公开(公告)号：US20240141535A1

公开(公告)日：2024-05-02

申请号：US18569066

申请日：2021-12-10

Applicant: SEMSYSCO GMBH

Inventor： Andreas Gleissner ,  Ulrich Tschinderle

IPC: C25D5/08 ,  C25D21/10

CPC classification number: C25D5/08 ,  C25D21/10

Abstract: The present invention relates to a system of at least two distribution body elements for a chemical and/or electric surface treatment of a substrate, a modular distribution body comprising such a system and a manufacturing method for at least two distribution body elements.
In the system of at least two distribution body elements, each distribution body element has a plate shape and comprises jet openings for distributing a process fluid from inside the distribution body element to the substrate to be treated and drain openings for distributing the process fluid and an electric current through the distribution body element. Each distribution body element has a connecting area configured to be connected to a connecting area of another distribution body element to form a modular distribution body comprising at least two distribution body elements.

公开(公告)号：US20240141534A1

公开(公告)日：2024-05-02

申请号：US18280784

申请日：2021-12-02

Applicant: SEMSYSCO GMBH

Inventor： Andreas Gleissner ,  Georg Hofer ,  Marianne Kolitsch-MataIn

IPC: C25D5/08 ,  C25D5/04 ,  C25D17/00 ,  C25D21/10

CPC classification number: C25D5/08 ,  C25D5/04 ,  C25D17/001 ,  C25D21/10

Abstract: The disclosure relates to a distribution system for a process fluid for a chemical and/or electrolytic surface treatment of a substrate, comprising: a distribution body, and a substrate holder, wherein the substrate holder has a substrate holder length (L) and a substrate holder width (W) and is configured to hold the substrate to be treated, wherein the distribution body comprises several openings for a process fluid and/or an electric current, wherein the distribution body and the substrate holder are moveable relative to each other, wherein the distribution body has a distribution body length (l) and a distribution body width (w), and wherein the distribution body length (l) is smaller than the substrate holder length (L).

公开(公告)号：US11164748B2

公开(公告)日：2021-11-02

申请号：US16256194

申请日：2019-01-24

Applicant: Semsysco GmbH

Inventor： Franz Markut ,  Thomas Wirnsberger ,  Oliver Knoll ,  Andreas Gleissner ,  Harald Okorn-Schmidt ,  Philipp Engesser

IPC: H01L21/288 ,  C25D17/00 ,  C25D21/12 ,  C25D5/02 ,  C25D7/12 ,  C25D5/34 ,  C25D21/04 ,  C25D5/00 ,  H01L21/768 ,  H05K3/42 ,  B05C3/00 ,  B05C3/02 ,  B05C9/14

Abstract: The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps: a) Providing a substrate with a substrate surface comprising at least one recess, b) applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas, c) applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and d) plating the recess.

公开(公告)号：US20210017662A1

公开(公告)日：2021-01-21

申请号：US17064295

申请日：2020-10-06

Applicant: Semsysco GmbH

Inventor： Andreas Gleissner ,  Thomas Wirnsberger ,  Herbert Ötzlinger

IPC: C25D5/34 ,  C25D17/00 ,  C25D17/06 ,  B05C3/132 ,  C25D5/08 ,  C25D7/12 ,  H01L21/288 ,  H01L21/768

Abstract: Exemplary substrate locking system, device, apparatus and method for chemical and/or electrolytic surface treatment of a substrate in a process fluid can be provided. For example, it is possible to provide a first element, a second element and a locking unit. The first element and the second element can be configured to hold the substrate between each other. The locking unit can be configured to lock the first element and the second element with each other. The locking unit can comprise a magnet control device and a magnet. The magnet can be arranged at or near the first element and/or the second element. The magnet control device can be configured to control a magnetic force between the first element and the second element.