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公开(公告)号：US20120092657A1
公开(公告)日：2012-04-19
申请号：US13265935
申请日：2010-04-22
IPC分类号： G01N21/88
CPC分类号： G01N21/95623 , G01N21/95607 , G01N2021/8822 , G01N2201/062 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： A method of inspecting defects and a device inspecting defects of detecting defects at high sensitivity and high capture efficiency even on various patterns existing on a wafer. In the device of inspecting defects, an illumination optical system is formed of two systems of a coherent illumination of a laser 5 and an incoherent illumination of LEDs 6a, 6b, 6c and 6d, and light paths are divided in a detecting system corresponding to respective illumination light, spatial modulation elements 55a and 55b are arranged to detecting light paths, respectively, scattered light inhibiting sensitivity is shielded by the spatial modulating elements 55a and 55b, scattered light transmitted through the spatial modulation elements 55a and 55b is detected by image sensors 90a and 90b arranged to respective light paths, and images detected by these two image sensors 90a and 90b are subjected to a comparison processing, thereby determining a defect candidate.
摘要翻译： 一种检测缺陷的方法，以及即使在晶片上存在的各种图案，也可以检测高灵敏度和高捕获效率的缺陷检测缺陷。 在检查缺陷的装置中，照明光学系统由激光器5的相干照明和LED 6a，6b，6c和6d的非相干照明的两个系统形成，并且光路被分成对应于相应的 照明光，空间调制元件55a和55b分别被布置成检测光路，散射光抑制灵敏度被空间调制元件55a和55b屏蔽，传播通过空间调制元件55a和55b的散射光被图像传感器90a检测 和90b，并且由这两个图像传感器90a和90b检测到的图像进行比较处理，从而确定缺陷候选。
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公开(公告)号：US09019492B2
公开(公告)日：2015-04-28
申请号：US13989835
申请日：2011-11-10
IPC分类号： G01N21/956 , G01N21/95 , G01N21/84
CPC分类号： G01N21/95623 , G01N21/9501 , G01N21/956 , G01N2021/8477
摘要： To prevent overlooking of a defect due to reduction in a defect signal, a defect inspection device is configured such that: light is irradiated onto an object to be inspected on which a pattern is formed; reflected, diffracted, and scattered light generated from the object by the irradiation of the light is collected, such that a first optical image resulting from the light passed through a first spatial filter having a first shading pattern is received by a first detector, whereby a first image is obtained; the reflected, diffracted, and scattered light generated from the object is collected, such that a second optical image resulting from the light passed through a second spatial filter having a second shading pattern is received by a second detector, whereby a second image is obtained; and the first and second images thus obtained are processed integrally to detect a defect candidate(s).
摘要翻译： 为了防止由于缺陷信号的减少而忽视缺陷，缺陷检查装置被配置为使得光被照射到形成有图案的待检查对象上; 收集通过照射光从物体产生的反射，衍射和散射光，使得由通过具有第一阴影图案的第一空间滤光器的光产生的第一光学图像由第一检测器接收，由此 获得第一幅图像; 从物体产生的反射，衍射和散射光被收集，使得由通过具有第二阴影图案的第二空间滤光器的光产生的第二光学图像由第二检测器接收，由此获得第二图像; 并且由此获得的第一和第二图像被整体地处理以检测缺陷候选。
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公开(公告)号：US20130242294A1
公开(公告)日：2013-09-19
申请号：US13989835
申请日：2011-11-10
IPC分类号： G01N21/956
CPC分类号： G01N21/95623 , G01N21/9501 , G01N21/956 , G01N2021/8477
摘要： To prevent overlooking of a defect due to reduction in a defect signal, a defect inspection device is configured such that: light is irradiated onto an object to be inspected on which a pattern is formed; reflected, diffracted, and scattered light generated from the object by the irradiation of the light is collected, such that a first optical image resulting from the light passed through a first spatial filter having a first shading pattern is received by a first detector, whereby a first image is obtained; the reflected, diffracted, and scattered light generated from the object is collected, such that a second optical image resulting from the light passed through a second spatial filter having a second shading pattern is received by a second detector, whereby a second image is obtained; and the first and second images thus obtained are processed integrally to detect a defect candidate(s).
摘要翻译： 为了防止由于缺陷信号的减少而忽视缺陷，缺陷检查装置被配置为使得光被照射到形成有图案的待检查对象上; 收集通过照射光从物体产生的反射，衍射和散射光，使得由通过具有第一阴影图案的第一空间滤光器的光产生的第一光学图像由第一检测器接收，由此 获得第一幅图像; 从物体产生的反射，衍射和散射光被收集，使得由通过具有第二阴影图案的第二空间滤光器的光产生的第二光学图像由第二检测器接收，由此获得第二图像; 并且由此获得的第一和第二图像被整体地处理以检测缺陷候选。
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公开(公告)号：US09109194B2
公开(公告)日：2015-08-18
申请号：US13505803
申请日：2010-11-05
申请人： Toshifumi Honda , Hiroko Fujita , Muneo Maeshima , Akira Maekawa , Yoshiko Ishida , Yuta Urano , Shinya Murakami
发明人： Toshifumi Honda , Hiroko Fujita , Muneo Maeshima , Akira Maekawa , Yoshiko Ishida , Yuta Urano , Shinya Murakami
摘要： When multiple kinds of bacterial colonies are present in a petri dish and, for example, a drug tolerance is to be measured, harvesting of mixed colonies of different types of bacteria makes it impossible to accurately determine the drug tolerance. Also, it is required to improve the throughput of a device for harvesting a bacterial colony. From images illuminated from multiple directions, isolating bacterial colonies are automatically extracted. Next, the image feature amounts are calculated from the multiple images that are illuminated from multiple directions and colonies are grouped depending on the feature amounts. Then, bacterial colonies to be harvested are determined based on the results of the grouping.
摘要翻译： 当培养皿中存在多种细菌菌落时，例如测定药物耐受性时，收集不同类型细菌的混合菌落使得不可能准确地确定药物耐受性。 此外，需要提高用于收获细菌菌落的装置的产量。 从多个方向照射的图像，分离细菌菌落被自动提取。 接下来，根据从多个方向照明的多个图像计算图像特征量，并且根据特征量对殖民地进行分组。 然后，基于分组的结果确定要收获的细菌菌落。
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25.发明申请公开(公告)号：US20130321798A1
公开(公告)日：2013-12-05
申请号：US13882542
申请日：2011-10-14
申请人： Yuta Urano , Toshifumi Honda , Takahiro Jingu
发明人： Yuta Urano , Toshifumi Honda , Takahiro Jingu
IPC分类号： G01N21/88
CPC分类号： G01N21/8806 , G01N21/4795 , G01N21/8851 , G01N21/9501 , G01N21/956 , G01N2021/8835
摘要： A defect inspection method includes an illumination light adjustment step of adjusting light emitted from a light source, an illumination intensity distribution control step of forming light flux obtained in the illumination light adjustment step into desired illumination intensity distribution, a sample scanning step of displacing a sample in a direction substantially perpendicular to a longitudinal direction of the illumination intensity distribution, a scattered light detection step of counting the number of photons of scattered light emitted from plural small areas in an area irradiated with illumination light to produce plural scattered light detection signals corresponding to the plural small areas, a defect judgment step of processing the plural scattered light detection signals to judge presence of a defect, a defect dimension judgment step of judging dimensions of the defect in each place in which the defect is judged to be present and a display step of displaying a position on sample surface and the dimensions of the defect in each place in which the defect is judged to be present.
摘要翻译： 缺陷检查方法包括调整从光源发出的光的照明光调节步骤，将在所述照明光调节步骤中获得的光束形成为期望的照度分布的照度分布控制步骤，将样品置换的样本扫描步骤 在与照明强度分布的长度方向大致正交的方向上，对从照明光照射的区域的多个小区域发射的散射光的光数进行计数，生成与多个散射光检测信号对应的散射光检测信号的散射光检测步骤 多个小区域，处理多个散射光检测信号以判断缺陷的存在的缺陷判断步骤，判断存在缺陷的每个位置的缺陷的尺寸的缺陷维度判断步骤和显示 显示位置的步骤o n样品表面和缺陷的每个位置的缺陷的尺寸。
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公开(公告)号：US20100004875A1
公开(公告)日：2010-01-07
申请号：US12488610
申请日：2009-06-22
申请人： Yuta Urano , Toshifumi Honda , Akira Hamamatsu , Shunji Maeda
发明人： Yuta Urano , Toshifumi Honda , Akira Hamamatsu , Shunji Maeda
CPC分类号： G01N21/9501 , G01N21/4738 , G01N2021/4711 , G01N2021/887
摘要： In a detection step, light produced on a sample in plural directions are collectively detected using a plurality of detectors. Multidimensional features containing information about scattered light distributions are extracted based on a plurality of detector outputs obtained. The feature is compared with data in a scattered light distribution library thereby to determine the types and sizes of defects. In a feature extraction step, a feature outputted based on the magnitude of each of scattered light detected signals of scatterers already known in refractive index and shape, which are obtained in the detection step, is corrected, thereby realizing high precision determination.
摘要翻译： 在检测步骤中，使用多个检测器共同检测在多个方向上的样品上产生的光。 基于获得的多个检测器输出提取包含关于散射光分布的信息的多维特征。 将该特征与散射光分布库中的数据进行比较，从而确定缺陷的类型和大小。 在特征提取步骤中，校正基于在检测步骤中获得的折射率和形状已知的散射体的散射光检测信号的大小的输出的特征，从而实现高精度的确定。
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公开(公告)号：US08599369B2
公开(公告)日：2013-12-03
申请号：US13378418
申请日：2010-06-09
CPC分类号： G01N21/9501 , G01N2021/8861 , G01N2021/8874
摘要： A defect inspection method wherein illumination light having a substantially uniform illumination intensity distribution in a certain direction on the surface of a specimen is radiated onto the surface of the specimen; wherein multiple components of those scattered light beams from the surface of the specimen which are emitted mutually different directions are detected, thereby obtaining corresponding multiple scattered light beam detection signals; wherein the multiple scattered light beam detection signals is subjected to processing, thereby determining the presence of defects; wherein the corresponding multiple scattered light detecting signals is processed with respect to all of the spots determined to be defective by the processing, thereby determining the sizes of defects; and wherein the defect locations on the specimen and the defect sizes are displayed with respect to all of the spots determined to be defective by the processing.
摘要翻译： 一种缺陷检查方法，其中将在试样表面上沿某一方向具有基本均匀的照明强度分布的照明光辐射到样品的表面上; 其中检测出来自样本表面的这些散射光束相互不同方向发射的多个分量，从而获得相应的多个散射光束检测信号; 其中对所述多个散射光束检测信号进行处理，由此确定缺陷的存在; 其中相应的多个散射光检测信号相对于通过处理确定为有缺陷的所有点进行处理，从而确定缺陷的尺寸; 并且其中相对于通过处理确定为有缺陷的所有点显示样本上的缺陷位置和缺陷尺寸。
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公开(公告)号：US20120133928A1
公开(公告)日：2012-05-31
申请号：US13378418
申请日：2010-06-09
CPC分类号： G01N21/9501 , G01N2021/8861 , G01N2021/8874
摘要： A defect inspection method wherein illumination light having a substantially uniform illumination intensity distribution in a certain direction on the surface of a specimen is radiated onto the surface of the specimen; wherein multiple components of those scattered light beams from the surface of the specimen which are emitted mutually different directions are detected, thereby obtaining corresponding multiple scattered light beam detection signals; wherein the multiple scattered light beam detection signals is subjected to processing, thereby determining the presence of defects; wherein the corresponding multiple scattered light detecting signals is processed with respect to all of the spots determined to be defective by the processing, thereby determining the sizes of defects; and wherein the defect locations on the specimen and the defect sizes are displayed with respect to all of the spots determined to be defective by the processing.
摘要翻译： 一种缺陷检查方法，其中将在试样表面上沿某一方向具有基本均匀的照明强度分布的照明光辐射到样品的表面上; 其中检测出来自样本表面的这些散射光束相互不同方向发射的多个分量，从而获得相应的多个散射光束检测信号; 其中对所述多个散射光束检测信号进行处理，由此确定缺陷的存在; 其中相应的多个散射光检测信号相对于通过处理确定为有缺陷的所有点进行处理，从而确定缺陷的尺寸; 并且其中相对于通过处理确定为有缺陷的所有点显示样本上的缺陷位置和缺陷尺寸。
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公开(公告)号：US09773641B2
公开(公告)日：2017-09-26
申请号：US13993838
申请日：2011-11-10
申请人： Yuko Otani , Yuta Urano , Toshifumi Honda
发明人： Yuko Otani , Yuta Urano , Toshifumi Honda
CPC分类号： H01J37/261 , G01N21/8806 , G01N21/9501
摘要： Disclosed are a method and an apparatus for observing defects by using an SEM, wherein, in order to observe defects on a wafer at high speed and high sensitivity, positional information of defects on a sample, which has been optically inspected and detected by other inspecting apparatus, and information of the conditions of the optical inspection having been performed by other inspecting apparatus are obtained, and optically detecting the defects on the sample placed on a table, on the basis of the thus obtained information, and on the basis of the detected positional information of the defect on the sample placed on the table, the positional information of the defect having been inspected and detected by other inspecting apparatus is corrected, then, the defects on the sample placed on the table are observed by the SEM using the thus corrected positional information of the defects.
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公开(公告)号：US20140204194A1
公开(公告)日：2014-07-24
申请号：US14116132
申请日：2012-04-27
申请人： Yuko Otani , Toshifumi Honda , Yuta Urano
发明人： Yuko Otani , Toshifumi Honda , Yuta Urano
CPC分类号： G01N21/9505 , G01B11/00 , G01B11/02 , G01B15/00 , G01N21/47 , G01N21/9501 , G01N2021/4711 , G01N2021/8822 , G01N2021/8867 , G02B26/008 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： This invention relates to a method for performing an analysis of defective material and the refractive index, and a three-dimensional analysis of very small pattern shapes including the steps of imaging by a scanning electron microscope to acquire an image of the position of a defect under observation using information of inspection results obtained by an optical inspection device, creating a model of the defect by using the acquired image of the defect under observation, calculating the values detected by the detector when reflected and scattered light emitted from a defect model is received by the detector when light is irradiated onto the defect model thus created, comparing the detection values thus calculated and the values detected by the detector, which has received light actually reflected and scattered from the sample, to obtain information relating to the height of the defect under observation, the material, or the refractive index.
摘要翻译： 本发明涉及一种用于对缺陷物质进行分析的方法和折射率，以及非常小的图案形状的三维分析，包括以下步骤：通过扫描电子显微镜成像以获得缺陷位置的图像 观察使用由光学检查装置获得的检查结果的信息，通过使用获取的观察缺陷图像来产生缺陷的模型，计算当从缺陷模型发射的反射和散射光被反射和检测到的值时检测到的值被接收到 当将光照射到如此产生的缺陷模型上时，将检测器与这样计算的检测值进行比较，并将接收到从样品实际反射和散射的光的检测器检测到的值进行比较，以获得与缺陷的高度有关的信息 观察，材料或折射率。
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