Abstract:
Optical components may be precisely positioned in three dimensions with respect to one another. A bonder which has the ability to precisely position the components in two dimensions can be utilized. The components may be equipped with contacts at different heights so that as the components come together in a third dimension, their relative positions can be sensed. This information may be fed back to the bonder to control the precise alignment in the third dimension.
Abstract:
A plurality of transducer elements are formed. For each of the plurality of transducer elements, an electrode of the transducer element is formed on a first side of a support layer. A piezoelectric element of the transducer element is formed on the first side of the support layer. An interconnect of the transducer element is formed in the support layer. The support layer is thinned to expose a second side of the support layer. The interconnects of the plurality of transducer elements extend between the first side and the second side of the support layer. The second side of the support layer is bonded to a flexible layer with an adhesive material. Conductive fillers are disposed in the adhesive material. The interconnects of the plurality of transducer elements are each electrically coupled via the conductive fillers to the corresponding interconnect extending through the flexible layer.
Abstract:
Techniques and mechanisms to provide mechanical support for a micromachined piezoelectric transducer array. In an embodiment, a transducer array includes transducer elements each comprising a respective membrane portion and a respective supporting structure disposed on or around a periphery of that membrane portion. The transducer elements are initially formed on a sacrificial wafer, wherein supporting structures of the transducer elements facilitate subsequent removal of the sacrificial wafer and/or subsequent handling of the transducer elements. In another embodiment, a polymer layer is disposed on the transducer elements to provide for flexible support during such subsequent handling.
Abstract:
Techniques and structures for providing flexibility of a micromachined transducer array. In an embodiment, a transducer array includes a plurality of transducer elements each comprising a piezoelectric element and one or more electrodes disposed in or on a support layer. The support layer is bonded to a flexible layer including a polymer material, wherein flexibility of the transducer array results in part from a total thickness of a flexible layer. In another embodiment, flexibility of the transducer array results in part from one or more flexural structures formed therein.
Abstract:
A method and system for providing a pole of magnetic transducer having an air-bearing surface (ABS) are described. Leading shield and planarization stop layers are provided. Portions of the planarization stop and shield layers distal from the ABS location are removed, providing a depression forming a bevel. The bevel has an angle greater than zero and less than ninety degrees. An intermediate layer having a top surface substantially perpendicular to the ABS location is provided. Part of the intermediate layer is removed, forming a trench having a bottom corresponding to the leading shield and a location and profile corresponding to the pole. A nonmagnetic layer is provided at least partially in the trench. The pole with a leading edge bevel corresponding to the bevel is provided in the trench. A capping layer covering the pole is provided, at least part of the intermediate layer removed, and a wrap-around shield provided.
Abstract:
A well may be formed for access to an optical waveguide core by a process that results in an L-shaped well. The L-shaped well may then be filled with a polymer. By controlling the size of each portion of well, the occurrence of bubbles within the well and cuts to the core may be reduced.
Abstract:
Optical components may be precisely positioned in three dimensions with respect to one another. A bonder which has the ability to precisely position the components in two dimensions can be utilized. The components may be equipped with contacts at different heights so that as the components come together in a third dimension, their relative positions can be sensed. This information may be fed back to the bonder to control the precise alignment in the third dimension.
Abstract:
Systems and methods for providing hybrid coils for magnetic write heads used in disk drives are described. One such system includes a magnetic read/write head including a read transducer, and a write transducer including a pair of write poles, a hybrid coil including a first coil having a pancake coil configuration including at least one turn positioned between the pair of write poles, and a second coil having a helical coil configuration including a plurality of turns positioned between the pair of write poles, the second coil coupled to the first coil, where the at least one turn of the first coil is interleaved with the turns of the second coil.
Abstract:
A method and system provide a magnetic transducer that includes an underlayer and a first nonmagnetic layer on the underlayer. The method and system include providing a first trench in the first nonmagnetic layer. The first trench has at least one edge corresponding to at least one side shield. The method and system also include providing a second nonmagnetic layer in the first trench and providing a second trench in the second nonmagnetic layer. The method and system include providing the main pole. At least part of the main pole resides in the second trench. The method and system further include removing at least a portion of the second nonmagnetic layer between the edge(s) and the main pole. The method and system also provide the side shield(s) in the first trench. The side shield(s) extend from at least an air-bearing surface location to not further than a coil front location.
Abstract:
A method and system provide a magnetic transducer that includes an air-bearing surface (ABS). The magnetic transducer includes an underlayer and a main pole residing on the underlayer. The main pole includes a front and a rear. The front resides at the ABS, while the rear is distal from the ABS. The main pole also includes a first portion having a first magnetic moment and a second portion having a second magnetic moment. The first portion has a front face at the ABS and terminates between the ABS and the rear of the main pole. A part of the second portion resides on the first portion, while another part of the second portion resides between the first portion of the main pole and the rear of the main pole. The first magnetic moment is less than the second magnetic moment.