公开(公告)号：US07312347B2

公开(公告)日：2007-12-25

申请号：US11526252

申请日：2006-09-22

申请人： Takahiro Fujiwara ,  Tohru Yokozawa

发明人： Takahiro Fujiwara ,  Tohru Yokozawa

IPC分类号： C07F15/00 ,  C07F9/02

CPC分类号： C07F9/65517

摘要： Provided is a method for producing an optically active compound, in more detail, for producing an optically active compound by asymmetric hydrogenation in a high yield and asymmetric yield. The present invention also provides a catalyst for asymmetric synthesis for the above production method, especially a catalyst for asymmetric hydrogenation, containing a transition metal complex. Further, the present invention provides a new diphosphine compound useful as a ligand of the above transition metal complex and a new transition metal complex containing the above diphosphine compound.The present invention relates to a diphosphine compound represented by the following formula (1): a transition metal complex using the compound, a catalyst for asymmetric synthesis comprising the above transition metal complex and a method for producing an optically active compound using the above catalyst for asymmetric synthesis.

公开(公告)号：US20070142472A1

公开(公告)日：2007-06-21

申请号：US10578744

申请日：2004-11-26

申请人： Tohru Yokozawa ,  Hideo Shimizu ,  Takahiro Fujiwara ,  Yasunori Ino

发明人： Tohru Yokozawa ,  Hideo Shimizu ,  Takahiro Fujiwara ,  Yasunori Ino

IPC分类号： A61K31/192 ,  C07C65/03

CPC分类号： C07C51/412 ,  C07C51/09 ,  C07C51/36 ,  C07C51/43 ,  Y02P20/55 ,  C07C59/64

摘要： The present invention relates to a process for producing an optically active 3-(4-hydroxyphenyl)propionic acid useful as intermediates for medicines, through short steps in good yield and with high optical purity. More specifically, the present invention relates to a process for producing an optically active 3-(4-hydroxyphenyl)propionic acid of the formula (6): wherein R2 is an alkyl group; R5 to R8 are each independently a hydrogen atom or a substituent; and the symbol * is an chiral carbon atom, or a salt thereof, which comprises reacting a benzaldehyde of the formula (1): wherein R1 is a protective group; and R5 to R8 are each the same as defined above, with a glycolic acid derivative of the formula (2): wherein R3 is a hydrocarbon group; and R2 is the same as defined above, hydrolyzing the resulting product to give a cinnamic acid of the formula (4): wherein R1, R2 and R5 to R8 are each the same as defined above, or a salt thereof, and subjecting the resulting cinnamic acid (4) or a salt thereof to asymmetric hydrogenation to give an optically active phenylpropionic acid of the formula (5): wherein all the symbols are each the same as defined above, or a salt thereof, followed by deprotection.

摘要翻译： 本发明涉及一种用作药物中间体的光学活性3-（4-羟基苯基）丙酸的方法，通过短的步骤以良好的收率和高的光学纯度。 更具体地说，本发明涉及制备式（6）的光学活性3-（4-羟基苯基）丙酸的方法：其中R 2是烷基; R 5至R 8各自独立地为氢原子或取代基; 符号*是手性碳原子或其盐，其包括使式（1）的苯甲醛：其中R 1为保护基; 和R 5至R 8各自与上述定义相同，与式（2）的乙醇酸衍生物：其中R 3， 是一个烃基; 和R 2与上述定义相同，水解所得产物，得到式（4）的肉桂酸：其中R 1，R 2， R 0和R 5至R 8各自与上述定义相同，或其盐，并将所得肉桂酸（4）或其盐 不对称氢化得到式（5）的光学活性苯基丙酸：其中所有符号各自与上述定义相同，或其盐，然后脱保护。

公开(公告)号：US5601228A

公开(公告)日：1997-02-11

申请号：US501085

申请日：1995-08-02

申请人： Takao Fukunaga ,  Kazuhito Higasa ,  Hirokazu Shiroishi ,  Seishi Kumamoto ,  Takahiro Fujiwara ,  Noriko Katayama

发明人： Takao Fukunaga ,  Kazuhito Higasa ,  Hirokazu Shiroishi ,  Seishi Kumamoto ,  Takahiro Fujiwara ,  Noriko Katayama

IPC分类号： B23K35/02 ,  B23K35/26 ,  B23K35/34 ,  H05K3/34

CPC分类号： B23K35/025 ,  B23K35/262 ,  B23K35/268 ,  B23K35/34 ,  H05K3/3484 ,  H05K2203/125 ,  Y10T29/49144

摘要： The invention provides a solder-precipitating composition containing Sn-Pb alloy powder and an organic acid salt of Pb as essential components, and capable of precipitating solder as a result of substitution between Sn contained in the Sn-Pb alloy powder and Pb contained in the organic acid salt of Pb. Further, the invention provides a mounting method including the steps of supplying a conductor on a board with a solder-precipitating composition which contains Sn-Pb alloy powder and an organic acid salt of Pb as essential components, heating the solder-precipitating composition supplied on the conductor, to precipitate solder on the conductor and pre-coat the conductor with solder, as a result of substitution reaction between Sn in the Sn-Pb alloy powder and Pb ions in the organic acid salt of Pb, mounting a device on the solder pre-coated conductor, and melting the solder layer to securely mount the device on the conductor.

摘要翻译： PCT No.PCT / JP94 / 02047 Sec。 371日期：1995年8月2日 102（e）日期1995年8月2日PCT 1994年12月6日PCT PCT。 出版物WO95 / 15834 日期：1995年6月15日本发明提供了含有Sn-Pb合金粉末和Pb的有机酸盐作为必要成分的焊料沉淀组合物，并且能够通过Sn-Pb合金粉末中包含的Sn的取代而使焊料沉淀 和Pb中有机酸盐中含有的Pb。 此外，本发明提供了一种安装方法，包括以下步骤：在板上提供含有Sn-Pb合金粉末和Pb的有机酸盐作为必需组分的焊料沉淀组合物，加热供给的焊料沉淀组合物 导体，通过Sn-Pb合金粉末中的Sn和Pb的有机酸盐中的Pb离子之间的取代反应，将焊料沉淀在导体上并用焊料预先涂覆导体，将装置安装在焊料上 预涂导体，并熔化焊料层，以将装置牢固地安装在导体上。

公开(公告)号：US5453582A

公开(公告)日：1995-09-26

申请号：US396867

申请日：1995-03-01

申请人： Toshiaki Amano ,  Kazuhito Hikasa ,  Seishi Kumamoto ,  Takahiro Fujiwara

发明人： Toshiaki Amano ,  Kazuhito Hikasa ,  Seishi Kumamoto ,  Takahiro Fujiwara

IPC分类号： B23K35/00 ,  B23K35/34 ,  H05K1/11 ,  H05K3/34 ,  H05K1/18

CPC分类号： H05K3/3421 ,  B23K35/34 ,  H05K1/111 ,  B23K35/007 ,  H05K2201/09381 ,  H05K2201/097 ,  H05K2201/10689 ,  H05K2203/042 ,  H05K2203/1157 ,  H05K2203/125 ,  H05K3/3484 ,  Y02P70/611 ,  Y02P70/613

摘要： A large number of pads, to which component leads are to be soldered, are formed on an insulating substrate so as to constitute a pad array. Colder layers are precoated on the pads. Each of the pads has a component lead mounting portion where a component lead is to be mounted, and a component lead non-mounting portion where no component lead is to be mounted. The component lead non-mounting portion includes a wide part having a width greater than that of the component lead mounting portion.

摘要翻译： 为了构成焊盘阵列，在绝缘基板上形成有要焊接有组分引线的大量焊盘。 更硬的层预涂在垫上。 每个焊盘具有要安装部件引线的部件引线安装部分和不安装部件引线的部件引线非安装部分。 部件引线非安装部分包括具有大于部件引线安装部分的宽度的宽部分。