Semiconductor laser device and method of manufacturing the same
    21.
    发明授权
    Semiconductor laser device and method of manufacturing the same 失效
    半导体激光器件及其制造方法

    公开(公告)号:US07903709B2

    公开(公告)日:2011-03-08

    申请号:US12357282

    申请日:2009-01-21

    IPC分类号: H01S5/00

    摘要: A semiconductor laser device includes a substrate and a semiconductor layer formed on a surface of the substrate and having a waveguide extending in a first direction parallel to the surface, wherein the waveguide is formed on a region approaching a first side from a center of the semiconductor laser device in a second direction parallel to the surface and intersecting with the first direction, a first region separated from the waveguide on a side opposite to the first side of the waveguide and extending parallel to the first direction and a first recess portion separated from the waveguide on an extension of a facet of the waveguide, intersecting with the first region and extending in the second direction are formed on an upper surface of the semiconductor laser device, and a thickness of the semiconductor layer on the first region is smaller than a thickness of the semiconductor layer on a region other than the first region.

    摘要翻译: 半导体激光器件包括衬底和形成在衬底的表面上的半导体层,并且具有沿平行于表面的第一方向延伸的波导,其中波导形成在从半导体的中心接近第一侧的区域 激光装置在与第一方向平行的第二方向上与第一方向相交的第一区域,与波导的与波导的第一侧相反的一侧并且平行于第一方向延伸的第一凹部, 在半导体激光器件的上表面上形成有与第一区域交叉且沿第二方向延伸的波导的小平面的延伸的波导,并且第一区域上的半导体层的厚度小于厚度 的第一区域以外的区域。

    SEMICONDUCTOR LASER DEVICE AND METHOD OF MANUFACTURING THE SAME
    23.
    发明申请
    SEMICONDUCTOR LASER DEVICE AND METHOD OF MANUFACTURING THE SAME 失效
    半导体激光器件及其制造方法

    公开(公告)号:US20090185594A1

    公开(公告)日:2009-07-23

    申请号:US12357282

    申请日:2009-01-21

    IPC分类号: H01S5/026 H01L21/00

    摘要: A semiconductor laser device includes a substrate and a semiconductor layer formed on a surface of the substrate and having a waveguide extending in a first direction parallel to the surface, wherein the waveguide is formed on a region approaching a first side from a center of the semiconductor laser device in a second direction parallel to the surface and intersecting with the first direction, a first region separated from the waveguide on a side opposite to the first side of the waveguide and extending parallel to the first direction and a first recess portion separated from the waveguide on an extension of a facet of the waveguide, intersecting with the first region and extending in the second direction are formed on an upper surface of the semiconductor laser device, and a thickness of the semiconductor layer on the first region is smaller than a thickness of the semiconductor layer on a region other than the first region.

    摘要翻译: 半导体激光器件包括衬底和形成在衬底的表面上的半导体层,并且具有沿平行于表面的第一方向延伸的波导,其中波导形成在从半导体的中心接近第一侧的区域 激光装置在与第一方向平行的第二方向上与第一方向相交的第一区域,与波导的与波导的第一侧相反的一侧并且平行于第一方向延伸的第一凹部, 在半导体激光器件的上表面上形成有与第一区域交叉且沿第二方向延伸的波导的小平面的延伸的波导,并且第一区域上的半导体层的厚度小于厚度 的第一区域以外的区域。

    NITRIDE BASED SEMICONDUCTOR LASER DEVICE
    24.
    发明申请
    NITRIDE BASED SEMICONDUCTOR LASER DEVICE 有权
    基于氮化物的半导体激光器件

    公开(公告)号:US20090086783A1

    公开(公告)日:2009-04-02

    申请号:US12236616

    申请日:2008-09-24

    IPC分类号: H01S5/026

    摘要: One facet of a nitride based semiconductor laser device is composed of a cleavage plane of (0001), and the other facet thereof is composed of a cleavage plane of (000 1). Thus, the one facet and the other facet are respectively a Ga polar plane and an N polar plane. A portion of the one facet and a portion of the other facet, which are positioned in an optical waveguide, constitute a pair of cavity facets. A first protective film including nitrogen as a constituent element is formed on the one facet. A second protective film including oxygen as a constituent element is formed on the other facet.

    摘要翻译: 氮化物基半导体激光器件的一个面由(0001)的解理面构成,其另一个面由(000

    Light emitting device and fabrication method thereof
    26.
    发明申请
    Light emitting device and fabrication method thereof 审中-公开
    发光元件及其制造方法

    公开(公告)号:US20050141240A1

    公开(公告)日:2005-06-30

    申请号:US10953066

    申请日:2004-09-30

    摘要: A pre-curing viscous solution (precursor solution) is applied to the back surface of a substrate for forming an optically transparent layer principally composed of an inorganic material. The substrate is heated or irradiated with UV light while being pressed with unevenness of a mold. By removing the substrate from the mold, the optically transparent, inorganic material layer principally composed of the inorganic material is formed on the substrate. In this manner, the inorganic material layer with the unevenness is formed on the back surface of the substrate (a light extraction surface) by embossing.

    摘要翻译: 将预固化粘性溶液(前体溶液)施加到用于形成主要由无机材料构成的光学透明层的基板的背面。 在用模具的不均匀性压制的同时,用UV光照射基板。 通过从模具中除去基材,在基材上形成主要由无机材料构成的光学透明的无机材料层。 以这种方式,通过压花在基板的背面(光提取面)上形成具有凹凸的无机材料层。

    Semiconductor laser device and method of manufacturing the same
    28.
    发明授权
    Semiconductor laser device and method of manufacturing the same 有权
    半导体激光器件及其制造方法

    公开(公告)号:US08193016B2

    公开(公告)日:2012-06-05

    申请号:US12985632

    申请日:2011-01-06

    IPC分类号: H01L21/00

    摘要: A semiconductor laser device includes a substrate and a semiconductor layer formed on a surface of the substrate and having a waveguide extending in a first direction parallel to the surface, wherein the waveguide is formed on a region approaching a first side from a center of the semiconductor laser device in a second direction parallel to the surface and intersecting with the first direction, a first region separated from the waveguide on a side opposite to the first side of the waveguide and extending parallel to the first direction and a first recess portion separated from the waveguide on an extension of a facet of the waveguide, intersecting with the first region and extending in the second direction are formed on an upper surface of the semiconductor laser device, and a thickness of the semiconductor layer on the first region is smaller than a thickness of the semiconductor layer on a region other than the first region.

    摘要翻译: 半导体激光器件包括衬底和形成在衬底的表面上的半导体层,并且具有沿平行于表面的第一方向延伸的波导,其中波导形成在从半导体的中心接近第一侧的区域 激光装置在与第一方向平行的第二方向上与第一方向相交的第一区域,与波导的与波导的第一侧相反的一侧并且平行于第一方向延伸的第一凹部, 在半导体激光器件的上表面上形成有与第一区域交叉且沿第二方向延伸的波导的小平面的延伸的波导,并且第一区域上的半导体层的厚度小于厚度 的第一区域以外的区域。

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
    30.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE 有权
    制造半导体器件和半导体器件的方法

    公开(公告)号:US20110210365A1

    公开(公告)日:2011-09-01

    申请号:US13105386

    申请日:2011-05-11

    IPC分类号: H01L33/58

    摘要: A method of manufacturing a semiconductor device includes steps of forming a semiconductor device layer on an upper surface of a substrate including the upper surface, a lower surface and a dislocation concentrated region arranged so as to part a first side closer to the upper surface and a second side closer to the lower surface, exposing a portion where the dislocation concentrated region does not exist above on the lower surface by removing the substrate on the second side along with at least a part of the dislocation concentrated region, and forming an electrode on the portion.

    摘要翻译: 一种制造半导体器件的方法包括以下步骤:在包括上表面,下表面和位错集中区域的基板的上表面上形成半导体器件层,以便将第一侧部分靠近上表面部分,以及 第二侧更靠近下表面,通过沿着位错集中区域的至少一部分去除第二侧的基板,在下表面上方露出位错集中区域不存在的部分,并且在第二侧上形成电极 一部分。