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1.发明授权Apparatus and method for facilitating immersion-cooling of an electronic subsystem 有权用于促进电子子系统的浸入冷却的装置和方法公开(公告)号：US07961475B2
公开(公告)日：2011-06-14
申请号：US12256618
申请日：2008-10-23
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Vinod Kamath , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Vinod Kamath , Robert E. Simons
CPC分类号： H05K7/20772 , H01L2924/0002 , H01L2924/00
摘要： Apparatus and method are provided for facilitating immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a hermetically sealed electrical connector disposed on a wall of the container. The electrical connector is sized and configured to receive an electrical and network connector of the electronic subsystem when the electronic subsystem is operatively inserted into the container, and to facilitate external electrical and network coupling to the subsystem. The apparatus further includes coolant inlet and outlet ports coupled to the container for facilitating ingress and egress of coolant through the container. When the electronic subsystem is operatively inserted into the container and coolant flows through the container, the electronic subsystem is immersion-cooled by the coolant.
摘要翻译： 提供了一种装置和方法，用于促进具有要浸没冷却的多种不同类型组件的电子子系统的浸入式冷却。 该装置包括一个容纳电子子系统的容器，以及一个设置在容器壁上的气密密封电连接器。 电连接器的尺寸和构造被设计成当电子子系统可操作地插入容器中时接收电子子系统的电气和网络连接器，并且便于外部电气和网络耦合到子系统。 该装置还包括联接到容器的冷却剂入口和出口，用于促进冷却剂通过容器的进入和流出。 当电子子系统可操作地插入容器并且冷却剂流过容器时，电子子系统被冷却剂浸没冷却。
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2.发明授权Liquid cooling apparatus and method for facilitating cooling of an electronics system 失效用于促进电子系统冷却的液体冷却装置和方法公开(公告)号：US07639499B1
公开(公告)日：2009-12-29
申请号：US12168259
申请日：2008-07-07
申请人： Levi A. Campbell , Richard C. Chu , Martin J. Crippen , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Vinod Kamath , Jason A. Matteson , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Martin J. Crippen , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Vinod Kamath , Jason A. Matteson , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20772
摘要： Apparatus and method are provided for facilitating liquid cooling one or more components of an electronic subsystem chassis disposed within an electronics rack. The apparatus includes a rack-level coolant manifold assembly and at least one movable chassis-level manifold subassembly. The rack-level coolant manifold assembly includes a rack-level inlet manifold and a rack-level outlet manifold, and each movable chassis-level manifold subassembly includes a chassis-level coolant inlet manifold coupled in fluid communication with the rack-level inlet manifold, and a chassis-level coolant outlet manifold coupled in fluid communication with the rack-level outlet manifold. The chassis-level manifold subassembly is slidably coupled to the electronics rack to facilitate access to one or more removable components of the electronic subsystem chassis. In one embodiment, the electronics subsystem chassis is a multi-blade center system having multiple removable blades, each blade being an electronics subsystem.
摘要翻译： 提供了设备和方法，以便于液体冷却设置在电子机架内的电子子系统机架的一个或多个部件。 该设备包括机架级冷却剂歧管组件和至少一个可移动底盘级歧管组件。 机架级冷却剂歧管组件包括机架级入口歧管和机架级出口歧管，并且每个可移动底盘级歧管组件包括与机架级入口歧管流体连通地联接的底盘级冷却剂入口歧管， 以及与所述齿条级出口歧管流体连通地联接的底盘级冷却剂出口歧管。 底盘级歧管子组件可滑动地联接到电子机架，以便于接近电子子系统底盘的一个或多个可拆卸部件。 在一个实施例中，电子系统底盘是具有多个可移除刀片的多刀片中心系统，每个刀片是电子子系统。
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公开(公告)号：US07791882B2
公开(公告)日：2010-09-07
申请号：US12108020
申请日：2008-04-23
CPC分类号： H05K7/20745 , H05K7/20836
摘要： Apparatus and method are provided for cooling an electronics rack in an energy efficient, dynamic manner. The apparatus includes one or more extraction mechanisms for facilitating cooling of the electronics rack, an enclosure, a heat removal unit, and a control unit. The enclosure has an outer wall, a cover coupled to the outer wall and a central opening sized to surround the electronics rack and the heat extraction mechanism. A liquid coolant loop couples the heat removal unit in fluid communication with the heat extraction mechanism, which removes heat from liquid coolant passing therethrough. The control unit is coupled to the heat removal unit for dynamically adjusting energy consumption of the heat removal unit to limit its energy consumption, while providing a required cooling to the electronics rack employing the liquid coolant passing through the heat extraction mechanism.
摘要翻译： 提供了用于以节能，动态的方式冷却电子机架的装置和方法。 该装置包括用于促进电子机架的冷却，外壳，散热单元和控制单元的一个或多个提取机构。 外壳具有外壁，联接到外壁的盖和大小为围绕电子机架和散热机构的中心开口。 液体冷却剂回路联接散热单元与散热机构的流体连通，其从通过其中的液体冷却剂中除去热量。 控制单元联接到除热单元，用于动态地调节散热单元的能量消耗以限制其能量消耗，同时使用通过热提取机构的液体冷却剂向电子机架提供所需的冷却。
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公开(公告)号：US09307674B2
公开(公告)日：2016-04-05
申请号：US13102200
申请日：2011-05-06
申请人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
发明人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
IPC分类号： H01L23/427 , H01L23/473 , H05K7/20 , F28D15/02
CPC分类号： H05K7/20336 , F28D15/02 , H05K7/20509 , H05K7/20772 , H05K7/20936
摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.
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5.发明授权Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system 有权多组分电子系统的热电增强型液态冷却公开(公告)号：US09027360B2
公开(公告)日：2015-05-12
申请号：US13102195
申请日：2011-05-06
申请人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
发明人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
CPC分类号： H05K7/20763 , F25B21/02 , F25B21/04 , F25D17/06 , H05K7/20254 , H05K7/20263 , H05K7/20781 , H05K7/2079 , H05K7/20836
摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled structure, a thermal conduction path coupling the electronic component and the liquid-cooled structure, a coolant loop in fluid communication with a coolant-carrying channel of the liquid-cooled structure, and an outdoor-air-cooled heat exchange unit coupled to facilitate heat transfer from the liquid-cooled structure via, at least in part, the coolant loop. The thermoelectric array facilitates transfer of heat from the electronic component to the liquid-cooled structure, and the heat exchange unit cools coolant passing through the coolant loop by dissipating heat from the coolant to outdoor ambient air. In one implementation, temperature of coolant entering the liquid-cooled structure is greater than temperature of the outdoor ambient air to which heat is dissipated.
摘要翻译： 提供了用于促进电子部件的冷却的装置和方法。 该装置包括液冷结构，耦合电子部件和液冷结构的热传导路径，与液冷结构的冷却剂传送通道流体连通的冷却剂回路，室外空气冷却 热交换单元被耦合以便于至少部分地通过冷却剂回路从液冷结构经由热传递。 热电阵列有助于将热量从电子部件传递到液冷结构，并且热交换单元通过将冷却剂的热量散发到室外环境空气来冷却通过冷却剂回路的冷却剂。 在一个实施方案中，进入液冷结构的冷却剂的温度大于散热的室外环境空气的温度。
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6.发明授权Cooled electronic system with thermal spreaders coupling electronics cards to cold rails 失效冷却电子系统，散热器将电子卡耦合到冷轨公开(公告)号：US08493738B2
公开(公告)日：2013-07-23
申请号：US13102211
申请日：2011-05-06
申请人： Timothy J. Chainer , Michael A. Gaynes , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark D. Schultz , Daniel P. Simco , Mark E. Steinke
发明人： Timothy J. Chainer , Michael A. Gaynes , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark D. Schultz , Daniel P. Simco , Mark E. Steinke
IPC分类号： H05K7/20
CPC分类号： H05K7/20772 , H05K7/20781 , H05K7/2079
摘要： Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.
摘要翻译： 提供液冷电子系统，其包括具有电子卡的电子组件和在一端具有闩锁的插座。 闩锁有助于将卡固定在插座内或从插座中取出卡。 液冷冷轨布置在插座的一端，散热器将电子卡连接到冷轨。 热散布器包括耦合到卡的相对侧上的第一和第二表面的第一和第二热传递板，以及从板的端部边缘延伸的导热延伸件，其将相应的传递板联接到液体冷却的冷轨。 导热延伸部设置在闩锁的侧面，并且卡可以使用闩锁固定在插座内或从插座中移除而不移除冷轨或散热器。
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7.发明申请SYSTEM TO IMPROVE OPERATION OF A DATA CENTER WITH HETEROGENEOUS COMPUTING CLOUDS 有权改进具有异质计算云的数据中心的操作的系统公开(公告)号：US20120254400A1
公开(公告)日：2012-10-04
申请号：US13077578
申请日：2011-03-31
IPC分类号： G06F15/173
CPC分类号： G06F9/5094 , Y02D10/22
摘要： A system to improve operation of a data center with heterogeneous computing clouds may include monitoring components to track data center climate controls and individual heterogeneous computing clouds' operating parameters within the data center. The system may also include a controller that regulates the individual heterogeneous computing clouds and data center climate controls based upon data generated by the monitoring components to improve the operating performance of the individual heterogeneous computing clouds as well as the operating performance of the data center. The system may further include spilling computing clouds to receive excess workload of an individual heterogeneous computing cloud without violating individual heterogeneous computing clouds contracts.
摘要翻译： 改进具有异构计算云的数据中心运行的系统可能包括监视组件以跟踪数据中心气候控制和数据中心内的个别异构计算云运行参数。 该系统还可以包括控制器，其基于由监视组件生成的数据来调节各个异构计算云和数据中心气候控制，以改善各个异构计算云的操作性能以及数据中心的操作性能。 该系统可以进一步包括溢出计算云以接收单个异构计算云的额外的工作量，而不违反个别的异构计算云合同。
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公开(公告)号：US07660116B2
公开(公告)日：2010-02-09
申请号：US12107010
申请日：2008-04-21
申请人： Alan Claassen , Eric Alan Eckberg , Dennis John Hansen , Vinod Kamath , Madhusudan K. Iyengar , Howard Victor Mahaney, Jr. , Michael Sven Miller , Stephen Peter Mroz
发明人： Alan Claassen , Eric Alan Eckberg , Dennis John Hansen , Vinod Kamath , Madhusudan K. Iyengar , Howard Victor Mahaney, Jr. , Michael Sven Miller , Stephen Peter Mroz
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F2200/201 , H05K7/20736 , H05K7/2079 , Y10T29/49826
摘要： Rack assemblies and methods for cooling one or more rack-based computer systems, as well as data center configurations that utilize the rack assembly. The rack assembly comprises a rack providing support for multiple columns of heat-generating electronic devices and device fans for moving air from an air inlet side of the rack through the devices and through an air outlet side of the rack. The rack assembly also comprises a unitary door having a support frame spanning the air outlet side of the rack and hingedly coupling the door to a rear vertical edge of the rack. The door includes an air-to-liquid heat exchanger panel spanning an air outlet passage inside the support frame so that substantially all of the air passing through the air outlet must pass through the heat exchanger panel. The air outlet passage has a cross-sectional area that is substantially equal to or greater than the cross-sectional area of the multiple columns of heat-generating devices.
摘要翻译： 用于冷却一个或多个基于机架的计算机系统的机架组件和方法，以及利用机架组件的数据中心配置。 机架组件包括一个支架，用于支撑多列发热电子设备和设备风扇，用于将空气从机架的空气入口侧移动穿过设备并通过机架的空气出口侧。 机架组件还包括一个整体门，其具有横跨机架的空气出口侧的支撑框架，并将门铰接地连接到机架的后垂直边缘。 门包括空气到液体的热交换器面板，其横跨支撑框架内的空气出口通道，使得通过出气口的空气基本上必须通过热交换器面板。 空气出口通道的横截面积基本上等于或大于多列发热装置的横截面面积。
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公开(公告)号：US20090262501A1
公开(公告)日：2009-10-22
申请号：US12107010
申请日：2008-04-21
申请人： Alan Claassen , Eric Alan Eckberg , Dennis John Hansen , Vinod Kamath , Madhusudan K. Iyengar , Howard Victor Mahaney, JR. , Michael Sven Miller , Stephen Peter Mroz
发明人： Alan Claassen , Eric Alan Eckberg , Dennis John Hansen , Vinod Kamath , Madhusudan K. Iyengar , Howard Victor Mahaney, JR. , Michael Sven Miller , Stephen Peter Mroz
CPC分类号： G06F1/20 , G06F2200/201 , H05K7/20736 , H05K7/2079 , Y10T29/49826
摘要： Rack assemblies and methods for cooling one or more rack-based computer systems, as well as data center configurations that utilize the rack assembly. The rack assembly comprises a rack providing support for multiple columns of heat-generating electronic devices and device fans for moving air from an air inlet side of the rack through the devices and through an air outlet side of the rack. The rack assembly also comprises a unitary door having a support frame spanning the air outlet side of the rack and hingedly coupling the door to a rear vertical edge of the rack. The door includes an air-to-liquid heat exchanger panel spanning an air outlet passage inside the support frame so that substantially all of the air passing through the air outlet must pass through the heat exchanger panel. The air outlet passage has a cross-sectional area that is substantially equal to or greater than the cross-sectional area of the multiple columns of heat-generating devices.
摘要翻译： 用于冷却一个或多个基于机架的计算机系统的机架组件和方法，以及利用机架组件的数据中心配置。 机架组件包括一个支架，用于支撑多列发热电子设备和设备风扇，用于将空气从机架的空气入口侧移动穿过设备并通过机架的空气出口侧。 机架组件还包括一个整体门，其具有横跨机架的空气出口侧的支撑框架，并将门铰接地连接到机架的后垂直边缘。 门包括空气到液体的热交换器面板，其横跨支撑框架内的空气出口通道，使得通过出气口的空气基本上必须通过热交换器面板。 空气出口通道的横截面积基本上等于或大于多列发热装置的横截面面积。
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公开(公告)号：US09179574B2
公开(公告)日：2015-11-03
申请号：US13114203
申请日：2011-05-24
CPC分类号： H05K7/1497 , F25B25/005 , F25B2700/2106 , F25B2700/21173 , F25D11/003 , F25D17/02 , H05K7/2079 , Y10T29/49359
摘要： A cooling unit and cooling method are provided for a container-type data center. The cooling unit includes a heat rejection unit, for rejecting heat from coolant passing through a coolant loop to air passing across the heat rejection unit, and a refrigeration unit controllable to selectively provide auxiliary cooling to at least a portion of the coolant passing through the coolant loop. The heat rejection unit includes a heat exchange assembly, having a first heat exchanger and a second heat exchanger, and one or more air-moving devices providing airflow across the first and second heat exchangers. The first heat exchanger couples in fluid communication with the coolant loop, and the second heat exchanger is coupled in fluid communication with a refrigeration loop of the refrigeration unit for rejecting heat from refrigerant passing through the refrigeration loop to the airflow passing across the second heat exchanger.
摘要翻译： 为集装箱式数据中心提供冷却装置和冷却方法。 冷却单元包括排热单元，用于将来自通过冷却剂回路的冷却剂的热量排除通过散热单元的空气;以及制冷单元，其可控制以选择性地向通过冷却剂的冷却剂的至少一部分提供辅助冷却 循环。 散热单元包括具有第一热交换器和第二热交换器的热交换组件，以及提供横跨第一和第二热交换器的气流的一个或多个气动装置。 所述第一热交换器与所述冷却剂回路流体连通，并且所述第二热交换器与所述制冷单元的制冷回路流体连通地联接，用于将通过所述制冷回路的制冷剂的热量排出到穿过所述第二热交换器的气流 。
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