20090206424A1

公开(公告)日：2009-08-20

申请号：US12032763

申请日：2008-02-18

申请人： Wayne T. Kilian ,  Gilberto Morales

发明人： Wayne T. Kilian ,  Gilberto Morales

IPC分类号： H01L29/82 ,  H01L21/00

CPC分类号： H01L29/82 ,  G01R33/07 ,  H01L27/22 ,  H01L43/065

摘要： A Hall-effect device with a merged and/or non-merged complementary structure in order to cancel stress induced offsets includes an n-type epitaxial Hall element and a p-type Hall element. The p-type Hall element can be implanted directly on top of the n-type epitaxial Hall element. The merged Hall elements can be biased in parallel to provide a zero-bias depletion layer throughout for isolation. The output of the p-type Hall element can be connected to the geometrically corresponding output of the n-type epitaxial Hall element through a suitable resistance. The output signal can be taken at the outputs of the n-type element. The Hall-effect device can be constructed utilizing standard processes.

摘要翻译： 具有合并和/或非合并互补结构以消除应力引起的偏移的霍尔效应器件包括n型外延霍尔元件和p型霍尔元件。 p型霍尔元件可以直接注入在n型外延霍尔元件的顶部。 合并的霍尔元件可以平行偏置，以提供整个零偏压耗尽层用于隔离。 p型霍尔元件的输出可以通过适当的电阻连接到n型外延霍尔元件的几何相应的输出。 输出信号可以在n型元件的输出处获取。 霍尔效应装置可以利用标准方法构建。

公开(公告)号：US20070251292A1

公开(公告)日：2007-11-01

申请号：US11412460

申请日：2006-04-26

申请人： Scott Beck ,  Gilberto Morales

发明人： Scott Beck ,  Gilberto Morales

IPC分类号： G01F25/00

CPC分类号： G01F1/6845 ,  G01F1/6847

摘要： A flip-chip flow sensor has electrical components, such as temperature sensors and a heater, on the top of a substrate and has a channel formed in the bottom of the substrate. The channel is separated from the substrate's top by a membrane of substrate material. A fluid flowing through the channel is separated from a heater, upstream temperature sensor, downstream temperature sensor, bond pads, and wire bonds by the membrane. Heat flows through the membrane easily because the membrane is thin. As such, the electrical elements of the flow sensor, the bond pads and the wires are physically separated from a fluid flowing through the channel but can function properly because they are not thermally isolated.

摘要翻译： 倒装芯片流量传感器在基板的顶部具有诸如温度传感器和加热器的电气部件，并且在基板的底部形成通道。 通道由衬底材料的膜与衬底的顶部分离。 流经通道的流体与加热器，上游温度传感器，下游温度传感器，接合焊盘和膜的引线接合分离。 由于膜薄，热容易流过膜。 因此，流量传感器，接合焊盘和电线的电气元件与流过通道的流体物理分离，但是由于它们不是热隔离的，所以可以正常工作。

公开(公告)号：US07216547B1

公开(公告)日：2007-05-15

申请号：US11328415

申请日：2006-01-06

申请人： Carl E. Stewart ,  Gilberto Morales

发明人： Carl E. Stewart ,  Gilberto Morales

IPC分类号： G01L7/00

CPC分类号： G01L9/0055 ,  G01L9/0042

摘要： A pressure sensor apparatus and method that incorporates a silicon frit bonded cap. The pressure sensor includes a silicon sensor wafer with diaphragms at a bottom surface thereof, a silicon cap wafer mounted on the topside of each sensor wafer, a plurality of silicon sensor die formed on the sensor wafer, a silicon cap wafer etched to create a plurality of reference cavities on the topside of the diaphragm, a thin glass frit to form a wafer-to-wafer bond between the sensor wafer and cap wafer. Sensing devices such as semiconductor die/sensor, peizoresistors, can be used to sense the pressure. The wafer-to-wafer frit bonding improves the output signal drift and the thermal performance of the pressure sensor minimizes the thermal mismatch created by anodic bonded glass wafers.

摘要翻译： 一种压力传感器装置和方法，其包括硅玻璃料接合盖。 压力传感器包括在其底表面上具有隔膜的硅传感器晶片，安装在每个传感器晶片顶部的硅盖晶片，形成在传感器晶片上的多个硅传感器管芯，被蚀刻以形成多个 的薄膜玻璃料，以在传感器晶片和盖子晶片之间形成晶片与晶片的结合。 可以使用诸如半导体管芯/传感器，传感器等感测装置感测压力。 晶圆到晶片的玻璃料粘合改善了输出信号漂移，并且压力传感器的热性能使由阳极粘合玻璃晶片产生的热失配最小化。