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公开(公告)号:US09727239B2
公开(公告)日:2017-08-08
申请号:US14725712
申请日:2015-05-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dimin Niu , Hongzhong Zheng , Suhas , Krishna Malladi
CPC classification number: G06F3/06 , G06F3/061 , G06F3/0631 , G06F3/0688 , G06F3/0689
Abstract: An electronic system includes: an interface block of a storage device configured to process system information from a system device; a memory block of the storage device, coupled to the interface block, partitioned by the interface block configured to process the system information for partitioning the memory block; and a storage block of a storage device, coupled to the memory block, configured to access a data block of the storage block provided to the system device.
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公开(公告)号:US12242344B2
公开(公告)日:2025-03-04
申请号:US18127329
申请日:2023-03-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dimin Niu , Mu-Tien Chang , Hongzhong Zheng , Hyun-Joong Kim , Won-hyung Song , Jangseok Choi
Abstract: A method of correcting a memory error of a dynamic random-access memory module (DRAM) using a double data rate (DDR) interface, the method includes conducting a memory transaction including multiple bursts with a memory controller to send data from data chips of the DRAM to the memory controller, detecting one or more errors using an ECC chip of the DRAM, determining a number of the bursts having the errors using the ECC chip of the DRAM, determining whether the number of the bursts having the errors is greater than a threshold number, determining a type of the errors, and directing the memory controller based on the determined type of the errors, wherein the DRAM includes a single ECC chip per memory channel.
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23.
公开(公告)号:US12153646B2
公开(公告)日:2024-11-26
申请号:US17967733
申请日:2022-10-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dongyan Jiang , Dimin Niu , Hongzhong Zheng
Abstract: An adaptive matrix multiplier. In some embodiments, the matrix multiplier includes a first multiplying unit a second multiplying unit, a memory load circuit, and an outer buffer circuit. The first multiplying unit includes a first inner buffer circuit and a second inner buffer circuit, and the second multiplying unit includes a first inner buffer circuit and a second inner buffer circuit. The memory load circuit is configured to load data from memory, in a single burst of a burst memory access mode, into the first inner buffer circuit of the first multiplying unit; and into the first inner buffer circuit of the second multiplying unit.
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24.
公开(公告)号:US12141227B2
公开(公告)日:2024-11-12
申请号:US16942570
申请日:2020-07-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dongyan Jiang , Dimin Niu , Hongzhong Zheng
Abstract: An adaptive matrix multiplier. In some embodiments, the matrix multiplier includes a first multiplying unit a second multiplying unit, a memory load circuit, and an outer buffer circuit. The first multiplying unit includes a first inner buffer circuit and a second inner buffer circuit, and the second multiplying unit includes a first inner buffer circuit and a second inner buffer circuit. The memory load circuit is configured to load data from memory, in a single burst of a burst memory access mode, into the first inner buffer circuit of the first multiplying unit; and into the first inner buffer circuit of the second multiplying unit.
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公开(公告)号:US20210311634A1
公开(公告)日:2021-10-07
申请号:US17353393
申请日:2021-06-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Mu-Tien Chang , Prasun Gera , Dimin Niu , Hongzhong Zheng
Abstract: A 3D-stacked memory device including: a base die including a plurality of switches to direct data flow and a plurality of arithmetic logic units (ALUs) to compute data; a plurality of memory dies stacked on the base die; and an interface to transfer signals to control the base die.
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公开(公告)号:US11138135B2
公开(公告)日:2021-10-05
申请号:US16194219
申请日:2018-11-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Krishna T. Malladi , Hongzhong Zheng , Dimin Niu , Peng Gu
Abstract: A high bandwidth memory (HBM) system includes a first HBM+ card. The first HBM+ card includes a plurality of HBM+ cubes. Each HBM+ cube has a logic die and a memory die. The first HBM+ card also includes a HBM+ card controller coupled to each of the plurality of HBM+ cubes and configured to interface with a host, a pin connection configured to connect to the host, and a fabric connection configured to connect to at least one HBM+ card.
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公开(公告)号:US10929026B2
公开(公告)日:2021-02-23
申请号:US15136872
申请日:2016-04-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dimin Niu , Mu-Tien Chang , Hongzhong Zheng
IPC: G06F12/1009 , G06F12/02 , G06F3/06 , G11C13/00 , G11C8/06
Abstract: A non-volatile memory comprises an array of a plurality of non-volatile memory cells, a controller coupled to the array, and an evaluator coupled to an output of the array. In a first operational mode, the controller receives a logical address and selects one non-volatile memory cell for access. In a second operational mode, and the controller receives a logical address and selects N non-volatile memory cells for access in which N is an integer greater than 1. If the logical address is for a read access, in the first operational mode the evaluator is disabled and the read-address output of the array corresponds to one selected non-volatile memory cell, and in the second operational mode the evaluator determines an read-address output corresponding to the received logical address based on a read output of the N selected non-volatile memory cells.
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公开(公告)号:US10795764B2
公开(公告)日:2020-10-06
申请号:US16411127
申请日:2019-05-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dimin Niu , Mu-Tien Chang , Hongzhong Zheng , Hyun-Joong Kim , Won-Hyung Song , Jangseok Choi
IPC: G06F11/10 , G11C29/52 , G11C11/4093
Abstract: A data chip that may pollute data is disclosed. The data chip may include a data array, read circuitry to read raw data from the data array, and a buffer to store the raw data. Using a pollution pattern stored in a mask register, a data pollution engine may pollute the raw data. Transmission circuitry may then transmit the polluted data.
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公开(公告)号:US10394719B2
公开(公告)日:2019-08-27
申请号:US15457813
申请日:2017-03-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: Mu-Tien Chang , Dimin Niu , Hongzhong Zheng
IPC: G06F12/126 , G06F12/128 , G11C11/406
Abstract: A method for replacing data on a volatile memory cache is provided. The volatile memory cache includes one or more memory banks and each of the memory banks includes a plurality of memory lines. The method includes: identifying a replacement ID for at least one of the memory lines to be replaced; identifying a refresh bank ID for one of the memory banks to be refreshed; determining whether or not a conflict exists between the replacement ID and the refresh bank ID; and selecting a new replacement ID if the conflict exists.
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公开(公告)号:US20190179704A1
公开(公告)日:2019-06-13
申请号:US16276304
申请日:2019-02-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dimin Niu , Mu-Tien Chang , Hongzhong Zheng , Hyun-Joong Kim , Won-hyung Song , Jangseok Choi
Abstract: A method of correcting a memory error of a dynamic random-access memory module (DRAM) using a double data rate (DDR) interface, the method includes conducting a memory transaction including multiple bursts with a memory controller to send data from data chips of the DRAM to the memory controller, detecting one or more errors using an ECC chip of the DRAM, determining a number of the bursts having the errors using the ECC chip of the DRAM, determining whether the number of the bursts having the errors is greater than a threshold number, determining a type of the errors, and directing the memory controller based on the determined type of the errors, wherein the DRAM includes a single ECC chip per memory channel.
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