公开(公告)号：US20240079365A1

公开(公告)日：2024-03-07

申请号：US18373048

申请日：2023-09-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungryong HAN ,  Yeonghyeon SEO ,  Sangmoo PARK ,  Jinyoung KIM ,  Byunghoon LEE

IPC: H01L23/00 ,  H01L25/16

CPC classification number: H01L24/29 ,  H01L24/27 ,  H01L24/30 ,  H01L24/32 ,  H01L24/83 ,  H01L25/167 ,  H01L2224/27005 ,  H01L2224/29028 ,  H01L2224/29116 ,  H01L2224/29144 ,  H01L2224/29155 ,  H01L2224/2919 ,  H01L2224/30131 ,  H01L2224/32145 ,  H01L2224/83203

Abstract: A display module is provided. The display module includes: a substrate partitioned into a plurality of pixel regions and including a plurality of electrode pads disposed in the pixel regions; a bonding member including an adhesive layer stacked on one surface of the substrate and a plurality of conductive balls disposed in the adhesive layer; and a plurality of light emitting diodes including electrodes connected to the plurality of electrode pads by the plurality of conductive balls, in which the plurality of conductive balls are patterned as a conductive region corresponding to the plurality of electrode pads.

公开(公告)号：US20230387372A1

公开(公告)日：2023-11-30

申请号：US18205312

申请日：2023-06-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoonsuk LEE ,  Eunhye KIM ,  Sangmoo PARK ,  Jamyeong KOO ,  Sera KWON ,  Byunghoon LEE ,  Changkyu CHUNG

IPC: H01L33/62 ,  H01L25/16 ,  H01L33/58 ,  H01L23/00

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/58 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L2224/30505 ,  H01L2224/30517 ,  H01L2224/3003 ,  H01L2224/3011 ,  H01L2224/32145 ,  H01L2924/12041 ,  H01L2224/2919 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2924/0132

Abstract: Provided is a display assembly including a plurality of light emitting diodes, a plurality of electrodes provided on the plurality of light emitting diodes, a substrate, a plurality of electrode pads provided on the substrate, the plurality of electrode pads being connected to the electrodes provided on the plurality of light emitting diodes, and an adhesive layer fixing the plurality of light emitting diodes to the substrate, wherein the adhesive layer includes a non-conductive polymer resin, a flux agent mixed with the non-conductive polymer resin, and a plurality of conductive particles dispersed in the non-conductive polymer resin and connecting the electrodes of the light emitting diodes and the plurality of electrode pads.

公开(公告)号：US20210288209A1

公开(公告)日：2021-09-16

申请号：US17258061

申请日：2019-07-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung KWAG ,  Byungchul KIM ,  Minsub OH ,  Sangmoo PARK ,  Eunhye KIM ,  Yoonsuk LEE

IPC: H01L33/00 ,  H01L27/15

Abstract: An electronic device is disclosed. The electronic device comprises: a transfer device capable of moving, to a target substrate, a plurality of LEDs arranged in a transfer substrate, and arranging same; a storage unit in which feature information of each of the plurality of LEDs is stored; and a processor for controlling the transfer device such that each of a plurality of LEDs is arranged in an arrangement location on the target substrate of each of a plurality of LEDs on the basis of the stored feature information.

公开(公告)号：US20200312822A1

公开(公告)日：2020-10-01

申请号：US16808558

申请日：2020-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunhye KIM ,  Doyoung KWAG ,  Byungchul KIM ,  Sangmoo PARK ,  Minsub OH ,  Dongyeob LEE ,  Yoonsuk LEE

IPC: H01L25/075 ,  H01L33/62

Abstract: A method of manufacturing a display module is provided. The method may include providing a substrate including a pixel region on which a plurality of electrodes are disposed and a peripheral region that is a region other than the pixel region on the substrate; forming an adhesive layer on the pixel region of the substrate; transferring a plurality of micro light emitting diodes (LEDs) onto the adhesive layer; pre-curing the adhesive layer to shift the adhesive layer on the pixel region to the peripheral region; and bonding the plurality of micro LEDs to the plurality of electrodes.

公开(公告)号：US20200161159A1

公开(公告)日：2020-05-21

申请号：US16682111

申请日：2019-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangmoo PARK ,  Doyoung Kwag ,  Eunhye Kim ,  Minsub Oh ,  Yoonsuk Lee

IPC: H01L21/683 ,  H01L21/67 ,  H01L33/62

Abstract: A micro LED transfer device is provided. The micro LED transfer device includes a transfer part configured to arrange a first substrate wherein a plurality of LEDs are disposed on a lower surface relative to an upper surface of a second substrate; a memory storing characteristic information of each of the plurality of LEDs; a laser light source configured to irradiate laser light; a mask comprising a plurality of shutters configured to selectively open and close a plurality of openings of the mask, the mask being interposed between the first substrate and the laser light source; and a processor configured to identify an LED from among the plurality of LEDs to be arranged on the second substrate based on the stored characteristic information, and control the mask such that a shutter from among the plurality of shutters that corresponds to the LED is opened.