公开(公告)号：US20200184172A1

公开(公告)日：2020-06-11

申请号：US16412619

申请日：2019-05-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongkyun KIM

IPC: G06K9/00 ,  G06F3/041 ,  G06F3/043

Abstract: A fingerprint sensor of an electronic device includes a plurality of acoustic transducers and a signal processor. The plurality of acoustic transducers are arranged on one surface of the plate-like member to surround at least a portion of an outer perimeter of a measuring area of the plate-like member to transmit and receive ultrasonic guided waves. The signal processor recognizes a target object touching a surface of the measuring area through ultrasonic wave tomography that applies a time-reversal process with respect to a signal transmitted from at least one of the plurality of acoustic transducers and a signal received by at least one of the remaining acoustic transducers.

公开(公告)号：US20200019744A1

公开(公告)日：2020-01-16

申请号：US16291052

申请日：2019-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongkyun KIM

IPC: G06K9/00 ,  G06T7/00

Abstract: A method and an apparatus for converting image data of a super-pixel array into image data a sub-pixel array are provided. A plurality of nodes in a separate activation area on a sensing circuit are activated to obtain a plurality of super-pixels and to generate image data of a super-pixel array including the plurality of super-pixels. Also, one or more nodes in an integrated activation area are separately activated to obtain values of sub-pixels in a first area of a sub-pixel array, and based on the super-pixel array and the values of the sub-pixels in the first area, the image data of the super-pixel array is converted into image data of the sub-pixel array.

公开(公告)号：US20180260071A1

公开(公告)日：2018-09-13

申请号：US15973754

申请日：2018-05-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongkyun KIM

IPC: G06F3/041 ,  G06K9/00 ,  G06F3/044

CPC classification number: G06F3/0416 ,  G06F3/0412 ,  G06F3/044 ,  G06F2203/0338 ,  G06F2203/04106 ,  G06K9/00013 ,  G06K9/0002 ,  G06K9/0008 ,  G06K9/001

Abstract: An electronic device includes a display panel configured to display an image, first electrodes provided on the display panel and arranged in parallel in a direction, second electrodes provided on the display panel and arranged in parallel in a direction crossing the first electrodes, an insulating layer provided between the first electrodes and the second electrodes, a controller configured to transmit driving signals to the first electrodes, and receive electrical signals from the second electrodes, touch detection areas and fingerprint-touch detection areas in which the first electrodes cross the second electrodes, and a protection film provided on the first electrodes and the second electrodes. The touch detection areas are arranged in a matrix of M rows and N columns, the fingerprint-touch detection areas are disposed at positions in the matrix, and each of the fingerprint-touch detection areas includes fingerprint detection pixels.

公开(公告)号：US20170364176A1

公开(公告)日：2017-12-21

申请号：US15375765

申请日：2016-12-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongkyun KIM ,  Seogwoo HONG ,  Byungkyu LEE ,  Seokwhan CHUNG

IPC: G06F3/044 ,  G06F3/041 ,  G06K9/00

Abstract: A touch sensor includes a plurality of first electrodes, a plurality of second electrodes, and a capacitance measurer configured to measure mutual capacitances between the plurality of first electrodes and the plurality of second electrodes. Each of the first electrodes includes a plurality of loop patterns.

公开(公告)号：US20250157883A1

公开(公告)日：2025-05-15

申请号：US18647903

申请日：2024-04-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan KANG ,  Dongkyun KIM ,  Daehyuk SON ,  Hotaik LEE ,  Seogwoo HONG

IPC: H01L23/473 ,  H01L25/065

Abstract: A semiconductor device includes a semiconductor chip having a semiconductor integrated circuit. A cooling channel is formed in the semiconductor chip. At least a portion of the cooling channel is formed in the semiconductor chip. First wick structures may be arranged on a bottom of the cooling channel that is parallel to an upper surface of the semiconductor chip in a transverse direction. The first wick structures may move a liquid coolant by capillary action in the transverse direction along the bottom of the cooling channel. Second wick structures may be arranged along an inner surface of the vapor chamber and may move the liquid coolant by capillary action in the transverse direction along the inner surface of the vapor chamber.

公开(公告)号：US20240322068A1

公开(公告)日：2024-09-26

申请号：US18433068

申请日：2024-02-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngtek OH ,  Dongho KIM ,  Joonyong PARK ,  Junsik HWANG ,  Dongkyun KIM ,  Sanghoon SONG ,  Minchul YU ,  Kyungwook HWANG

IPC: H01L33/00 ,  H01L21/67 ,  H01L21/673

CPC classification number: H01L33/005 ,  H01L21/67132 ,  H01L21/67333

Abstract: A micro semiconductor chip transfer method is provided and includes: preparing a transfer substrate including an upper portion having grooves formed therein; supplying, to the upper portion of the transfer substrate, a suspension including micro semiconductor chips and a liquid; and aligning the micro semiconductor chips in the grooves by sweeping, with an alignment bar that includes a hydrophobic wiper, an upper surface of the transfer substrate while the suspension is on the upper surface of the transfer substrate.

公开(公告)号：US20240162403A1

公开(公告)日：2024-05-16

申请号：US18220974

申请日：2023-07-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonyong PARK ,  Dongkyun KIM ,  Dongho KIM ,  Kyungwook HWANG ,  Junsik HWANG

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/38 ,  H01L33/50

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/382 ,  H01L33/505 ,  H01L2933/0016 ,  H01L2933/0041 ,  H01L2933/0066

Abstract: Provided are a multifold micro emitting device, a display apparatus, a method of manufacturing the multifold micro emitting device, and method of manufacturing the display apparatus. The multifold micro light emitting device includes a plurality of sub light emitting devices, a first electrode configured to apply a voltage to each of the plurality of sub light emitting devices, a second electrode configured to apply a common voltage to the plurality of sub light emitting devices, and a separator configured to separate the plurality of sub light emitting devices from each other, and the plurality of sub light emitting devices are configured as a single chip.

公开(公告)号：US20240079385A1

公开(公告)日：2024-03-07

申请号：US18120166

申请日：2023-03-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonyong PARK ,  Dongkyun KIM ,  Sanghoon SONG ,  Minchul YU ,  Kyungwook HWANG ,  Junsik HWANG

IPC: H01L25/075 ,  H01L33/38

CPC classification number: H01L25/0753 ,  H01L33/38

Abstract: Provided are a micro semiconductor chip transferring structure and a display device employing a display transferring structure. A transferring structure includes a transfer substrate having a plurality of grooves, and a plurality of micro semiconductor chips transferred to the plurality of grooves, respectively, wherein a minimum space between adjacent two of the plurality of micro semiconductor chips transferred to the plurality of grooves is 100% to 200% inclusive of a width of each of the plurality of micro semiconductor chips.

公开(公告)号：US20240006199A1

公开(公告)日：2024-01-04

申请号：US18086992

申请日：2022-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon KIM ,  Kyungwook HWANG ,  Dongkyun KIM ,  Dongho KIM ,  Joonyong PARK ,  Minchul YU ,  Seogwoo HONG ,  Junsik HWANG

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/68

CPC classification number: H01L21/67132 ,  H01L21/68 ,  H01L21/67333

Abstract: A chip wet transfer apparatus includes a first chip supply module configured to supply a large amount of micro-semiconductor chips to a transfer substrate, a first chip alignment module configured to align the large amount of micro-semiconductor chips in a plurality of grooves, a second chip supply module configured to supply a small amount of micro-semiconductor chips, and a second chip alignment module configured to align the small amount of micro-semiconductor chips.

公开(公告)号：US20230154769A1

公开(公告)日：2023-05-18

申请号：US17736352

申请日：2022-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongkyun KIM ,  Hyunjoon KIM ,  Joonyong PARK ,  Seogwoo HONG ,  Kyungwook HWANG

IPC: H01L21/67 ,  H01L21/673 ,  B65G51/02

CPC classification number: H01L21/67121 ,  H01L21/67333 ,  B65G51/02

Abstract: A chip transfer apparatus includes: a chip storage module in which a plurality of micro-semiconductor chips and a suspension including impurities are stored; a chip filtration module separating a first suspension including the plurality of micro-semiconductor chips and a second suspension including the impurities in the suspension; and a chip supply module configured to supply the first suspension onto the transfer substrate such that the first suspension is introduced from the chip filtration module and the plurality of micro-semiconductor chips are flowable on the transfer substrate.