公开(公告)号：US6133142A

公开(公告)日：2000-10-17

申请号：US992628

申请日：1997-12-18

申请人： Khanh Tran ,  Jeff Shields

发明人： Khanh Tran ,  Jeff Shields

IPC分类号： H01L21/3213 ,  H01L21/60 ,  H01L21/4763

CPC分类号： H01L21/76897 ,  H01L21/32135

摘要： Reliable vias are formed by providing an adequate landing area without increasing the size of the underlying feature. Embodiments include forming a lower metal feature with an ARC layer extending beyond the side surfaces of the primary conductive portion serving as an etch stop when forming the through-hole. The overhanging portion provides a suitable landing pad without increasing the size of the underlying feature. Embodiments include ARCs having a thickness ranging from about 1000 .ANG. to about 1300 .ANG. and an overhanging portion extending beyond the side surface of the primary conductive portion up to about 0.05 microns.

摘要翻译： 通过提供足够的着陆区域而不增加基础特征的尺寸来形成可靠的通孔。 实施例包括在形成通孔时形成具有延伸超过用作蚀刻停止层的主导电部分的侧表面的ARC层的下部金属特征。 突出部分提供合适的着陆垫，而不增加底层特征的尺寸。 实施方案包括厚度范围为约1000安培至约1300安培的ARC，以及延伸超过主要导电部分的侧表面直至约0.05微米的突出部分。

公开(公告)号：US20190390933A1

公开(公告)日：2019-12-26

申请号：US16448004

申请日：2019-06-21

申请人： Khanh Tran

发明人： Khanh Tran

IPC分类号： F41B11/70 ,  F41B11/62

摘要： The present disclosure provides a foldable buttstock assembly for a pneumatic air gun. The foldable buttstock assembly has a foldable buttstock air fitting adapter connected to an air tank to a barrel unit of the pneumatic air gun. It also has an air channeling fitting to channel flow of the air gas. The pneumatic air gun can be operated while the air tank is in any position.

公开(公告)号：US08344478B2

公开(公告)日：2013-01-01

申请号：US12605010

申请日：2009-10-23

申请人： Joseph P. Ellul ,  Khanh Tran ,  Edward Martin Godshalk ,  Albert Bergemont

发明人： Joseph P. Ellul ,  Khanh Tran ,  Edward Martin Godshalk ,  Albert Bergemont

IPC分类号： H01L21/768 ,  H01L29/86

CPC分类号： H01L28/10 ,  H01L21/76898 ,  H01L23/5227 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： Inductors and methods for integrated circuits that result in inductors of a size compatible with integrated circuits, allowing the fabrication of inductors, with or without additional circuitry on a first wafer and the bonding of that wafer to a second wafer without wasting of wafer area. The inductors in the first wafer are comprised of coils formed by conductors at each surface of the first wafer coupled to conductors in holes passing through the first wafer. Various embodiments are disclosed.

摘要翻译： 用于集成电路的电感器和方法，其导致尺寸与集成电路兼容的电感器，允许制造电感器，在第一晶片上具有或不具有附加电路，以及将晶片连接到第二晶片，而不浪费晶片面积。 第一晶片中的电感器由在第一晶片的每个表面处的导体形成的线圈组成，该线圈与穿过第一晶片的孔中的导体相连接。 公开了各种实施例。

公开(公告)号：US20110095395A1

公开(公告)日：2011-04-28

申请号：US12605010

申请日：2009-10-23

申请人： Joseph P. Ellul ,  Khanh Tran ,  Edward Martin Godshalk ,  Albert Bergemont

发明人： Joseph P. Ellul ,  Khanh Tran ,  Edward Martin Godshalk ,  Albert Bergemont

IPC分类号： H01L29/86 ,  H01L21/768

CPC分类号： H01L28/10 ,  H01L21/76898 ,  H01L23/5227 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： Inductors and methods for integrated circuits that result in inductors of a size compatible with integrated circuits, allowing the fabrication of inductors, with or without additional circuitry on a first wafer and the bonding of that wafer to a second wafer without wasting of wafer area. The inductors in the first wafer are comprised of coils formed by conductors at each surface of the first wafer coupled to conductors in holes passing through the first wafer. Various embodiments are disclosed.

摘要翻译： 用于集成电路的电感器和方法，其导致尺寸与集成电路兼容的电感器，允许制造电感器，在第一晶片上具有或不具有附加电路，以及将晶片连接到第二晶片，而不浪费晶片面积。 第一晶片中的电感器由在第一晶片的每个表面处的导体形成的线圈组成，该线圈与穿过第一晶片的孔中的导体相连接。 公开了各种实施例。

公开(公告)号：US20110011386A1

公开(公告)日：2011-01-20

申请号：US12503072

申请日：2009-07-15

申请人： Khanh Tran

发明人： Khanh Tran

IPC分类号： F41B11/02

CPC分类号： F41B11/57 ,  F41B11/53

摘要： A bottom feed magazine of a paintball gun includes a housing for storing a plurality of paintballs. A circular tray is mounted to the housing. A hub is rotatable about a shaft within the circular tray at a center thereof. The circular tray and the hub together define an annular channel for receiving paintballs dropped therein from the housing. A plurality of arms is provided on the hub for driving the paintballs along the channel. A tube has an inlet end extending into the channel and an outlet end extending generally upwards to a top wall of the housing. When the central hub rotates, the paintballs in the channel are driven along the channel, into the inlet end and pushed up along the tube towards the outlet end.

摘要翻译： 彩弹枪的底部进料盒包括用于存储多个彩弹的壳体。 圆形托盘安装到外壳上。 轮毂可绕其圆心内的轴旋转。 圆形托盘和毂一起限定了用于接收从壳体落入其中的彩弹的环形通道。 多个臂设置在轮毂上，用于沿着通道驱动彩弹。 管具有延伸到通道中的入口端和大体向上延伸到壳体的顶壁的出口端。 当中心轮毂旋转时，通道中的彩弹将沿着通道驱动进入入口端，并沿管朝向出口端向上推。

公开(公告)号：US20080155302A1

公开(公告)日：2008-06-26

申请号：US11588441

申请日：2006-10-26

申请人： Lawton Chun-Hing Mue ,  Inderjit Singh Chohan ,  Khanh Tran

发明人： Lawton Chun-Hing Mue ,  Inderjit Singh Chohan ,  Khanh Tran

IPC分类号： G06F11/00

CPC分类号： G06F11/1451 ,  G06F11/1469

摘要： Methods and systems for storing recovery related information on a computer memory are described. One exemplary method comprises accessing a user input relating to a user selection of applications to be restored upon executing a recovery of the memory and storing on a recovery partition of the memory a recovery image corresponding to a user image on a user partition of the memory. The user image comprises the user selection of applications. Upon executing a recovery, the recovery image is copied to the user partition such that the user image is configured to correspond to the recovery image. The recovery image is derived from a set of applications that includes at least one un-installed application.

摘要翻译： 描述了用于在计算机存储器上存储恢复相关信息的方法和系统。 一个示例性方法包括：在执行存储器的恢复时访问与要恢复的应用程序的用户选择相关的用户输入，并且在存储器的恢复分区上存储与存储器的用户分区上的用户映像相对应的恢复图像。 用户图像包括用户对应用的选择。 在执行恢复时，将恢复图像复制到用户分区，使得用户图像被配置为对应于恢复图像。 恢复映像源自包括至少一个未安装应用程序的一组应用程序。

公开(公告)号：US06884259B2

公开(公告)日：2005-04-26

申请号：US10649079

申请日：2003-08-27

申请人： Khanh Tran ,  Steve M. Spencer

发明人： Khanh Tran ,  Steve M. Spencer

IPC分类号： A61F2/82 ,  A61B17/12 ,  A61F2/01 ,  A61F2/06 ,  A61F2/84

CPC分类号： A61F2/95 ,  A61B17/12013 ,  A61F2/01 ,  A61F2002/9517

摘要： A stent delivery system may comprise a shape memory metal bumper which is expandable from a reduced profile configuration to an increased profile configuration. The stent delivery system comprises an inner tube, a stent disposed about the inner tube and a shape memory metal bumper disposed about the inner tube adjacent the proximal end of the stent.

摘要翻译： 支架输送系统可以包括形状记忆金属缓冲器，其可以从减小的轮廓配置扩展到增加的轮廓配置。 支架输送系统包括内管，围绕内管设置的支架和形状记忆金属保险杠，其围绕邻近支架近端的内管设置。

公开(公告)号：US06492258B1

公开(公告)日：2002-12-10

申请号：US09881831

申请日：2001-06-14

申请人： Minh Van Ngo ,  Paul R. Besser ,  Matthew Buynoski ,  John Caffall ,  Nick Maccrae ,  Richard J. Huang ,  Khanh Tran

发明人： Minh Van Ngo ,  Paul R. Besser ,  Matthew Buynoski ,  John Caffall ,  Nick Maccrae ,  Richard J. Huang ,  Khanh Tran

IPC分类号： H01L214763

CPC分类号： H01L21/7685 ,  H01L21/76837 ,  H01L21/76858 ,  H01L21/76885 ,  H01L23/53223 ,  H01L2221/1078 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for making 0.25-micron semiconductor chips includes annealing the metal interconnect lines prior to depositing an inter-layer dielectric (ILD) between the lines. During annealing, an alloy of aluminum and titanium forms, which subsequently volumetrically contracts, with the contraction being absorbed by the aluminum. Because the alloy is reacted prior to ILD deposition, however, the aluminum is not constrained by the ILD when it attempts to absorb the contraction of the alloy. Consequently, the likelihood of undesirable void formation. in the interconnect lines is reduced. The likelihood of undesirable void formation is still further reduced during the subsequent ILD gapfill deposition process by using relatively low bias power to reduce vapor deposition temperature. and by using relatively low source gas deposition flow rates to reduce flow-induced compressive stress on the interconnect lines during ILD formation.

摘要翻译： 制造0.25微米半导体芯片的方法包括在线之间沉积层间电介质（ILD）之前退火金属互连线。 在退火期间，形成铝和钛的合金，其随后容积收缩，铝的收缩被铝吸收。 因为合金在ILD沉积之前反应，所以当铝试图吸收合金的收缩时，铝不受ILD的约束。 因此，形成不希望的空隙的可能性。 在互连线路中减少。 在随后的ILD间隙填充沉积过程中，通过使用相对低的偏压功率来降低气相沉积温度，仍然进一步降低了不希望的空隙形成的可能性。 并且通过使用相对低的源气体沉积流速来减少在ILD形成期间在互连线上的流动引起的压缩应力。

公开(公告)号：US6100179A

公开(公告)日：2000-08-08

申请号：US415218

申请日：1999-10-12

申请人： Khanh Tran

发明人： Khanh Tran

IPC分类号： H01L23/532 ,  H01L21/4763

CPC分类号： H01L23/53223 ,  H01L23/5329 ,  H01L2924/0002

摘要： Spacings between metal features are gap filled with HSQ without degradation of the electromigration resistance by depositing a conformal dielectric liner encapsulating the metal features before depositing the HSQ gap fill layer. Embodiments include depositing a conformal layer of a high density plasma oxide by high density plasma chemical deposition to a thickness of about 100 .ANG. to about 1,000 .ANG..

公开(公告)号：US6034420A

公开(公告)日：2000-03-07

申请号：US993051

申请日：1997-12-18

申请人： Khanh Tran

发明人： Khanh Tran

IPC分类号： H01L23/532 ,  H01L23/58

CPC分类号： H01L23/53223 ,  H01L23/5329 ,  H01L2924/0002

摘要： Spacings between metal features are gap filled with HSQ without degradation of the electromigration resistance by depositing a conformal dielectric liner encapsulating the metal features before depositing the HSQ gap fill layer. Embodiments include depositing a conformal layer of a high density plasma oxide by high density plasma chemical deposition to a thickness of about 100 .ANG. to about 1,000 .ANG..

摘要翻译： 通过在沉积HSQ间隙填充层之前沉积封装金属特征的共形电介质衬垫，金属特征之间的间距通过HSQ间隙填充而不降低电迁移阻力。 实施例包括通过高密度等离子体化学沉积沉积高密度等离子体氧化物的保形层至约100至约1000的厚度。