Graphene channel silicon carbide power semiconductor transistor

    公开(公告)号:US11158708B1

    公开(公告)日:2021-10-26

    申请号:US16486494

    申请日:2018-09-25

    Abstract: The invention provides a graphene channel silicon carbide power semiconductor transistor, and its cellular structure thereof. Characterized in that, a graphene strip serving as a channel is embedded in a surface of the P-type body region and two ends of the graphene strip are respectively contacted with a boundary between the N+-type source region and the P-type body region and a boundary between the P-type body region and the N-type drift region, and the graphene strip is distributed in a cellular manner in a gate width direction, a conducting channel of a device is still made of graphene; in the case of maintaining basically invariable on-resistance and current transmission capacity, the P-type body regions are separated by the graphene strip, thus enhancing a function of assisting depletion, which further reduces an overall off-state leakage current of the device, and improves a breakdown voltage.

    TRANSVERSE ULTRA-THIN INSULATED GATE BIPOLAR TRANSISTOR HAVING HIGH CURRENT DENSITY
    24.
    发明申请
    TRANSVERSE ULTRA-THIN INSULATED GATE BIPOLAR TRANSISTOR HAVING HIGH CURRENT DENSITY 有权
    具有高电流密度的横向超薄绝缘栅双极晶体管

    公开(公告)号:US20150270377A1

    公开(公告)日:2015-09-24

    申请号:US14439715

    申请日:2012-12-27

    Abstract: A transverse ultra-thin insulated gate bipolar transistor having current density includes: a P substrate, where the P substrate is provided with a buried oxide layer thereon, the buried oxide layer is provided with an N epitaxial layer thereon, the N epitaxial layer is provided with an N well region and P base region therein, the P base region is provided with a first P contact region and an N source region therein, the N well region is provided with an N buffer region therein, the N well region is provided with a field oxide layer thereon, the N buffer region is provided with a P drain region therein, the N epitaxial layer is provided therein with a P base region array including a P annular base region, the P base region array is located between the N well region and the P base region, the P annular base region is provided with a second P contact region and an N annular source region therein, and the second P contact region is located in the N annular source region. The present invention greatly increases current density of a transverse ultra-thin insulated gate bipolar transistor, thus significantly improving the performance of an intelligent power module.

    Abstract translation: 具有电流密度的横向超薄绝缘栅双极晶体管包括:P基板,其中P基板在其上设置有掩埋氧化物层,所述掩埋氧化物层在其上设置有N外延层,提供N外延层 在其中具有N阱区域和P基极区域,P基极区域中设置有第一P接触区域和N源极区域,N阱区域中设置有N个缓冲区域,N阱区域设置有 在其上的场氧化物层,N缓冲区在其中设置有P漏极区,N外延层中设置有包括P环状基极区的P基区阵列,P基区阵列位于N阱之间 区域和P基区域中,P环状基部区域设置有第二P接触区域和N环状源极区域,第二P接触区域位于N环状源极区域中。 本发明大大增加了横向超薄绝缘栅双极晶体管的电流密度,从而显着提高了智能功率模块的性能。

    High-threshold power semiconductor device and manufacturing method thereof

    公开(公告)号:US12107167B2

    公开(公告)日:2024-10-01

    申请号:US17762929

    申请日:2021-01-20

    CPC classification number: H01L29/7851 H01L29/1095 H01L29/778 H01L29/8122

    Abstract: The present invention discloses a high-threshold power semiconductor device and a manufacturing method thereof. The high-threshold power semiconductor device includes, in sequence from bottom to top: a metal drain electrode, a substrate, a buffer layer, and a drift region; further including: a composite column body which is jointly formed by a drift region protrusion, a columnar p-region and a columnar n-region on the drift region, a channel layer, a passivation layer, a dielectric layer, a heavily doped semiconductor layer, a metal gate electrode and a source metal electrode. The composite column body is formed by sequentially depositing a p-type semiconductor layer and an n-type semiconductor layer on the drift region and then etching same. The channel layer and the passivation layer are formed in sequence by deposition. Thus, the above devices are divided into a cell region and a terminal region. The dielectric layer, the heavily doped semiconductor layer, the metal gate electrode and the source metal electrode only exist in the cell region, and the passivation layer of the terminal region extends upwards and is wrapped outside the channel layer. This structure can increase a threshold voltage of the device, improve the blocking characteristics of the device and reduce the size of a gate capacitance.

    Multi-phase high-precision current sharing control method applied to constant on-time control

    公开(公告)号:US12046990B1

    公开(公告)日:2024-07-23

    申请号:US18641384

    申请日:2024-04-21

    CPC classification number: H02M1/082 H02M1/0025 H02M3/1586

    Abstract: A multi-phase high-precision current sharing control method applied to constant on-time control is provided, wherein a current difference between continuously sampled current of each line and mean current is processed by a PI compensation module and a low-pass filter module to obtain on-time regulation data. A high bit of the regulation data controls the value of counter reference Vref in an on-time control module, and a low bit controls the length of an enabled delay line in a delay line module. The counter timing control of the on-time control module is combined with the delay line timing control of the delay line module to improve the control precision of a DPWM. The method takes COT control of a Buck converter as a typical application. Compared with a multi-phase COT controller without a current-sharing mechanism, the method can improve the stability and reliability of the system.

    Transverse ultra-thin insulated gate bipolar transistor having high current density
    28.
    发明授权
    Transverse ultra-thin insulated gate bipolar transistor having high current density 有权
    具有高电流密度的横向超薄绝缘栅双极晶体管

    公开(公告)号:US09240469B2

    公开(公告)日:2016-01-19

    申请号:US14439715

    申请日:2012-12-27

    Abstract: A transverse ultra-thin insulated gate bipolar transistor having current density includes: a P substrate, where the P substrate is provided with a buried oxide layer thereon, the buried oxide layer is provided with an N epitaxial layer thereon, the N epitaxial layer is provided with an N well region and P base region therein, the P base region is provided with a first P contact region and an N source region therein, the N well region is provided with an N buffer region therein, the N well region is provided with a field oxide layer thereon, the N buffer region is provided with a P drain region therein, the N epitaxial layer is provided therein with a P base region array including a P annular base region, the P base region array is located between the N well region and the P base region, the P annular base region is provided with a second P contact region and an N annular source region therein, and the second P contact region is located in the N annular source region. The present invention greatly increases current density of a transverse ultra-thin insulated gate bipolar transistor, thus significantly improving the performance of an intelligent power module.

    Abstract translation: 具有电流密度的横向超薄绝缘栅双极晶体管包括:P基板,其中P基板在其上设置有掩埋氧化物层,所述掩埋氧化物层在其上设置有N外延层,提供N外延层 在其中具有N阱区域和P基极区域,P基极区域中设置有第一P接触区域和N源极区域,N阱区域中设置有N个缓冲区域,N阱区域设置有 在其上的场氧化物层,N缓冲区在其中设置有P漏极区,N外延层中设置有包括P环状基极区的P基区阵列,P基区阵列位于N阱之间 区域和P基区域中,P环状基部区域设置有第二P接触区域和N环状源极区域,第二P接触区域位于N环状源极区域中。 本发明大大增加了横向超薄绝缘栅双极晶体管的电流密度,从而显着提高了智能功率模块的性能。

    Control method for four-switch buck-boost converter

    公开(公告)号:US12062985B1

    公开(公告)日:2024-08-13

    申请号:US18566102

    申请日:2022-09-26

    CPC classification number: H02M3/1582 H02M1/0058 H02M1/088

    Abstract: A control method for a four-switch buck-boost converter is provided. The control method adopts four-stage control, and divides the load range into two sections and adopts different control strategies according to a critical load value corresponding to optimal control. In Boost mode, before the critical load, T1 and T2 are kept constant, T3 is a minimum value for realizing soft-switching, and T4 decreases with the increase of the load; when the critical load is reached, T4 drops to 0; and after the critical load, T1, T2, T3 and T increase with the load. In Buck mode, before the critical load, T2 and T3 are kept constant, T1 is a minimum value for realizing soft-switching, and T4 decreases with the increase of the load; when the critical load is reached, T4 drops to 0; and after the critical load, T1, T2, T3 and T increase with the load.

    Gate drive circuit for reducing reverse recovery current of power device

    公开(公告)号:US11152936B2

    公开(公告)日:2021-10-19

    申请号:US17044623

    申请日:2020-04-15

    Abstract: The present invention discloses a gate drive circuit for reducing a reverse recovery current of a power device, and belongs to the field of basic electronic circuit technologies. The gate drive circuit includes a high-voltage LDMOS transistor, a diode forming a freewheeling path when the diode is turned on or a low-voltage MOS transistor in anti-parallel connection with a body diode, and a voltage detection circuit. When the power device is turned off, a freewheeling current produced by an inductive load flows through a freewheeling diode, the voltage detection circuit detects that the freewheeling diode is turned on, and an output signal is processed by a control circuit, to cause the drive circuit to output a high level, so that channels of the power device and the high-voltage LDMOS transistor are turned on, the freewheeling current flows through the conductive channels, almost not through the freewheeling diode, and there is no reverse recovery current in the freewheeling diode at this time, thereby reducing the reverse recovery current of the power device.

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