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    FLEXIBLE MICROMACHINED TRANSDUCER DEVICE AND METHOD FOR FABRICATING SAME
    1.
    发明申请
    FLEXIBLE MICROMACHINED TRANSDUCER DEVICE AND METHOD FOR FABRICATING SAME 审中-公开
    柔性微型传感器装置及其制造方法

    公开(公告)号：US20170062694A1

    公开(公告)日：2017-03-02

    申请号：US15353695

    申请日：2016-11-16

    申请人： Dimitre Latev ,  Arman Hajati ,  Darren Todd Imai ,  Ut Tran

    发明人： Dimitre Latev ,  Arman Hajati ,  Darren Todd Imai ,  Ut Tran

    IPC分类号： H01L41/04 ,  B32B37/12 ,  H01L41/29 ,  B06B1/06 ,  H01L41/047 ,  H01L41/09

    摘要： Techniques and structures for providing flexibility of a micromachined transducer array. In an embodiment, a transducer array includes a plurality of transducer elements each comprising a piezoelectric element and one or more electrodes disposed in or on a support layer. The support layer is bonded to a flexible layer including a polymer material, wherein flexibility of the transducer array results in part from a total thickness of a flexible layer. In another embodiment, flexibility of the transducer array results in part from one or more flexural structures formed therein.

    摘要翻译： 提供微机械传感器阵列的灵活性的技术和结构。 在一个实施例中，换能器阵列包括多个换能器元件，每个换能器元件包括压电元件和设置在支撑层中或支撑层上的一个或多个电极。 支撑层结合到包括聚合物材料的柔性层，其中换能器阵列的灵活性部分地来自柔性层的总厚度。 在另一个实施例中，换能器阵列的灵活性部分地由其中形成的一个或多个弯曲结构导致。

    Method for fabricating flexible micromachined transducer device
    3.
    发明授权
    Method for fabricating flexible micromachined transducer device 有权

    公开(公告)号：US10586912B2

    公开(公告)日：2020-03-10

    申请号：US15353695

    申请日：2016-11-16

    申请人： Dimitre Latev ,  Arman Hajati ,  Darren Todd Imai ,  Ut Tran

    发明人： Dimitre Latev ,  Arman Hajati ,  Darren Todd Imai ,  Ut Tran

    IPC分类号： H01L41/04 ,  H01L41/29 ,  B32B37/14 ,  B06B1/06 ,  H01L41/047 ,  H01L41/09 ,  B32B37/12 ,  B32B37/18

    摘要： A plurality of transducer elements are formed. For each of the plurality of transducer elements, an electrode of the transducer element is formed on a first side of a support layer. A piezoelectric element of the transducer element is formed on the first side of the support layer. An interconnect of the transducer element is formed in the support layer. The support layer is thinned to expose a second side of the support layer. The interconnects of the plurality of transducer elements extend between the first side and the second side of the support layer. The second side of the support layer is bonded to a flexible layer with an adhesive material. Conductive fillers are disposed in the adhesive material. The interconnects of the plurality of transducer elements are each electrically coupled via the conductive fillers to the corresponding interconnect extending through the flexible layer.

    FLEXIBLE MICROMACHINED TRANSDUCER DEVICE AND METHOD FOR FABRICATING SAME
    4.
    发明申请
    FLEXIBLE MICROMACHINED TRANSDUCER DEVICE AND METHOD FOR FABRICATING SAME 有权
    柔性微型传感器装置及其制造方法

    公开(公告)号：US20150158052A1

    公开(公告)日：2015-06-11

    申请号：US14103672

    申请日：2013-12-11

    申请人： Dimitre Latev ,  Arman Hajati ,  Darren Todd Imai ,  Ut Tran

    发明人： Dimitre Latev ,  Arman Hajati ,  Darren Todd Imai ,  Ut Tran

    IPC分类号： B06B1/02 ,  B06B1/06 ,  H01L41/04 ,  B32B37/24

    CPC分类号： H01L41/042 ,  B06B1/0622 ,  B32B37/12 ,  B32B37/185 ,  B32B2457/00 ,  H01L41/0475 ,  H01L41/098 ,  H01L41/29 ,  Y10T156/10

    摘要： Techniques and structures for providing flexibility of a micromachined transducer array. In an embodiment, a transducer array includes a plurality of transducer elements each comprising a piezoelectric element and one or more electrodes disposed in or on a support layer. The support layer is bonded to a flexible layer including a polymer material, wherein flexibility of the transducer array results in part from a total thickness of a flexible layer. In another embodiment, flexibility of the transducer array results in part from one or more flexural structures formed therein.

    摘要翻译： 提供微机械传感器阵列的灵活性的技术和结构。 在一个实施例中，换能器阵列包括多个换能器元件，每个换能器元件包括压电元件和设置在支撑层中或支撑层上的一个或多个电极。 支撑层结合到包括聚合物材料的柔性层，其中换能器阵列的灵活性部分地来自柔性层的总厚度。 在另一个实施例中，换能器阵列的灵活性部分地由其中形成的一个或多个弯曲结构导致。

    METHOD, APPARATUS AND SYSTEM FOR A TRANSFERABLE MICROMACHINED PIEZOELECTRIC TRANSDUCER ARRAY
    8.
    发明申请
    METHOD, APPARATUS AND SYSTEM FOR A TRANSFERABLE MICROMACHINED PIEZOELECTRIC TRANSDUCER ARRAY 有权
    可转移微电子压电传感器阵列的方法，装置和系统

    公开(公告)号：US20150200350A1

    公开(公告)日：2015-07-16

    申请号：US14152899

    申请日：2014-01-10

    申请人： Arman Hajati ,  Ut Tran ,  Darren Imai ,  Martin Schoeppler

    发明人： Arman Hajati ,  Ut Tran ,  Darren Imai ,  Martin Schoeppler

    IPC分类号： H01L41/053 ,  H01L41/25 ,  H01L41/33 ,  H01L41/047 ,  B06B1/06

    CPC分类号： B06B1/0622 ,  B06B1/0688 ,  H01L41/098 ,  H01L41/313 ,  H01L41/331 ,  Y10T29/42

    摘要： Techniques and mechanisms to provide mechanical support for a micromachined piezoelectric transducer array. In an embodiment, a transducer array includes transducer elements each comprising a respective membrane portion and a respective supporting structure disposed on or around a periphery of that membrane portion. The transducer elements are initially formed on a sacrificial wafer, wherein supporting structures of the transducer elements facilitate subsequent removal of the sacrificial wafer and/or subsequent handling of the transducer elements. In another embodiment, a polymer layer is disposed on the transducer elements to provide for flexible support during such subsequent handling.

    摘要翻译： 为微加工压电换能器阵列提供机械支撑的技术和机制。 在一个实施例中，换能器阵列包括换能器元件，每个换能器元件包括设置在该膜部分的周边上或周围的相应的膜部分和相应的支撑结构。 换能器元件最初形成在牺牲晶片上，其中换能器元件的支撑结构有助于随后去除牺牲晶片和/或随后处理换能器元件。 在另一个实施方案中，聚合物层设置在换能器元件上以在随后的处理期间提供柔性支撑。

    Multi-frequency ultra wide bandwidth transducer
    9.
    发明授权
    Multi-frequency ultra wide bandwidth transducer 有权
    多频超宽带传感器

    公开(公告)号：US08767512B2

    公开(公告)日：2014-07-01

    申请号：US13835500

    申请日：2013-03-15

    申请人： Arman Hajati

    发明人： Arman Hajati

    IPC分类号： B06B1/06 ,  H01L41/08 ,  H01L41/047 ,  H04R17/00 ,  H01L41/09

    CPC分类号： H01L41/0475 ,  B06B1/0622 ,  B06B1/0629 ,  G01S7/521 ,  G10K11/346 ,  H01L41/047 ,  H01L41/0825 ,  H01L41/098 ,  H04R17/00 ,  H04R2201/401 ,  H04R2201/403

    摘要： Piezoelectric micromachined ultrasonic transducer (pMUT) arrays and techniques for frequency shaping in pMUT arrays are described, for example to achieve both high frequency and low frequency operation in a same device. The ability to operate at both high and low frequencies may be tuned during use of the device to adaptively adjust for optimal resolution at a particular penetration depth of interest. In embodiments, various sizes of piezoelectric membranes are fabricated for tuning resonance frequency across the membranes. The variously sized piezoelectric membranes are lumped together by two or more separate electrode rails, enabling independent addressing between the two or more subgroups of sized transducer elements. Signal processing of the drive and/or response signals generated and/or received from each of the two or more electrode rails may achieve a variety of operative modes for the device, such as a near field mode, a far field mode, and an ultra wide bandwidth mode.

    摘要翻译： 例如，在同一设备中实现高频和低频操作的压电微机械超声换能器（pMUT）阵列和pMUT阵列中的频率整形技术。 在使用设备期间可以调节在高频和低频两种操作的能力，以适应性地调整在感兴趣的特定穿透深度处的最佳分辨率。 在实施例中，制造各种尺寸的压电膜以调谐跨越膜的共振频率。 各种尺寸的压电膜通过两个或更多个单独的电极轨道集中在一起，使得可以在两个或更多个尺寸的换能器元件的子组之间进行独立寻址。 从两个或更多个电极轨道中的每个产生和/或接收的驱动和/或响应信号的信号处理可以实现用于设备的各种操作模式，诸如近场模式，远场模式和超级 宽带宽模式。

    Piezoelectric transducer device for configuring a sequence of operational modes
    10.
    发明授权
    Piezoelectric transducer device for configuring a sequence of operational modes 有权

    公开(公告)号：US10022751B2

    公开(公告)日：2018-07-17

    申请号：US14292413

    申请日：2014-05-30

    申请人： Arman Hajati ,  Deane Gardner ,  Christopher M. Daft

    发明人： Arman Hajati ,  Deane Gardner ,  Christopher M. Daft

    IPC分类号： B06B1/00 ,  B06B1/06 ,  G10K11/34 ,  B06B1/02

    摘要： In an embodiment, a tile device includes a plurality of piezoelectric transducers elements and a base adjoining and supporting the plurality of piezoelectric transducers elements. The base includes integrated circuitry programmed to successively configure operational modes of the tile, according to a pre-programmed sequence, to successively select respective subsets of the piezoelectric transducers elements for activation. The integrated circuitry includes pulser logic to selectively activate such subsets, and demultiplexer logic to communicate from the tile sense signals resulting from such activation. In another embodiment, the demultiplexer logic is part of a first voltage domain of the tile, and the pulser logic is part of a second voltage domain of the tile. The base may include circuitry to protect the demultiplexer logic from a relatively high voltage level of the second voltage domain.