公开(公告)号：US20110217911A1

公开(公告)日：2011-09-08

申请号：US13036496

申请日：2011-02-28

Applicant: One-Moon CHANG ,  Jae-Phil Boo ,  Soo-Young Tak ,  Jong-Sun Ahn ,  Shin Kim ,  Kyoung-Moon Kang

Inventor： One-Moon CHANG ,  Jae-Phil Boo ,  Soo-Young Tak ,  Jong-Sun Ahn ,  Shin Kim ,  Kyoung-Moon Kang

IPC: B24B41/06

CPC classification number: B24B41/06

Abstract: A chemical mechanical polishing apparatus includes a platen configured to support and rotate a wafer, and a polishing pad facing the platen. The polishing pad includes a body having a groove with a rotational symmetric pattern.

Abstract translation: 化学机械抛光装置包括被配置为支撑和旋转晶片的压板和面向压板的抛光垫。 抛光垫包括具有旋转对称图案的凹槽的主体。

公开(公告)号：US20110217910A1

公开(公告)日：2011-09-08

申请号：US13033876

申请日：2011-02-24

Applicant: One-Moon CHANG ,  Jae-Phil Boo ,  Jong-Bok Kim ,  Soo-Young Tak ,  Jong-Sun Ahn ,  Shin Kim

Inventor： One-Moon CHANG ,  Jae-Phil Boo ,  Jong-Bok Kim ,  Soo-Young Tak ,  Jong-Sun Ahn ,  Shin Kim

IPC: B24B41/06

CPC classification number: B24B41/06

Abstract: A chemical mechanical polishing apparatus includes a platen having a first region configured to support a wafer, and a second region disposed outside the first region. The chemical mechanical polishing apparatus further includes a polishing pad disposed on the platen, a pad head to which the polishing pad is attached, a slurry supply configured to supply a slurry onto the wafer, and an injection port disposing on the second region of the platen. The injection port is configured to inject a predetermined gas to an edge of a bottom surface of the wafer and toward the outside of the wafer.

Abstract translation: 化学机械抛光装置包括具有构造成支撑晶片的第一区域的压板和设置在第一区域外的第二区域。 化学机械抛光装置还包括设置在压板上的抛光垫，附接有抛光垫的焊盘头，配置成将浆料供应到晶片上的浆料供应源和设置在压板的第二区域上的注入口 。 注入口被配置为将预定气体注入到晶片的底表面的边缘并朝向晶片的外部。

公开(公告)号：US20100127373A1

公开(公告)日：2010-05-27

申请号：US12591615

申请日：2009-11-25

Applicant: Shin Kim

Inventor： Shin Kim

IPC: H01L23/12

CPC classification number: H01L25/0657 ,  H01L23/3121 ,  H01L23/498 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A package structure includes a first semiconductor package with at least one mount portion recessed from a first surface of the first semiconductor package toward a second surface of the first semiconductor package, the first and second surfaces facing each other. The first semiconductor package at least partially surrounds a second semiconductor package and is spaced apart therefrom via a material layer.

Abstract translation: 封装结构包括：第一半导体封装，其具有从第一半导体封装的第一表面朝向第一半导体封装的第二表面凹陷的至少一个安装部分，第一和第二表面彼此面对。 第一半导体封装至少部分地围绕第二半导体封装并且经由材料层与其间隔开。

公开(公告)号：US07038156B2

公开(公告)日：2006-05-02

申请号：US10926401

申请日：2004-08-26

Applicant: Shin Kim ,  Bong Sang Lee

Inventor： Shin Kim ,  Bong Sang Lee

IPC: H01H15/02

CPC classification number: H01H19/04 ,  H01H19/025

Abstract: Disclosed is a rotary knob assembly for a home appliance. The assembly includes a rotary switch having an encoder and a shaft rotatably installed at the encoder, a knob coupled to the shaft of the rotary switch, and a support member provided around the rotary switch to support the rotary switch.

Abstract translation: 公开了一种用于家用电器的旋钮组件。 组件包括具有编码器和可旋转地安装在编码器上的轴的旋转开关，连接到旋转开关的轴的旋钮和设置在旋转开关周围以支撑旋转开关的支撑构件。

公开(公告)号：US06954635B2

公开(公告)日：2005-10-11

申请号：US09956863

申请日：2001-09-21

Applicant: Jong Hwan Kim ,  Shin Kim ,  Myung Jin Jung ,  Heung Soo Kim ,  Dong Han Kim ,  Kui Hong Park ,  Kang Hee Lee

Inventor： Jong Hwan Kim ,  Shin Kim ,  Myung Jin Jung ,  Heung Soo Kim ,  Dong Han Kim ,  Kui Hong Park ,  Kang Hee Lee

IPC: G06F3/12 ,  H04M3/00

CPC classification number: G06F3/1292 ,  G06F3/1205 ,  G06F3/1255 ,  G06F3/1261

Abstract: The present invention relates to a printing through a plurality of printer robot systems. Specifically, the invention provides a mobile printer system which prints letters or pictures inputted by a user without being constrained by the printing region through a plurality of mobile printer robots. The present invention comprises a plurality of mobile printer robot systems which have in-built printer functions and a main body which controls the printer operations through a wireless communication with the printer robot system.

Abstract translation: 本发明涉及通过多个打印机机器人系统的打印。 具体地，本发明提供一种移动打印机系统，其通过多个移动打印机器人打印由用户输入的字母或图片，而不受打印区域的约束。 本发明包括具有内置打印机功能的多个移动打印机器人系统和通过与打印机机器人系统的无线通信来控制打印机操作的主体。

公开(公告)号：US06768904B2

公开(公告)日：2004-07-27

申请号：US09967989

申请日：2001-10-02

Applicant: Shin Kim

Inventor： Shin Kim

IPC: H04B138

CPC classification number: H04N1/00307 ,  H04N2201/0022 ,  H04W88/02

Abstract: A method for transmitting data in a data communication system having a mobile terminal and a transmitting/receiving terminal is enclosed. The method includes the steps of establishing a voice communication channel between the mobile terminal and a receiving data terminal in the data communication system set to a Voice mode, setting the data communication system to a Data mode without disconnecting the voice communication channel by transmitting a first connection request and a telephone number of the receiving data terminal by the transmitting data terminal to the mobile terminal, establishing a data communication channel between the transmitting and receiving data terminals, and transmitting data to the receiving data terminal through the data communication channel. By sending a receiving side telephone number to the mobile terminal together with a connection request signal (ATD command) as shown in the data communication method according to the present invention, a user can transmit or receive data more conveniently during the wireless conversation. The mode of the communication system can simply be converted from a Voice mode to a Data (Fax) mode by transmitting a ATD command together with a receiving side telephone number so that it can provide a substantial convenience to a user when transmitting or receiving data during the wireless phone conversation.

Abstract translation: 封闭了在具有移动终端和发送/接收终端的数据通信系统中发送数据的方法。 该方法包括以下步骤：在设置为语音模式的数据通信系统中，在移动终端与接收数据终端之间建立语音通信信道，将数据通信系统设置为数据模式，而不断开语音通信信道，通过发送第一 连接请求和发送数据终端的接收数据终端的电话号码发送到移动终端，在发送和接收数据终端之间建立数据通信信道，并通过数据通信信道向接收数据终端发送数据。 通过如本发明的数据通信方法所示的连接请求信号（ATD命令），向移动终端发送接收侧电话号码，用户可以在无线对话期间更方便地发送或接收数据。 通过与接收侧电话号码一起发送ATD命令，可以简单地将通信系统的模式从语音模式转换为数据（传真）模式，使得当在发送或接收数据期间可以为用户提供实质的方便 无线电话对话。

公开(公告)号：US20240410450A1

公开(公告)日：2024-12-12

申请号：US18736886

申请日：2024-06-07

Applicant: Shin Kim

Inventor： Shin Kim

IPC: F16H19/04 ,  F03G7/08 ,  H02K7/06 ,  H02K7/116 ,  H02K7/18

Abstract: The apparatus for capturing energy from a source of linear motion includes a reciprocating gear rail assembly secured to an input shaft that engages an output gear and shaft for driving an electric generator.

公开(公告)号：US08734206B2

公开(公告)日：2014-05-27

申请号：US13036496

申请日：2011-02-28

Applicant: One-Moon Chang ,  Jae-Phil Boo ,  Soo-Young Tak ,  Jong-Sun Ahn ,  Shin Kim ,  Kyoung-Moon Kang

Inventor： One-Moon Chang ,  Jae-Phil Boo ,  Soo-Young Tak ,  Jong-Sun Ahn ,  Shin Kim ,  Kyoung-Moon Kang

IPC: B24B1/00

CPC classification number: B24B41/06

Abstract: A chemical mechanical polishing apparatus includes a platen configured to support and rotate a wafer, and a polishing pad facing the platen. The polishing pad includes a body having a groove with a rotational symmetric pattern.

Abstract translation: 化学机械抛光装置包括被配置为支撑和旋转晶片的压板和面向压板的抛光垫。 抛光垫包括具有旋转对称图案的凹槽的主体。

公开(公告)号：US08662958B2

公开(公告)日：2014-03-04

申请号：US12985048

申请日：2011-01-05

Applicant: Jong-sun Ahn ,  In-seak Hwang ,  Soo-young Tak ,  Shin Kim ,  One-moon Chang

Inventor： Jong-sun Ahn ,  In-seak Hwang ,  Soo-young Tak ,  Shin Kim ,  One-moon Chang

IPC: B24B49/00

CPC classification number: B24B37/10 ,  B24B49/12

Abstract: A chemical-mechanical polishing (CMP) apparatus for manufacturing a semiconductor device. The apparatus includes: a spin chuck for supporting and rotating a semiconductor wafer; a polisher comprising a polishing pad for planarizing a surface of the semiconductor wafer, the polisher moving along the surface of the semiconductor wafer by a polishing arm; and a polisher supporting device for supporting the polisher and maintaining the polisher in a horizontal state, while polishing an edge part of the surface of the semiconductor wafer, in order to improve polishing uniformity of a center part and the edge part of the semiconductor wafer. Accordingly, polishing uniformity of the center part and edge part of the semiconductor wafer may be improved, and a height of the polisher supporting device may be optimized according to a polishing degree. Also, the polisher may be easily supported, wear and tear of the support head may be minimized, and the support head may function as a conditioner.

Abstract translation: 一种用于制造半导体器件的化学机械抛光（CMP）装置。 该装置包括：用于支撑和旋转半导体晶片的旋转卡盘; 抛光机，包括用于平坦化半导体晶片的表面的抛光垫，抛光机通过抛光臂沿着半导体晶片的表面移动; 以及用于在抛光半导体晶片的表面的边缘部分的同时在支撑抛光机并将抛光机保持在水平状态的抛光机支撑装置，以便改善半导体晶片的中心部分和边缘部分的抛光均匀性。 因此，可以提高半导体晶片的中心部分和边缘部分的抛光均匀性，并且可以根据抛光度来优化抛光机支撑装置的高度。 此外，可以容易地支撑抛光机，可以使支撑头的磨损和撕裂最小化，并且支撑头可用作调节器。

公开(公告)号：US08536606B2

公开(公告)日：2013-09-17

申请号：US13361612

申请日：2012-01-30

Applicant: Shin Kim

Inventor： Shin Kim

IPC: H01L33/36

CPC classification number: H01L33/44 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Disclosed is a light emitting device including a light emitting structure comprising a first conductive type semiconductor layer, an active layer and a second conductive type semiconductor layer, a first electrode disposed on the first conductive type semiconductor layer, a second electrode disposed on the second conductivity type semiconductor layer, and a low temperature oxide film disposed on the light emitting structure, with an irregular thickness.

Abstract translation: 公开了一种发光器件，其包括发光结构，包括第一导电类型半导体层，有源层和第二导电类型半导体层，设置在第一导电类型半导体层上的第一电极，设置在第二导电类型半导体层上的第二电极 型半导体层和设置在发光结构上的低温氧化膜，具有不规则的厚度。