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公开(公告)号：US20220199545A1
公开(公告)日：2022-06-23
申请号：US17126621
申请日：2020-12-18
Applicant: STATS ChipPAC Pte. Ltd.
Inventor： ChangOh Kim , KyoungHee Park , JinHee Jung , OMin Kwon , JiWon Lee , YuJeong Jang
IPC: H01L23/552 , H01L23/00 , H01L23/31 , H01L21/56 , H01L21/033
Abstract: A semiconductor device has a semiconductor package including a substrate comprising a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A fanged metal mask is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The fanged metal mask is removed after forming the shielding layer.
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公开(公告)号：US10910322B2
公开(公告)日：2021-02-02
申请号：US16220934
申请日：2018-12-14
Applicant: STATS ChipPAC Pte. Ltd.
Inventor： ChangOh Kim , KyoWang Koo , SungWon Cho , BongWoo Choi , JiWon Lee
IPC: H01L21/00 , H01L23/552 , H01L21/311 , H01L21/56 , H01L23/31 , H01L23/00 , H01L23/66
Abstract: A semiconductor device has a substrate. An electrical component is disposed over a surface of the substrate. An encapsulant is deposited over the electrical component and substrate. A portion of the surface of the substrate remains exposed from the encapsulant. A shielding layer is formed over the encapsulant. A portion of the shielding layer is removed to expose the portion of the surface of the substrate.
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公开(公告)号：US20240170416A1
公开(公告)日：2024-05-23
申请号：US18429080
申请日：2024-01-31
Applicant: STATS ChipPAC Pte. Ltd.
Inventor： ChangOh Kim , KyoWang Koo , SungWon Cho , BongWoo Choi , JiWon Lee
CPC classification number: H01L23/552 , H01L21/56 , H01L23/28 , H01L23/66 , H01L24/94 , H01L25/50 , H01L2021/60112
Abstract: A semiconductor device has a substrate. A first component and second component are disposed over the substrate. The first component includes an antenna. A lid is disposed over the substrate between the first component and second component. An encapsulant is deposited over the substrate and lid. A conductive layer is formed over the encapsulant and in contact with the lid. A first portion of the conductive layer over the first component is removed using laser ablation.
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公开(公告)号：US11862478B2
公开(公告)日：2024-01-02
申请号：US17806924
申请日：2022-06-14
Applicant: STATS ChipPAC Pte. Ltd.
Inventor： ChangOh Kim , KyoungHee Park , JinHee Jung , OMin Kwon , JiWon Lee , YuJeong Jang
IPC: H01L21/683 , H01L21/48 , H01L23/31 , H01L23/498 , H01L23/552 , H01L23/544
CPC classification number: H01L21/4814 , H01L21/6835 , H01L23/3121 , H01L23/49822 , H01L23/49838 , H01L23/544 , H01L23/552 , H01L2221/6835 , H01L2221/68322 , H01L2223/54413
Abstract: A semiconductor device has a semiconductor package including a substrate with a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A metal mask having a fiducial marker is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The metal mask is removed after forming the shielding layer.
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公开(公告)号：US11784133B2
公开(公告)日：2023-10-10
申请号：US17136197
申请日：2020-12-29
Applicant: STATS ChipPAC Pte. Ltd.
Inventor： ChangOh Kim , KyoWang Koo , SungWon Cho , BongWoo Choi , JiWon Lee
IPC: H01L21/00 , H01L23/552 , H01L21/311 , H01L21/56 , H01L23/31 , H01L23/00 , H01L23/66
CPC classification number: H01L23/552 , H01L21/31144 , H01L21/563 , H01L21/565 , H01L23/3128 , H01L23/66 , H01L24/09 , H01L24/17
Abstract: A semiconductor device has a substrate. An electrical component is disposed over a surface of the substrate. An encapsulant is deposited over the electrical component and substrate. A portion of the surface of the substrate remains exposed from the encapsulant. A shielding layer is formed over the encapsulant. A portion of the shielding layer is removed to expose the portion of the surface of the substrate.
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Patent Agency Ranking
26.发明授权公开(公告)号：US11756897B2
公开(公告)日：2023-09-12
申请号：US17308410
申请日：2021-05-05
Applicant: STATS ChipPAC Pte. Ltd.
Inventor： ChangOh Kim , JinHee Jung , JiWon Lee , YuJeong Jang
IPC: H01L23/552 , H01L21/3213 , H01L25/065 , H01L23/31
CPC classification number: H01L23/552 , H01L21/32131 , H01L23/3107 , H01L25/0655
Abstract: A semiconductor device is formed by providing a semiconductor package including a shielding layer and forming a slot in the shielding layer using a laser. The laser is turned on and exposed to the shielding layer with a center of the laser disposed over a first point of the shielding layer. The laser is moved in a loop while the laser remains on and exposed to the shielding layer. Exposure of the laser to the shielding layer is stopped when the center of the laser is disposed over a second point of the shielding layer. A distance between the first point and the second point is approximately equal to a radius of the laser.
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27.发明申请公开(公告)号：US20220359419A1
公开(公告)日：2022-11-10
申请号：US17308410
申请日：2021-05-05
Applicant: STATS ChipPAC Pte. Ltd.
Inventor： ChangOh Kim , JinHee Jung , JiWon Lee , YuJeong Jang
IPC: H01L23/552 , H01L23/31 , H01L25/065 , H01L21/3213
Abstract: A semiconductor device is formed by providing a semiconductor package including a shielding layer and forming a slot in the shielding layer using a laser. The laser is turned on and exposed to the shielding layer with a center of the laser disposed over a first point of the shielding layer. The laser is moved in a loop while the laser remains on and exposed to the shielding layer. Exposure of the laser to the shielding layer is stopped when the center of the laser is disposed over a second point of the shielding layer. A distance between the first point and the second point is approximately equal to a radius of the laser.
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公开(公告)号：US20200373249A1
公开(公告)日：2020-11-26
申请号：US16991370
申请日：2020-08-12
Applicant: STATS ChipPAC Pte. Ltd.
Inventor： ChangOh Kim , KyoWang Koo , SungWon Cho , BongWoo Choi , JiWon Lee
Abstract: A semiconductor device has a substrate. A first component and second component are disposed over the substrate. The first component includes an antenna. A lid is disposed over the substrate between the first component and second component. An encapsulant is deposited over the substrate and lid. A conductive layer is formed over the encapsulant and in contact with the lid. A first portion of the conductive layer over the first component is removed using laser ablation.
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公开(公告)号：US10784210B2
公开(公告)日：2020-09-22
申请号：US16234156
申请日：2018-12-27
Applicant: STATS ChipPAC Pte. Ltd.
Inventor： ChangOh Kim , KyoWang Koo , SungWon Cho , BongWoo Choi , JiWon Lee
IPC: H01L23/552 , H01L23/66 , H01L23/28 , H01L21/56 , H01L21/78 , H01L25/00 , H01L25/065 , H01L23/00 , H01L21/60
Abstract: A semiconductor device has a substrate. A first component and second component are disposed over the substrate. The first component includes an antenna. A lid is disposed over the substrate between the first component and second component. An encapsulant is deposited over the substrate and lid. A conductive layer is formed over the encapsulant and in contact with the lid. A first portion of the conductive layer over the first component is removed using laser ablation.
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公开(公告)号：US20200211976A1
公开(公告)日：2020-07-02
申请号：US16234156
申请日：2018-12-27
Applicant: STATS ChipPAC Pte. Ltd.
Inventor： ChangOh Kim , KyoWang Koo , SungWon Cho , BongWoo Choi , JiWon Lee
Abstract: A semiconductor device has a substrate. A first component and second component are disposed over the substrate. The first component includes an antenna. A lid is disposed over the substrate between the first component and second component. An encapsulant is deposited over the substrate and lid. A conductive layer is formed over the encapsulant and in contact with the lid. A first portion of the conductive layer over the first component is removed using laser ablation.
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