公开(公告)号：US08194406B2

公开(公告)日：2012-06-05

申请号：US12565175

申请日：2009-09-23

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20827

摘要： Apparatus and method are provided for two-phase dielectric cooling of an electronic device. The apparatus includes a coolant flow path, a vapor condenser and one or more vapor fans. The coolant flow path is in fluid communication with the electronic device, where liquid dielectric coolant within the flow path vaporizes upon contacting the electronic device, forming dielectric coolant vapor, and thereby facilitating cooling of the electronic device. The vapor condenser is also in fluid communication with the coolant flow path and facilitates condensate formation from the dielectric coolant vapor. The one or more vapor fans are disposed within the flow path to actively move dielectric coolant vapor into contact with the vapor condenser, and thereby enhance cooling of the electronic device by facilitating coolant condensate formation and thus recirculation of the coolant condensate as liquid dielectric coolant.

摘要翻译： 提供了用于电子设备的两相电介质冷却的装置和方法。 该装置包括冷却剂流路，蒸汽冷凝器和一个或多个蒸气风扇。 冷却剂流动路径与电子设备流体连通，其中流动路径内的液体电介质冷却剂在接触电子设备时蒸发，形成电介质冷却剂蒸汽，从而便于电子设备的冷却。 蒸汽冷凝器还与冷却剂流动路径流体连通，并且有助于从电介质冷却剂蒸气形成冷凝物。 一个或多个蒸汽风扇设置在流动路径内以主动地移动介质冷却剂蒸汽与蒸汽冷凝器接触，从而通过促进冷却剂冷凝物的形成并因此使冷却剂冷凝物作为液体电介质冷却剂再循环来增强电子设备的冷却。

公开(公告)号：US08184436B2

公开(公告)日：2012-05-22

申请号：US12825781

申请日：2010-06-29

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： H05K7/20809

摘要： Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vapor-condensing heat exchanger to condense dielectric fluid vapor egressing from the immersion-cooled electronic subsystems; a dielectric fluid vapor return coupling in fluid communication the vapor outlets of the immersion-cooled electronic subsystems and the vapor-condensing heat exchanger; a reservoir for holding dielectric fluid; a gravity drain line coupled to drain dielectric fluid condensate from the vapor-condensing heat exchanger to the reservoir; an immersed, sub-cooling heat exchanger disposed within the reservoir; a dielectric fluid supply manifold coupling in fluid communication the reservoir and the dielectric fluid inlets of the immersion-cooled electronic subsystems; and a pump for supplying under pressure dielectric fluid from the reservoir to the dielectric fluid supply manifold for maintaining dielectric fluid in a liquid state within the immersion-cooled electronic subsystems.

摘要翻译： 提供液冷电子机架，包括：浸入式冷却电子子系统; 蒸气冷凝热交换器，用于冷凝从浸没冷却的电子子系统排出的介质流体蒸气; 介电流体蒸汽返回联接器，其使浸没冷却的电子子系统的蒸汽出口和蒸汽冷凝热交换器流体连通; 用于保持介电流体的储存器; 重力排放管线，其耦合以将介电流体冷凝物从所述蒸汽冷凝热交换器排出到所述储存器; 设置在储存器内的浸没式次冷热交换器; 介质流体供应歧管联接以使浸没冷却的电子子系统的储存器和电介质流体入口流体连通; 以及用于将压力介质流体从储存器供应到介电流体供应歧管的泵，用于将浸没冷却的电子子系统内的介质流体保持在液态。

公开(公告)号：US07978473B2

公开(公告)日：2011-07-12

申请号：US12706912

申请日：2010-02-17

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Bruce K. Furman ,  Madhusudan K. Iyengar ,  Paul A. Lauro ,  Roger R. Schmidt ,  Da-Yuan Shih ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Bruce K. Furman ,  Madhusudan K. Iyengar ,  Paul A. Lauro ,  Roger R. Schmidt ,  Da-Yuan Shih ,  Robert E. Simons

IPC分类号： H05K7/20 ,  G06F1/20 ,  H01L23/34

CPC分类号： H01L23/4735 ,  H01L23/473 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled.

摘要翻译： 提供冷却装置和制造方法以便于从发热电子装置中除去热量。 制造方法包括：获得焊料材料; 将焊料材料设置在要冷却的表面上; 回流和成形设置在待冷却表面上的焊料材料，以将焊料材料构成为具有从其延伸的多个翅片的基底。 除了在待冷却的表面上原位配置，基底同时冶金结合到待冷却的表面上。 构造为具有从其延伸的多个翅片的基底的焊料材料是通过其被冶金结合到要冷却的表面热连接到要冷却的表面的单个整体结构。

公开(公告)号：US07961475B2

公开(公告)日：2011-06-14

申请号：US12256618

申请日：2008-10-23

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Robert E. Simons

IPC分类号： H05K1/00 ,  H05K7/20 ,  H05K5/00 ,  H01R13/40 ,  H02B1/01 ,  F28F7/00 ,  F25D23/12

CPC分类号： H05K7/20772 ,  H01L2924/0002 ,  H01L2924/00

摘要： Apparatus and method are provided for facilitating immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a hermetically sealed electrical connector disposed on a wall of the container. The electrical connector is sized and configured to receive an electrical and network connector of the electronic subsystem when the electronic subsystem is operatively inserted into the container, and to facilitate external electrical and network coupling to the subsystem. The apparatus further includes coolant inlet and outlet ports coupled to the container for facilitating ingress and egress of coolant through the container. When the electronic subsystem is operatively inserted into the container and coolant flows through the container, the electronic subsystem is immersion-cooled by the coolant.

摘要翻译： 提供了一种装置和方法，用于促进具有要浸没冷却的多种不同类型组件的电子子系统的浸入式冷却。 该装置包括一个容纳电子子系统的容器，以及一个设置在容器壁上的气密密封电连接器。 电连接器的尺寸和构造被设计成当电子子系统可操作地插入容器中时接收电子子系统的电气和网络连接器，并且便于外部电气和网络耦合到子系统。 该装置还包括联接到容器的冷却剂入口和出口，用于促进冷却剂通过容器的进入和流出。 当电子子系统可操作地插入容器并且冷却剂流过容器时，电子子系统被冷却剂浸没冷却。

公开(公告)号：US07918025B2

公开(公告)日：2011-04-05

申请号：US12252386

申请日：2008-10-16

申请人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Robert E. Simons

发明人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Robert E. Simons

IPC分类号： B23P15/26

CPC分类号： H01L23/373 ,  H01L23/433 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/15312 ,  Y10T29/4935 ,  Y10T29/49368 ,  Y10T428/30 ,  Y10T442/2738

摘要： A thermal spreading device disposable between electronic circuitry and a heat sink includes a substrate having parallel first and second faces and conduits extending through the substrate between the faces. The substrate material has a first thermal conductivity value in a direction parallel to the faces and a second thermal conductivity value in a direction normal to the faces, with the second thermal conductivity value being less than the first thermal conductivity value. The conduit material has a thermal conductivity value associated with it, with the thermal conductivity value being greater than the second thermal conductivity value of the substrate. One method of fabricating the thermal spreading device includes disposing a molding material radially about the rods and hardening the material. Other methods include press fitting and shrink fitting the rods into a substrate material.

公开(公告)号：US07907406B1

公开(公告)日：2011-03-15

申请号：US12567954

申请日：2009-09-28

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/2079 ,  H05K7/202 ,  H05K7/20609

摘要： System and method are provided for cooling an electronics rack. A modular cooling unit (MCU) is associated with the rack to provide system coolant to an electronics subsystem and a bulk power assembly. The MCU includes a liquid-to-liquid heat exchanger, and defines portions of facility and system coolant loops. Chilled coolant from a facility source is passed through the liquid-to-liquid heat exchanger to cool system coolant flowing through the system coolant loop. The system also includes an air-to-liquid heat exchanger in fluid communication with the system coolant loop, a pump in fluid communication with the system coolant loop, and a controller. The controller controls operation of the pump to adjust flow of system coolant through the system coolant loop dependent upon a mode of operation. In a standby mode, system coolant flows through the air-to-liquid heat exchanger at a lower flow rate, and expels heat to ambient air.

摘要翻译： 提供了系统和方法来冷却电子机架。 模块化冷却单元（MCU）与机架相关联，以向电子子系统和大容量电源组件提供系统冷却剂。 MCU包括液 - 液热交换器，并且限定设备和系统冷却剂回路的部分。 来自设备源的冷冻冷却剂通过液体 - 液体热交换器以冷却流过系统冷却剂回路的系统冷却剂。 该系统还包括与系统冷却剂回路流体连通的空气 - 液体热交换器，与系统冷却剂回路流体连通的泵和控制器。 控制器控制泵的操作，以根据操作模式来调节通过系统冷却剂回路的系统冷却剂流动。 在备用模式下，系统冷却剂以较低的流量流过空气对液体热交换器，并将热量排放到周围空气。

公开(公告)号：US07405936B1

公开(公告)日：2008-07-29

申请号：US12055455

申请日：2008-03-26

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H05K7/20736 ,  F28F1/20 ,  F28F1/22 ,  H05K7/20009 ,  H05K7/20554 ,  H05K7/20772

摘要： A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be cooled; and a liquid-based cooling subsystem including at least one cold plate, physically coupled to the at least one primary heat generating component, and a thermally conductive coolant-carrying tube in fluid communication with the at least one cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and includes a plurality of thermally conductive fins extending from a surface thereof. The plurality of thermally conductive fins are disposed at least partially over the at least one secondary heat generating component to be cooled, and provide supplemental cooling of at least a portion of the air flow established across the multiple components of the electronics system.

摘要翻译： 为多组件电子系统提供混合冷却系统和制造方法。 该冷却系统包括用于建立穿过要被冷却的至少一个主要和至少一个次要发热部件的空气流的空气移动装置; 以及液体冷却子系统，其包括物理耦合到所述至少一个主发热部件的至少一个冷板和与所述至少一个冷板流体连通的导热冷却剂供给管。 导热辅助结构联接到冷却剂承载管并且包括从其表面延伸的多个导热翅片。 多个导热翅片至少部分地设置在待冷却的至少一个二次发热组件上，并且为跨越电子系统的多个部件建立的空气流的至少一部分提供补充冷却。

公开(公告)号：US07274566B2

公开(公告)日：2007-09-25

申请号：US11008732

申请日：2004-12-09

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F04B17/00

CPC分类号： H05K7/2079

摘要： A coolant flow drive apparatus is provided for facilitating removal of heat from a cooling structure coupled to a heat generating electronics component. The coolant flow drive apparatus includes a turbine in fluid communication with a primary coolant flowing within a primary coolant flow loop, and a pump in fluid communication with a secondary coolant within a secondary coolant flow path. The secondary fluid flow path is separate from the primary coolant flow path. The flow drive apparatus further includes a magnetic coupling between the turbine and the pump, wherein the turbine drives the pump through the magnetic coupling to pump secondary coolant through the secondary coolant flow path.

摘要翻译： 提供冷却剂流动驱动装置，用于便于从耦合到发热电子部件的冷却结构移除热量。 冷却剂流动驱动装置包括与在主冷却剂流动回路内流动的主要冷却剂流体连通的涡轮机，以及与次级冷却剂流动路径内的二级冷却剂流体连通的泵。 次级流体流动路径与主冷却剂流动路径分离。 流动驱动装置还包括在涡轮机和泵之间的磁耦合，其中涡轮机通过磁耦合驱动泵以将二级冷却剂泵送通过次级冷却剂流动路径。

公开(公告)号：US07106590B2

公开(公告)日：2006-09-12

申请号：US10726347

申请日：2003-12-03

申请人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons ,  Randy J. Zoodsma

发明人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons ,  Randy J. Zoodsma

IPC分类号： H05K7/20 ,  F28D15/00

CPC分类号： H05K7/2079

摘要： A cooling system is provided employing multiple coolant conditioning units (CCUs). Each CCU, which is coupled to a different, associated electronics rack of multiple electronics racks to be cooled, includes a heat exchanger, a first cooling loop with a control valve, and a second cooling loop. The first cooling loop receives chilled facility coolant from a source and passes at least a portion thereof via the control valve through the heat exchanger. The second cooling loop provides cooled system coolant to the associated electronics rack, and expels heat in the heat exchanger from the electronics rack to the chilled facility coolant in the first cooling loop. The control valve allows regulation of the facility coolant flow through the heat exchanger, thereby allowing independent control of temperature of the system coolant in the second cooling loop. Various CCU and associated component redundancies of the cooling system are also provided.

摘要翻译： 提供采用多个冷却剂调节单元（CCU）的冷却系统。 耦合到要冷却的多个电子机架的不同相关电子机架的每个CCU包括热交换器，具有控制阀的第一冷却回路和第二冷却回路。 第一冷却回路从源接收冷却设备冷却剂，并且经由控制阀将其至少一部分通过热交换器。 第二冷却回路将冷却的系统冷却剂提供给相关联的电子机架，并将热交换器中的热量从电子机架排出到第一冷却回路中的冷却设备冷却剂。 控制阀允许调节通过热交换器的设备冷却剂流，从而允许独立地控制第二冷却回路中的系统冷却剂的温度。 还提供了冷却系统的各种CCU和相关部件冗余。

公开(公告)号：US07086247B2

公开(公告)日：2006-08-08

申请号：US10930079

申请日：2004-08-31

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： F25D23/12

CPC分类号： H01L23/4275 ,  F28D20/021 ,  H01L2924/0002 ,  H05K7/20654 ,  Y02E60/145 ,  H01L2924/00

摘要： A cooling approach is provided for cooling an electronics subsystem, such as an electronics rack. The cooling approach includes a coolant conditioning unit and a thermal capacitor unit. The coolant conditioning unit has a heat exchanger, a first cooling loop and a second cooling loop. The first cooling loop receives facility coolant from a facility coolant source and passes at least a portion thereof to the heat exchanger. The second cooling loop provides system coolant to the electronics subsystem, and expels heat in the heat exchanger from the electronics subsystem to the facility coolant in the first cooling loop. The thermal capacitor unit is in fluid communication with the second cooling loop to maintain temperature of the system coolant within a defined range for a period of time upon shutdown or failure of the facility coolant in the first cooling loop, thereby allowing continued operation of the electronics subsystem.

摘要翻译： 提供冷却方法来冷却诸如电子机架的电子子系统。 冷却方式包括冷却剂调节单元和热电容器单元。 冷却剂调节单元具有热交换器，第一冷却回路和第二冷却回路。 第一冷却回路从设备冷却剂源接收设备冷却剂，并将其至少一部分通到热交换器。 第二冷却回路将系统冷却剂提供给电子子系统，并将热交换器中的热量从电子系统排出到第一冷却回路中的设备冷却剂。 热电容器单元与第二冷却回路流体连通，以在第一冷却回路中的设备冷却剂关闭或故障时将系统冷却剂的温度维持在限定范围内一段时间，从而允许电子装置的继续运行 子系统。